BGA Other Function Interface ICs 56

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX13055EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

X-XBGA-B24

1

Not Qualified

e2

30

260

MAX13056EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

BOTTOM

X-XBGA-B24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MAX13057EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

BOTTOM

X-XBGA-B24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4RCD0124KC0ATG

Renesas Electronics

INTERFACE CIRCUIT

BALL

253

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

TIN SILVER COPPER

BOTTOM

R-PBGA-B253

3

e1

260

LSI53C140IJ

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

BALL

192

BGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

GRID ARRAY

3.13 V

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B192

2.32 mm

23 mm

Not Qualified

e0

30

225

23 mm

LSI53C180

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

BALL

192

BGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

GRID ARRAY

3.13 V

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B192

2.32 mm

23 mm

Not Qualified

e0

30

225

23 mm

LSI53C140I2

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

BALL

192

BGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

GRID ARRAY

3.13 V

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B192

2.32 mm

23 mm

Not Qualified

e0

30

225

23 mm

BCM5387

Broadcom

INTERFACE CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B256

Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.