BUTT Other Function Interface ICs 24

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LT8500ITJ#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BIPOLAR		3.3 V			GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel		-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
PCA9509AGM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	2 V	1			1.1 V			CHIP CARRIER, VERY THIN PROFILE					.8 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm			e4			1.6 mm
PCA9509AGM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	2 V	1			1.1 V			CHIP CARRIER, VERY THIN PROFILE					.8 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm				30	260	1.6 mm
PCA9509PGM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	1.5 V	1	CMOS		1.1 V	5.5 V		CHIP CARRIER, VERY THIN PROFILE			2.3 V		.8 V	.55 mm	85 Cel	3.3 V	-40 Cel		BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm				30	260	1.6 mm
LT8500ETJ#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BIPOLAR		3.3 V			GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel		-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
FXL2T245L10X	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	10	VBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V	1			1.4 V		1.5/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20			Other Interface ICs	1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-XBCC-B10	1	.55 mm	1.6 mm	Not Qualified		e4	30	260	2.1 mm
LT8500ITJ#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BIPOLAR		3.3 V			GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel		-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
LT8500ETJ#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BIPOLAR		3.3 V			GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel		-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
MAX3378EEBC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm
MAX3391EEBC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm
NLSX5011AMX1TCG	Onsemi	INTERFACE CIRCUIT	MILITARY	BUTT	6	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	4.5 V	1			2.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SOLCC6,.04,20				.9 V	.4 mm	125 Cel	1.8 V	-55 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	.4 mm	1 mm	Not Qualified	CONFIGURABLE INTERFACE STANDARDS	e4			1.2 mm
LC79451KB-X2T	Onsemi	INTERFACE CIRCUIT	COMMERCIAL EXTENDED	BUTT	168	BCC	RECTANGULAR	UNSPECIFIED	SEGMENT	YES	3.6 V	1	CMOS	.48 mA	2.5 V		2.5,2.7	CHIP CARRIER	DIE OR CHIP	128			1.6 V		80 Cel		-30 Cel		BOTTOM	R-XBCC-B168			1.43 mm	Not Qualified					6.55 mm
NCN6001MUTWG	Onsemi	INTERFACE CIRCUIT	OTHER	BUTT	20	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1			3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					2.7 V	.8 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B20		.6 mm	5 mm			e4			6 mm
NLSX5011BMX1TCG	Onsemi	INTERFACE CIRCUIT	MILITARY	BUTT	6	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	4.5 V	1			2.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SOLCC6,.04,16				.9 V	.5 mm	125 Cel	1.8 V	-55 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	.4 mm	1 mm	Not Qualified	CONFIGURABLE INTERFACE STANDARDS	e4			1.45 mm
NCN6001MUR2G	Onsemi	INTERFACE CIRCUIT	OTHER	BUTT	20	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1			3 V			CHIP CARRIER					2.7 V	.8 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B20		.6 mm	5 mm	Not Qualified		e4			6 mm
ST2378EBJR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	20	VBCC	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1			1.8 V		2/5	CHIP CARRIER, VERY THIN PROFILE	BGA20,4X5,20			Other Interface ICs	1.71 V	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBCC-B20		1 mm	2 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2.46 mm
TZA3050VH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	VBCC	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	BICMOS		3.3 V		3.3	CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
TZA3010BVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	BICMOS		3.3 V	3.47 V	3.3,3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		3.14 V	Display Drivers	3.14 V	.5 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
TZA3047BVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HBCC	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	BICMOS		3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
TZA3047AVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HBCC	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	BICMOS		3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
TZA3011AVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	BICMOS		3.3 V	3.47 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		3.14 V	Display Drivers	3.14 V	.5 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
TZA3011BVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	BICMOS		3.3 V	3.47 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		3.14 V	Display Drivers	3.14 V	.5 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
MAX3378EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm
MAX3391EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.