Other Function Interface ICs

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9614DPZ	NXP Semiconductors	INTERFACE CIRCUIT																															1							260
PTCA9416DTMR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	BCC	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1				1.32 V	3.6 V		CHIP CARRIER			1.08 V			1.08 V	.5 mm	125 Cel		-40 Cel		BOTTOM	R-PBCC-N20		.4 mm	.8 mm						1.35 mm
SEC1210-CN-02NC	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25					3.6 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
TFDU6103-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V	1				3 V			MICROELECTRONIC ASSEMBLY						2.4 V	1 mm	85 Cel		-25 Cel	MATTE TIN	SINGLE	R-PSMA-X8	4	4.7 mm	4 mm			e3	10	260	9.9 mm
TFDU6103-TT3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	L BEND	8		RECTANGULAR	UNSPECIFIED		YES	5.5 V	1		CMOS		3.3 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.4 V			2.4 V	1 mm	85 Cel	3.3 V	-25 Cel	MATTE TIN	SINGLE	R-XSMA-L8	4	4.2 mm	4.7 mm	Not Qualified		e3	10	260	9.7 mm
TPS25821DSSR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm	2 mm			e4	30	260	3 mm
6ES7131-6BF01-0AA0	Siemens	Digital I/P Module
772001	Pilz & Kg	Digital I/P Module
ADN2531ACPZ-R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20				Display Drivers	3 V	.5 mm	100 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.9 mm	3 mm	Not Qualified		e3			3 mm
ADUM1201WSRZ35	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	2		CMOS		5 V			SMALL OUTLINE	SOP8,.25					3 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
ADUM1400WTRWZ-RL	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4		CMOS	AEC-Q100	5 V			SMALL OUTLINE						3 V	1.27 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm	Not Qualified		e3	30	260	10.3 mm
ADUM142E1BRZ	Analog Devices	DIGITAL ISOLATOR	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4		CMOS		1.8 V			SMALL OUTLINE	SOP16,.25					1.7 V	1.27 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	3	1.75 mm	3.9 mm		IT ALSO OPERATES AT 2.5, 3.3, 5 V	e3	30	260	9.9 mm
ASI4UE-G1-MT	Renesas Electronics	INTERFACE CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	33.1 V	1		CMOS		30 V			SMALL OUTLINE, SHRINK PITCH						16 V	.65 mm	85 Cel		-25 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm			e3	30	260	10.2 mm
BB-485DRCI	Advantech	INTERFACE CIRCUIT
CCE4502CC5L-QFN	Renesas Electronics	DIGITAL I/O MODULE		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	36 V	1		HV-CMOS		24 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20					9 V	.5 mm	105 Cel		-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm
CCE451048QFN	Renesas Electronics	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	32 V	1		HV-CMOS		24 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20					8 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N48	3	1 mm	7 mm						7 mm
CCE4510_QFN24	Dialog Semiconductor	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	32 V	1		HVCMOS		24 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						8 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm
CP2112-F03-GM	Silicon Labs	INTERFACE CIRCUIT
GTL2012DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
HSDL-3021-021	Broadcom	INTERFACE CIRCUIT	OTHER	NO LEAD	8		RECTANGULAR	UNSPECIFIED		NO	3.6 V	1		BICMOS		3 V			MICROELECTRONIC ASSEMBLY						2.4 V		85 Cel		-25 Cel		SINGLE	R-XSMA-N8	4			Not Qualified				255
ISO6731FQDWRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	3	3	CMOS	AEC-Q100	1.8 V									1.71 V		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2				ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V	e4	30	260
ISO6731QDWRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	3	3	CMOS	AEC-Q100	1.8 V									1.71 V		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2				ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V	e4	30	260
ISO7331CDW	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5 V	3	3			3.3 V			SMALL OUTLINE						3.3 V	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2	2.65 mm	7.5 mm		IT ALSO OPERATES AT 5V	e4	30	260	10.3 mm
ISO7340CDWR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5 V	4	4			3.3 V			SMALL OUTLINE						3.3 V	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2	2.65 mm	7.5 mm		IT ALSO OPERATES AT 5 V	e4	30	260	10.3 mm
ISO7720QDWQ1	Texas Instruments	DIGITAL ISOLATOR	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	2	2	CMOS	AEC-Q100	2.5 V			SMALL OUTLINE	SOP16,.4					2.25 V	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	2	2.65 mm	7.5 mm		ALSO REQUIRED VCC2 SUPPLY 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY	e4	30	260	10.3 mm
