COMMERCIAL Other Function Interface ICs 381

Reset All

Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX253CSA-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE	SOP8,.25		Other Interface ICs	4.5 V	1.27 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
MAX253CSA+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE	SOP8,.25		Other Interface ICs	4.5 V	1.27 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX253CSA	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE	SOP8,.25		Other Interface ICs	4.5 V	1.27 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e0	20	240	4.9 mm
MAX253CSA+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE	SOP8,.25		Other Interface ICs	4.5 V	1.27 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX253CPA	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	1	CMOS			5 V		5		IN-LINE	DIP8,.3		Other Interface ICs	4.5 V	2.54 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDIP-T8	1	4.572 mm	7.62 mm	Not Qualified		e0			9.375 mm
MAX253CPA+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	1	CMOS			5 V		5		IN-LINE	DIP8,.3		Other Interface ICs	4.5 V	2.54 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDIP-T8	1	4.572 mm	7.62 mm	Not Qualified		e3	30	260	9.375 mm
TUSB321RWBR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				5 V				CHIP CARRIER, VERY THIN PROFILE				4.5 V	.4 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
PCA9559PW,118	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			3 V	.65 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm			e4	30	260	6.5 mm
LTC4331CUFD#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC	YES	5.5 V	1	CMOS	EIA-485		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.17X.21,20			3 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm			e3		260	5 mm
TUSB320RWBR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5 V	1				3.5 V				CHIP CARRIER, VERY THIN PROFILE				2.7 V	.4 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
MAX253CUA	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX253CUA+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3996CTP	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.5 V	1	BIPOLAR			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-CQCC-N20	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3996CTP+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		Display Drivers	3 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-CQCC-N20	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
LTC4301LCMS8#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX253CUA-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX253CUA+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MCDP6000C1	Kinetic Technologies	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	46	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1.26 V	1				1.2 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC46,.18X.25,16			1.14 V	.4 mm	70 Cel		0 Cel		QUAD	R-XQCC-N46		.9 mm	6.5 mm		IT LASO HAS 1.65 TO 1.95V SUPPLY				4.5 mm
PCA9559PW,112	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			3 V	.65 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm				30	260	6.5 mm
HSDL-3003-021	Broadcom	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	8		RECTANGULAR	UNSPECIFIED	NO	3.6 V	1	BICMOS			3 V				MICROELECTRONIC ASSEMBLY				2.4 V		70 Cel		-20 Cel		SINGLE	R-XSMA-N8	4			Not Qualified				255
LTC4316CMS#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			3.3 V				SMALL OUTLINE				2.25 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10		1.1 mm	3 mm			e3			3 mm
104PW161	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	FLAT	11		RECTANGULAR	UNSPECIFIED	YES	13.2 V	1				12 V				FLANGE MOUNT				10.8 V		70 Cel		-10 Cel		DUAL	R-XDFM-F11
LTC4303CMS8#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4332CUFD#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS	SPI		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16X.2,20			3 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm		SEATED HT-CALCULATED	e3		260	5 mm
LTM2892CY-S#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	6		SPI		5 V				GRID ARRAY	BGA24,6X9,40			3 V	1 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B24		3.11 mm	6.25 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
AD9985AKSTZ-110	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1				3.3 V				FLATPACK, LOW PROFILE				3.15 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
HD3SS2522RHUR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N56	3	.8 mm	5 mm			e4	30	260	11 mm
AD9985AKSTZ-140	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1				3.3 V				FLATPACK, LOW PROFILE				3.15 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
EL6204CWZ-T7A	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				5 V		5		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP6,.11,37		Display Drivers	4.5 V	.95 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G6	2	1.45 mm	1.6 mm	Not Qualified		e3	30	260	2.9 mm
LTC4304CMS#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304CMS#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4332CUFD#TRPBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS	SPI		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16X.2,20			3 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm		SEATED HT-CALCULATED	e3		260	5 mm
MAX3297CUE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3297CUE+	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MC3467P	Motorola	INTERFACE CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	1	BIPOLAR			5 V			-6 V	IN-LINE				4.75 V	2.54 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDIP-T18		4.57 mm	7.62 mm	Not Qualified		e0			22.73 mm
T0816M-TCQG	Atmel	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR			5 V		5		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25		Display Drivers	4.5 V	.635 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.7 mm		Not Qualified		e3		260	4.9 mm
PI2EQX5864DZFE	Pericom Semiconductor	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1.25 V	1			800 mA	1.2 V		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20		Other Interface ICs	1.15 V	.5 mm	70 Cel		0 Cel		QUAD	R-XQCC-N56		.8 mm	5 mm	Not Qualified					11 mm
T0816-TCQ	Atmel	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR			5 V		5		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25		Display Drivers	4.5 V	.635 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.7 mm		Not Qualified		e0			4.9 mm
AD9984AKCPZ-170	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.9 V	1	CMOS			1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
AD9984AKSTZ-170	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1	CMOS			1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
LTC4302CMS-1#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MD2134K7-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	1				5 V	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.20SQ,16	4.75 V		4.75 V	.4 mm	70 Cel	5 V	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40		.8 mm	5 mm	Not Qualified		e4			5 mm
AD9984AKSTZ-140	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1	CMOS			1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
LTC4316CDD#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			3.3 V	16.5 V			SMALL OUTLINE, VERY THIN PROFILE		12 V		2.25 V	.5 mm	70 Cel	15 V	0 Cel	MATTE TIN	DUAL	S-PDSO-N10		.8 mm	3 mm			e3			3 mm
MD1712FG-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5 V	1				3.3 V	12.6 V		-10 V	FLATPACK, LOW PROFILE, FINE PITCH	SPQFP48,.28SQ,20	8 V		1.8 V	.5 mm	70 Cel	10 V	0 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
MD2131K7-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	2.7 V	1				2.5 V	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.75 V		2.3 V	.4 mm	70 Cel	5 V	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40		.8 mm	5 mm			e4			5 mm
UC563DP	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1				5 V				SMALL OUTLINE				4.75 V	1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	CURRENT LIMIT AND THERMAL SHUTDOWN PROTECTION		NOT SPECIFIED	NOT SPECIFIED	4.9 mm
ECL2537N	Texas Instruments		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			ECL							IN-LINE	DIP16,.3		Other Interface ICs		2.54 mm	70 Cel		0 Cel		DUAL	R-PDIP-T16				Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.