Infineon Technologies Other Function Interface ICs 265

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

CY8CMBR3002-SX1I

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

1.8 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

3

1.727 mm

3.8985 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e3

30

260

4.889 mm

TLE9201SGAUMA1

Infineon Technologies

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

12

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

8 V

1 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G12

3

2.6 mm

6.4 mm

e3

7.5 mm

CY8CMBR3108-LQXIT

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-XQCC-N16

3

.6 mm

3 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

30

260

3 mm

CY8CMBR3002-SX1IT

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

1.8 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

3

1.727 mm

3.8985 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

4.889 mm

ISO1I811TXUMA1

Infineon Technologies

Digital I/P Module

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

35 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

9.6 V

2.85 V

.5 mm

85 Cel

24 V

-40 Cel

TIN

DUAL

R-PDSO-G48

3

1.1 mm

6.1 mm

e3

12.5 mm

CY8CMBR3110-SX2IT

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

1.8 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G16

3

1.727 mm

3.8985 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

9.893 mm

CY8CMBR3116-LQXI

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N24

3

.6 mm

4 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

30

260

4 mm

CY8CMBR3110-SX2I

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

1.8 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

1.727 mm

3.8985 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e3

30

260

9.893 mm

CY8CMBR2044-24LKXIT

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3 V

CHIP CARRIER, VERY THIN PROFILE

1.71 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.6 mm

3 mm

e4

20

260

3 mm

CDM10V4XTSA1

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

25 V

1

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

11 V

.95 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

e3

2.9 mm

CY8CMBR3102-SX1IT

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

1.8 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

3

1.727 mm

3.8985 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

4.889 mm

CY8CMBR3108-LQXI

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-XQCC-N16

3

.6 mm

3 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

30

260

3 mm

CY8CMBR2044-24LKXI

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3 V

CHIP CARRIER, VERY THIN PROFILE

1.71 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.6 mm

3 mm

e4

20

260

3 mm

TLE6368G2AUMA1

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

60 V

1

AEC-Q100

13.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

5.5 V

.65 mm

TIN

DUAL

R-PDSO-G36

3

3.5 mm

11 mm

e3

15.9 mm

TLE9263BQXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9263BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

CY8CMBR3102-SX1I

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

1.8 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

3

1.727 mm

3.8985 mm

ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V

e4

30

260

4.889 mm

TLE92623BQXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9263QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-PQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9263QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9263QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

3

.9 mm

7 mm

7 mm

TLE9262QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-PQCC-N48

3

.9 mm

7 mm

e3

7 mm

CDM10VD3XTSA1

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

25 V

1

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

11 V

.95 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

e3

2.9 mm

TLE9274QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

4.5 V

.5 mm

150 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9274QX

Infineon Technologies

INTERFACE CIRCUIT

TIN

3

e3

TLE9274QXV33

Infineon Technologies

INTERFACE CIRCUIT

TIN

3

e3

CDM10VD4XTSA1

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

25 V

1

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

11 V

.95 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

2.9 mm

TLE92633BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

CDM10VD2XTSA1

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

25 V

1

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

11 V

.95 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

e3

2.9 mm

CDM10VXTSA1

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

25 V

1

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

11 V

.95 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

2.9 mm

TLE9262BQXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE9262BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE92633BQXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

BTS56033LBBXUMA1

Infineon Technologies

INTERFACE CIRCUIT

CDM10V2XTSA1

Infineon Technologies

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

25 V

1

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

11 V

.95 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G6

1

1.45 mm

1.6 mm

2.9 mm

EVALISO1I813TTOBO1

Infineon Technologies

Digital I/P Module

TLE9221SXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

AEC-Q100

5 V

SMALL OUTLINE, SHRINK PITCH

4.75 V

.65 mm

Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)

DUAL

R-PDSO-G16

2A

1.99 mm

5.3 mm

OTHER SUPPLY VOLTAGE ARE MIN:5.5, NOM:13.5, MAX:18

NOT SPECIFIED

NOT SPECIFIED

6.2 mm

TLE9260QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

3

.9 mm

7 mm

7 mm

TLE9221SXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

BTS5482SFXUMA2

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

17 V

SMALL OUTLINE, SHRINK PITCH

8 V

3 V

.65 mm

13.5 V

TIN

DUAL

R-PDSO-G36

3

2.65 mm

7.6 mm

e3

12.8 mm

TLE9262QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE9262QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE92623BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

ISO1I813TXUMA1

Infineon Technologies

Digital I/P Module

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

35 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

9.6 V

2.85 V

.5 mm

85 Cel

24 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3

1.1 mm

6.1 mm

e3

12.5 mm

BTS56033LBAAUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

24

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

28 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

3.8 V

.65 mm

13.5 V

DUAL

R-PDSO-N24

3

1 mm

6 mm

SEATED HGT-NOM

9.5 mm

CY8CMBR2016-24LQXI

Infineon Technologies

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

BTS54220LBEAUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

24

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

28 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

3.8 V

.65 mm

13.5 V

MATTE TIN

DUAL

R-PDSO-N24

3

1 mm

6 mm

SEATED HGT-NOM

e3

9.5 mm

BTS5482SF

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

4.3 V

17 V

SMALL OUTLINE, SHRINK PITCH

8 V

3 V

.65 mm

13.5 V

DUAL

R-PDSO-G36

3

2.65 mm

7.6 mm

12.8 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.