Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Onsemi |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3 V |
SMALL OUTLINE |
2.7 V |
.65 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
1 |
3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G48 |
3 |
1.1 mm |
7 mm |
Not Qualified |
e3 |
260 |
7 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
57 V |
1 |
SMALL OUTLINE |
0 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
4.4 mm |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
36 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
AEC-Q100 |
OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
8.4 mA |
5 V |
28 V |
5,8/18 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP36,.4,20 |
5.5 V |
Peripheral Drivers |
4.5 V |
.5 mm |
150 Cel |
13.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G36 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
1.2 mm |
4.4 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.13SQ,20 |
Other Interface ICs |
.5 mm |
80 Cel |
-20 Cel |
QUAD |
S-PQCC-N24 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP14,.25 |
.9 V |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
1.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N14 |
1 |
.8 mm |
2.5 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.13SQ,20 |
Other Interface ICs |
.5 mm |
80 Cel |
-20 Cel |
QUAD |
S-PQCC-N24 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
55 mA |
2.5 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
.265 ns |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
55 mA |
2.5 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
.265 ns |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
53 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
.47 ns |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.465 V |
1 |
35 mA |
2.5 V |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
SMALL OUTLINE, LOW PROFILE |
TSSOP8,.19 |
3 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
3.3 V |
1.5/5.5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
Other Interface ICs |
1.5 V |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
.55 mm |
1 mm |
Not Qualified |
e4 |
30 |
260 |
1.45 mm |
||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N12 |
1 |
.55 mm |
1.7 mm |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
.9 mm |
2 mm |
Not Qualified |
e3 |
30 |
260 |
2.3 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
3.3 V |
0.9/4.5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
.9 V |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
33.1 V |
1 |
CMOS |
SMALL OUTLINE, SHRINK PITCH |
16 V |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
1.99 mm |
5.3 mm |
Not Qualified |
10.2 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
QUAD |
S-PQCC-N8 |
1 |
.6 mm |
1.6 mm |
NOT SPECIFIED |
260 |
1.6 mm |
||||||||||||||||||||||||||||||||||||
Onsemi |
DIGITAL ISOLATOR |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.4 |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
3 mm |
7.5 mm |
10.3 mm |
||||||||||||||||||||||||||||||||||||||
|
Onsemi |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
OTHER |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
YES |
CMOS |
.1 mA |
3/5 |
FLATPACK |
QFP80,.7X.9,32 |
0 |
64-BP |
Other Interface ICs |
.8 mm |
85 Cel |
-20 Cel |
QUAD |
R-PQFP-G80 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
.9 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 mm |
2.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
33.1 V |
1 |
CMOS |
SMALL OUTLINE, SHRINK PITCH |
16 V |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
1.99 mm |
5.3 mm |
Not Qualified |
10.2 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
.9 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N14 |
1 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.5 mm |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
DIGITAL ISOLATOR |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.4 |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
3 mm |
7.5 mm |
10.3 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.4 |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
3 mm |
7.5 mm |
e3 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||||
Onsemi |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
SEGMENT |
YES |
CMOS |
.5 mA |
3/5 |
FLATPACK |
QFP64,.66SQ,32 |
200 |
4-BP |
Other Interface ICs |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
Onsemi |
COMMERCIAL |
SEGMENT |
CMOS |
.3 mA |
3.3/5 |
DIE OR CHIP |
0 |
240-BP |
Other Interface ICs |
70 Cel |
-20 Cel |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
2.8 V |
0.9/4.5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,16 |
Other Interface ICs |
.9 V |
.4 mm |
125 Cel |
1.8 V |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-N6 |
1 |
.55 mm |
1 mm |
Not Qualified |
CONFIGURABLE INTERFACE STANDARDS |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
1.2 mm |
||||||||||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
33.1 V |
1 |
CMOS |
SMALL OUTLINE, SHRINK PITCH |
16 V |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
1.99 mm |
5.3 mm |
Not Qualified |
10.2 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
SMALL OUTLINE |
SOP14,.25 |
.9 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.65 mm |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
OTHER |
BALL |
30 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3 V |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.6 V |
2.6 V |
.4 mm |
85 Cel |
2.8 V |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B30 |
1 |
.45 mm |
1.99 mm |
IT ALSO OPERATES AT 3V |
e1 |
30 |
260 |
2.59 mm |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
50 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.3 V |
25 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC50,.2X.4,20 |
5 V |
Other Interface ICs |
2 V |
.5 mm |
85 Cel |
15 V |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N50 |
3 |
1 mm |
5 mm |
Not Qualified |
ALSO REQUIRED NEG SUPPLY VOLTAGE -13V TO 0 |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.07X.1,16 |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
1 |
.8 mm |
1.8 mm |
e4 |
30 |
260 |
2.6 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
4.5 V |
2 |
AEC-Q100 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.9 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
.9 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N14 |
1 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.5 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
.9 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N14 |
1 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.5 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
INDUSTRIAL |
GULL WING |
30 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
YES |
CMOS |
.46 mA |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP30,.3 |
16 |
4-BP |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G30 |
4 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
BUTT |
6 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
2.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SOLCC6,.04,20 |
.9 V |
.4 mm |
125 Cel |
1.8 V |
-55 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
.4 mm |
1 mm |
Not Qualified |
CONFIGURABLE INTERFACE STANDARDS |
e4 |
1.2 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
.9 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N14 |
1 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.5 mm |
||||||||||||||||||||||||||||||||||
Onsemi |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
SEGMENT |
YES |
CMOS |
.46 mA |
5 V |
5 |
FLATPACK |
QFP80,.55SQ,20 |
55 |
3-BP |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G80 |
Not Qualified |
||||||||||||||||||||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
53 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 mm |
3 mm |
Not Qualified |
e0 |
235 |
3 mm |
.47 ns |
|||||||||||||||||||||||||||||
|
Onsemi |
Tin (Sn) |
1 |
e3 |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.