ISOW7742FDFMR	Texas Instruments	INTERFACE CIRCUIT		GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.63 V	4	4			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SOP20,.4					2.97 V	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	3	3.55 mm	7.5 mm			e4		260	12.83 mm
ISOW7742QDFMRQ1	Texas Instruments	DIGITAL ISOLATOR		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.63 V	2	4	CMOS	AEC-Q100	3.3 V			SMALL OUTLINE	SOP20,.4					2.97 V	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	3	2.65 mm	7.5 mm		IT ALSO REQUIRES 5V NOMINAL SUPPLY VOLTAGE	e4		260	10.3 mm
LT8500ETJ#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR		3.3 V			GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22					3 V	.55 mm	125 Cel		-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
LTC4316IMS#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		CMOS		3.3 V			SMALL OUTLINE						2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	1.1 mm	3 mm			e3		260	3 mm
LTM2887IY-3I#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	32	LBGA	RECTANGULAR	UNSPECIFIED		YES	3.6 V	1				3.3 V			GRID ARRAY, LOW PROFILE	BGA32,8X11,50					3 V	1.27 mm	85 Cel		-40 Cel		BOTTOM	R-XBGA-B32	4	3.62 mm	15 mm				30	245	11.25 mm
M74HC4543B1	Sgs-ates Componenti Electronici S P A		INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	NO				CMOS				2/6	IN-LINE	DIP16,.3	7		0-BP	Other Interface ICs		2.54 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified		e0
MAX14851AEE+	Analog Devices	INTERFACE CIRCUIT																												Matte Tin (Sn) - annealed			1					e3	30	260
MAX14851AEE+T	Analog Devices	INTERFACE CIRCUIT																												Matte Tin (Sn) - annealed			1					e3	30	260
MAX14930BASE+T	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4		BICMOS		3.3 V			SMALL OUTLINE	SOP16,.25					1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm		Also has VDDB supply from 1.71V to 5.5V	e3	30	260	9.9 mm
MAX3001EAUP/V+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		BICMOS	AEC-Q100		5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.65 V			1.2 V	.65 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm			e3	30	260	6.5 mm
MC33972ATEKR2	NXP Semiconductors	INTERFACE CIRCUIT																												TIN			3					e3	40	260
NTS0104UK-Q100Z	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES					AEC-Q100			1.8/3.3,2.5/5	GRID ARRAY, FINE PITCH	BGA12,3X4,16				Other Interface ICs		.4 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B12				Not Qualified
PCA9515ADRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	2		BICMOS		3 V		2.5/3.3	SMALL OUTLINE	SOP8,.25				Other Interface ICs	2.3 V	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
PCA9601D,118	NXP Semiconductors	BUS BUFFERS		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	15 V	1				5 V			SMALL OUTLINE	SOP8,.25					2.5 V	1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm				30	260	4.9 mm
PCA9616PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			3 V			.8 V	.65 mm	85 Cel	5 V	-40 Cel		DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm				30	260	5 mm
PCAL6534EVJ	NXP Semiconductors	INTERFACE CIRCUIT		BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16					.8 V	.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B42	1	1 mm	2.6 mm			e1	30	260	3 mm
RPM971-H14E3A	ROHM	INTERFACE CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED		NO	3.6 V	1				3 V	5.5 V		MICROELECTRONIC ASSEMBLY			2.7 V			2.4 V	.95 mm	85 Cel	3 V	-25 Cel		SINGLE	R-XSMA-X8		2.2 mm	2.9 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
SEC1210-CN-02	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25					3.6 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
SI8651AB-B-IS1	Silicon Labs	DIGITAL ISOLATOR		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		CMOS		5 V			SMALL OUTLINE	SOP16,.25					2.5 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm						9.9 mm
SI8660EC-B-IS1	Silicon Labs	DIGITAL ISOLATOR		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		CMOS	AEC-Q100	5 V			SMALL OUTLINE	SOP16,.24					2.375 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm						9.9 mm
SI8661EC-B-IS1	Silicon Labs	DIGITAL ISOLATOR		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		CMOS	AEC-Q100	5 V			SMALL OUTLINE	SOP16,.24					2.375 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm						9.9 mm
SI8662ED-B-IS	Silicon Labs	DIGITAL ISOLATOR		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		CMOS	AEC-Q100	5 V			SMALL OUTLINE	SOP16,.4					2.375 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm						10.3 mm
SI88240ED-IS	Silicon Labs	INTERFACE CIRCUIT																															3						40	260

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.