Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
General Semiconductor |
OTHER |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP40,.6 |
32 |
1-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
9.375 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e3 |
30 |
260 |
9.375 mm |
|||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T16 |
1 |
4.45 mm |
7.62 mm |
Not Qualified |
e3 |
260 |
26.162 mm |
||||||||||||||||||||||||||||
|
Nve |
DIGITAL ISOLATOR |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
3.3 V |
IN-LINE |
DIP8,.3 |
2.7 V |
2.55 mm |
100 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
4.32 mm |
7.62 mm |
9.48 mm |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
100 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
1 |
4.318 mm |
7.62 mm |
Not Qualified |
e3 |
260 |
25.908 mm |
||||||||||||||||||||||||||||
Holtek Semiconductor |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
NO |
CMOS |
.6 mA |
3/5 |
IN-LINE |
DIP28(UNSPEC) |
32 |
4-BP |
Other Interface ICs |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDIP-T20 |
4.19 mm |
7.62 mm |
Not Qualified |
e0 |
25.91 mm |
|||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
1 |
4.45 mm |
7.62 mm |
Not Qualified |
e3 |
260 |
26.162 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
9.375 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e3 |
30 |
260 |
9.375 mm |
|||||||||||||||||||||||||||
Sgs-ates Componenti Electronici S P A |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
NO |
CMOS |
2/6 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
DIGITAL ISOLATOR |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
3.3 V |
IN-LINE |
DIP8,.3 |
3 V |
2.54 mm |
100 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
4.699 mm |
7.62 mm |
9.58 mm |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T16 |
1 |
4.45 mm |
7.62 mm |
Not Qualified |
e3 |
26.162 mm |
|||||||||||||||||||||||||||||
Renesas Electronics |
INTERFACE CIRCUIT |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5.25 V |
1 |
CMOS |
MIL-PRF-38535 Class Q |
5 V |
IN-LINE |
DIP40,.6 |
4.75 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.72 mm |
15.24 mm |
Qualified |
LG-MAX |
e0 |
53.24 mm |
||||||||||||||||||||||||||||||||
Motorola |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
1 |
BIPOLAR |
5 V |
-6 V |
IN-LINE |
4.75 V |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T18 |
4.57 mm |
7.62 mm |
Not Qualified |
e0 |
22.73 mm |
|||||||||||||||||||||||||||||||||
|
Broadcom |
DIGITAL ISOLATOR |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
3.3 V |
IN-LINE |
DIP8,.3 |
3 V |
2.54 mm |
100 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
4.699 mm |
7.62 mm |
9.58 mm |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP32,.6 |
Other Interface ICs |
4.5 V |
2.54 mm |
100 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
15.24 mm |
Not Qualified |
e3 |
260 |
41.91 mm |
||||||||||||||||||||||||||||||
Renesas Electronics |
INTERFACE CIRCUIT |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5.25 V |
1 |
CMOS |
5 V |
IN-LINE |
DIP40,.6 |
4.75 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.72 mm |
15.24 mm |
LG-MAX |
e0 |
53.24 mm |
||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
ECL |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
3.3 V |
IN-LINE |
3 V |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
4.19 mm |
7.62 mm |
Not Qualified |
9.525 mm |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
ECL |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
BICMOS |
IN-LINE |
.9 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
5.08 mm |
7.62 mm |
ALSO OPERATES WITH 2.7 V TO 5.5 V |
9.59 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
2 |
BICMOS |
3 V |
2.5/3.3 |
IN-LINE |
TSSOP8,.19 |
Line Driver or Receivers |
2.3 V |
2.54 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
5.08 mm |
7.62 mm |
Not Qualified |
e4 |
9.81 mm |
||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
15 V |
+-15 |
-15 V |
IN-LINE |
DIP18,.3 |
Other Interface ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
1 |
CMOS |
MIL-STD-883 |
5 V |
IN-LINE |
4.5 V |
2.54 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-GDIP-T8 |
5.08 mm |
7.62 mm |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
1 |
CMOS |
MIL-STD-883 |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T8 |
1 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||
Onsemi |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
12 V |
1 |
12 V |
-8 V |
IN-LINE |
-4 V |
10 V |
2.54 mm |
70 Cel |
-8 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
5.1 mm |
7.62 mm |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
15 V |
4 |
CMOS |
5 V |
IN-LINE |
3 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
5.1 mm |
7.62 mm |
LG-MAX |
20 mm |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
3 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
.6 mA |
5/15 |
IN-LINE |
DIP16,.3 |
4 |
0-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
18 V |
4 |
CMOS |
5 V |
IN-LINE |
3 V |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDIP-T16 |
3.83 mm |
7.62 mm |
LG-MAX |
19.2 mm |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
20 V |
1 |
CMOS |
5 V |
3/15 |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
3 V |
2.54 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.1 mm |
7.62 mm |
Not Qualified |
e4 |
245 |
||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
.6 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
15 V |
4 |
CMOS |
5 V |
IN-LINE |
3 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
LG-MAX |
e0 |
20 mm |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
18 V |
4 |
CMOS |
3/18 |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
3 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
3 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
12 V |
1 |
12 V |
IN-LINE |
10 V |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
5.1 mm |
7.62 mm |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
.6 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
3 mA |
5/15 |
IN-LINE |
DIP16,.3 |
4 |
0-BP |
Other Interface ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
5 V |
IN-LINE |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
5 V |
IN-LINE |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
12.6 V |
1 |
IN-LINE |
4.75 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
36.51 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
12.6 V |
1 |
IN-LINE |
4.75 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
36.51 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
12.6 V |
1 |
IN-LINE |
4.75 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
12.6 V |
1 |
IN-LINE |
4.75 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
IN-LINE |
2.5 V |
2.54 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
245 |
34.795 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.