TSSOP Other Function Interface ICs 687

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	No. of Segments	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX1741EUB+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1			3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					2.25 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
MAX3377EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS		3.3 V	1.8/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25			Other Interface ICs	1.65 V	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
TC7WPN3125FK(TE85L)	Toshiba		INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES			CMOS			1.2/2.5,1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20			Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8				Not Qualified
TC7LX1102FK(TE85L,F)	Toshiba	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC		YES			CMOS			1.5/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20			Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8				Not Qualified
TC7WPN3125FK(TE85L,F)	Toshiba		INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES			CMOS			1.2/2.5,1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20			Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8				Not Qualified
TC7LX1102FK(TE85L)	Toshiba	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC		YES			CMOS			1.5/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20			Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8				Not Qualified
ISL24010IVZ-T	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES		1	BIPOLAR	4 mA	22 V		-5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	0	0-BP	Other Interface ICs		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
ISL24010IVZ	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES		1	BIPOLAR	4 mA	22 V		-5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	0	0-BP	Other Interface ICs		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
ISL24011IVZ-T	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		1			22 V		-5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
ISL24011IVZ	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		1			22 V		-5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
UPD168830MA-6A5-E1-A	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	1	MOS		5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					4.5 V	.5 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G24		1.2 mm	4.4 mm			e6			6.65 mm
ISL33002IUZ-T	Renesas Electronics	BUS BUFFERS		GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS		2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				2.3 V	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
ISL33001IUZ-T13	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS		2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				2.3 V	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm				30	260	3 mm
ISL33001IUZ-T7	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS		2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				2.3 V	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm				30	260	3 mm
ISL33001IUZ-T	Renesas Electronics	BUS BUFFERS		GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS		2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				2.3 V	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.