Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.8 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3 |
1.727 mm |
3.8985 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e3 |
30 |
260 |
4.889 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
12 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
8 V |
1 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G12 |
3 |
2.6 mm |
6.4 mm |
e3 |
7.5 mm |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-XQCC-N16 |
3 |
.6 mm |
3 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.8 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.727 mm |
3.8985 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
4.889 mm |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
Digital I/P Module |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
35 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
9.6 V |
2.85 V |
.5 mm |
85 Cel |
24 V |
-40 Cel |
TIN |
DUAL |
R-PDSO-G48 |
3 |
1.1 mm |
6.1 mm |
e3 |
12.5 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.8 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G16 |
3 |
1.727 mm |
3.8985 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
9.893 mm |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N24 |
3 |
.6 mm |
4 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.8 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
1.727 mm |
3.8985 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e3 |
30 |
260 |
9.893 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
1.71 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
3 |
.6 mm |
3 mm |
e4 |
20 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
e3 |
2.9 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.8 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.727 mm |
3.8985 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
4.889 mm |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-XQCC-N16 |
3 |
.6 mm |
3 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
1.71 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
3 |
.6 mm |
3 mm |
e4 |
20 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
36 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
60 V |
1 |
AEC-Q100 |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
5.5 V |
.65 mm |
TIN |
DUAL |
R-PDSO-G36 |
3 |
3.5 mm |
11 mm |
e3 |
15.9 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.8 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.727 mm |
3.8985 mm |
ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V |
e4 |
30 |
260 |
4.889 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
e3 |
2.9 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
4.5 V |
.5 mm |
150 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
TIN |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
TIN |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
e3 |
2.9 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
Digital I/P Module |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
4.75 V |
.65 mm |
Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag) |
DUAL |
R-PDSO-G16 |
2A |
1.99 mm |
5.3 mm |
OTHER SUPPLY VOLTAGE ARE MIN:5.5, NOM:13.5, MAX:18 |
NOT SPECIFIED |
NOT SPECIFIED |
6.2 mm |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
36 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
4.3 V |
17 V |
SMALL OUTLINE, SHRINK PITCH |
8 V |
3 V |
.65 mm |
13.5 V |
TIN |
DUAL |
R-PDSO-G36 |
3 |
2.65 mm |
7.6 mm |
e3 |
12.8 mm |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
.9 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
Digital I/P Module |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
35 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.3,20 |
9.6 V |
2.85 V |
.5 mm |
85 Cel |
24 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
1.1 mm |
6.1 mm |
e3 |
12.5 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
4.3 V |
28 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
3.8 V |
.65 mm |
13.5 V |
DUAL |
R-PDSO-N24 |
3 |
1 mm |
6 mm |
SEATED HGT-NOM |
9.5 mm |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NICKEL PALLADIUM GOLD |
3 |
e4 |
30 |
260 |
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|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
4.3 V |
28 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
3.8 V |
.65 mm |
13.5 V |
MATTE TIN |
DUAL |
R-PDSO-N24 |
3 |
1 mm |
6 mm |
SEATED HGT-NOM |
e3 |
9.5 mm |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
36 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
4.3 V |
17 V |
SMALL OUTLINE, SHRINK PITCH |
8 V |
3 V |
.65 mm |
13.5 V |
DUAL |
R-PDSO-G36 |
3 |
2.65 mm |
7.6 mm |
12.8 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.