Samsung Other Function Interface ICs 30

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

KA2284B

Samsung

INTERFACE CIRCUIT

THROUGH-HOLE

9

SIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

SINGLE

R-PSIP-T9

7.3 mm

3 mm

Not Qualified

21.84 mm

S6C0679

Samsung

COMMERCIAL

464

PLASTIC/EPOXY

SEGMENT

YES

CMOS

3 V

3

TAB,464 PINS

420

0-BP

Other Interface ICs

1.27 mm

70 Cel

-20 Cel

Not Qualified

S6C1104XXX(COF)

Samsung

COMMERCIAL

SEGMENT

CMOS

6 mA

3 V

3

DIE OR CHIP

384

0-BP

Other Interface ICs

70 Cel

-20 Cel

Not Qualified

KS0717

Samsung

INDUSTRIAL

SEGMENT

CMOS

3/5

DIE OR CHIP

100

54-BP

Other Interface ICs

85 Cel

-40 Cel

Not Qualified

KS0070Q

Samsung

COMMERCIAL

GULL WING

128

QFP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.8 mA

3/5

FLATPACK

QFP128,.68X.85,20

80

16-BP

Other Interface ICs

.5 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQFP-G128

Not Qualified

e0

KS0063B

Samsung

OTHER

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

YES

CMOS

1 mA

3/5,3/13

FLATPACK

QFP100,.7X1.0

80

0-BP

Other Interface ICs

.635 mm

85 Cel

-30 Cel

QUAD

R-PQFP-G100

Not Qualified

KS0715

Samsung

INDUSTRIAL

SEGMENT

CMOS

1 mA

3/5

DIE OR CHIP

100

33-BP

Other Interface ICs

85 Cel

-40 Cel

Not Qualified

KS0071B-00

Samsung

OTHER

SEGMENT

CMOS

1 mA

3/5

DIE OR CHIP

60

32-BP

Other Interface ICs

85 Cel

-30 Cel

Not Qualified

S6B33B2A

Samsung

OTHER

SEGMENT

.95 mA

1.8/3.3

DIE OR CHIP

132

162-BP

Other Interface ICs

70 Cel

-30 Cel

Not Qualified

KS0093

Samsung

OTHER

SEGMENT

CMOS

3/5

DIE OR CHIP

80

26-BP

Other Interface ICs

85 Cel

-30 Cel

Not Qualified

KS0040

Samsung

OTHER

SEGMENT

CMOS

1 mA

3/5

DIE OR CHIP

132

65-BP

Other Interface ICs

85 Cel

-30 Cel

Not Qualified

KS0076Q

Samsung

COMMERCIAL

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.8 mA

3/5

FLATPACK

QFP80,.75X1,32

40

16-BP

Other Interface ICs

.8 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQFP-G80

Not Qualified

e0

KS0073

Samsung

OTHER

GULL WING

128

QFP

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.3 mA

3/5

FLATPACK

QFP128(UNSPEC)

60

34-BP

Other Interface ICs

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

QUAD

Not Qualified

e0

KS0068B-00

Samsung

OTHER

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.9 mA

3/5

FLATPACK

QFP100,.7X1.0

40

16-BP

Other Interface ICs

.635 mm

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQFP-G100

Not Qualified

e0

KS0642

Samsung

COMMERCIAL

372

PLASTIC/EPOXY

SEGMENT

YES

CMOS

3.3,11

TAB,372PINS

312

0-BP

Other Interface ICs

1.27 mm

70 Cel

-20 Cel

Not Qualified

KS0108Q

Samsung

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.5 mA

5 V

5

FLATPACK

QFP100,.7X1.0

64

0-BP

Other Interface ICs

.635 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQFP-G100

Not Qualified

e0

S6A0073

Samsung

COMMERCIAL EXTENDED

SEGMENT

CMOS

.3 mA

3/5

DIE OR CHIP

60

34-BP

Other Interface ICs

80 Cel

-30 Cel

Not Qualified

KS0711

Samsung

INDUSTRIAL

SEGMENT

CMOS

1 mA

3/5

DIE OR CHIP

132

65-BP

Other Interface ICs

85 Cel

-40 Cel

Not Qualified

S6A0090

Samsung

OTHER

SEGMENT

CMOS

.1 mA

3/5

DIE OR CHIP

64

26-BP

Other Interface ICs

85 Cel

-30 Cel

Not Qualified

S6C1108XXX(TCP)

Samsung

COMMERCIAL

SEGMENT

YES

CMOS

3 V

3

TAB(UNSPEC)

384

0-BP

Other Interface ICs

70 Cel

-20 Cel

Not Qualified

S6C1108XXX(COF)

Samsung

COMMERCIAL

SEGMENT

CMOS

3 V

3

DIE OR CHIP

384

0-BP

Other Interface ICs

70 Cel

-20 Cel

Not Qualified

KS0654

Samsung

COMMERCIAL

PLASTIC/EPOXY

SEGMENT

YES

CMOS

3,9

TAB(UNSPEC)

384

0-BP

Other Interface ICs

70 Cel

-20 Cel

Not Qualified

S6B33B2BXX-B0CY

Samsung

OTHER

SEGMENT

.95 mA

1.8/3.3

DIE OR CHIP

132

162-BP

Other Interface ICs

70 Cel

-30 Cel

Not Qualified

KS0672

Samsung

COMMERCIAL

450

PLASTIC/EPOXY

SEGMENT

YES

CMOS

7 mA

3/3.3,8/13

TAB,450PINS

384

0-BP

Other Interface ICs

1.27 mm

70 Cel

-20 Cel

Not Qualified

KA2287B

Samsung

INTERFACE CIRCUIT

THROUGH-HOLE

9

SIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

SINGLE

R-PSIP-T9

7.3 mm

3 mm

Not Qualified

21.84 mm

KS0010

Samsung

INTERFACE CIRCUIT

OTHER

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQFP-G48

1.7 mm

7 mm

Not Qualified

7 mm

S6C0666

Samsung

COMMERCIAL

428

PLASTIC/EPOXY

SEGMENT

YES

CMOS

3 V

3

TAB,428PINS

384

0-BP

Other Interface ICs

1.27 mm

70 Cel

-20 Cel

Not Qualified

KA2285B

Samsung

INTERFACE CIRCUIT

THROUGH-HOLE

9

SIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

SINGLE

R-PSIP-T9

7.3 mm

3 mm

Not Qualified

21.84 mm

S6C1104XXX(TCP)

Samsung

COMMERCIAL

PLASTIC/EPOXY

SEGMENT

YES

CMOS

6 mA

3 V

3

TAB(UNSPEC)

384

0-BP

Other Interface ICs

70 Cel

-20 Cel

Not Qualified

S6A0092

Samsung

OTHER

SEGMENT

CMOS

.5 mA

2.5/3.3

DIE OR CHIP

80

26-BP

Other Interface ICs

85 Cel

-30 Cel

Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.