Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Data Input Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Maximum Supply Current | No. of Digits/Characters | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | High Side Driver | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Current Flow Direction | Length | Multiplexed Display Capability |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
14 |
HLSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
1 |
AEC-Q100 |
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
13.5 V |
100 us |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
8 V |
1.27 mm |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.7 mm |
1.5 A |
3.9 mm |
230 us |
e3 |
SINK |
8.65 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
14 |
HLSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
MOS |
AEC-Q100 |
OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE |
13.5 V |
230 us |
13.5 |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
SOP14,.25 |
Peripheral Drivers |
3.3 V |
1.27 mm |
2 |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.7 mm |
1.5 A |
3.9 mm |
230 us |
Not Qualified |
e3 |
260 |
SINK |
8.65 mm |
||||||||||||||||||||||||
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
14 |
HLSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE |
230 us |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
3.3 V |
1.27 mm |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.7 mm |
1.5 A |
3.9 mm |
230 us |
e3 |
SINK |
8.65 mm |
|||||||||||||||||||||||||||||||||
Texas Instruments |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
4 |
BIPOLAR |
TRANSIENT |
10 us |
-52 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T14 |
5.08 mm |
.1 A |
7.62 mm |
10 us |
Not Qualified |
SOURCE |
19.305 mm |
|||||||||||||||||||||||||||||||||
Texas Instruments |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
TRANSIENT |
10 us |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
10 us |
Not Qualified |
SOURCE |
8.65 mm |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
TRANSIENT |
10 us |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
10 us |
Not Qualified |
SOURCE |
8.65 mm |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
4 |
BIPOLAR |
TRANSIENT |
10 us |
-52 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T14 |
5.08 mm |
.1 A |
7.62 mm |
10 us |
Not Qualified |
SOURCE |
19.305 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1.2/5,1.8/5 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
Peripheral Drivers |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELEPHONE RELAY DRIVER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELEPHONE RELAY DRIVER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELEPHONE RELAY DRIVER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
OVER CURRENT; THERMAL |
5 V |
100 us |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
DUAL |
R-PDSO-G24 |
1.75 mm |
.26 A |
3.9 mm |
100 us |
Not Qualified |
SOURCE AND SINK |
8.65 mm |
|||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
OVER CURRENT; THERMAL |
5 V |
100 us |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
DUAL |
R-PDSO-G24 |
1.75 mm |
.26 A |
3.9 mm |
100 us |
Not Qualified |
SOURCE AND SINK |
8.65 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
14 |
HLSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
MOS |
AEC-Q100 |
OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE |
230 us |
8/18 |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
SOP14,.25 |
Peripheral Drivers |
3.3 V |
1.27 mm |
2 |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.7 mm |
1.5 A |
3.9 mm |
230 us |
Not Qualified |
e3 |
260 |
SINK |
8.65 mm |
|||||||||||||||||||||||||
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
18 |
HLSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
OVER CURRENT; THERMAL |
5 V |
100 us |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
3 V |
.65 mm |
DUAL |
R-PDSO-G18 |
1.7 mm |
.35 A |
3.9 mm |
100 us |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
SOURCE AND SINK |
8.65 mm |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
18 |
HLSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
OVER CURRENT; THERMAL |
5 V |
100 us |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
SSOP24,.24 |
Peripheral Drivers |
3 V |
.65 mm |
8 |
MATTE TIN |
DUAL |
R-PDSO-G18 |
3 |
1.7 mm |
.35 A |
3.9 mm |
100 us |
Not Qualified |
e3 |
260 |
SOURCE AND SINK |
8.65 mm |
|||||||||||||||||||||||||
|
Infineon Technologies |
TELEPHONE RELAY DRIVER |
GULL WING |
18 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
OVER CURRENT; THERMAL |
5 V |
100 us |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
3 V |
.65 mm |
DUAL |
R-PDSO-G18 |
1.7 mm |
.35 A |
3.9 mm |
100 us |
NOT SPECIFIED |
NOT SPECIFIED |
SOURCE AND SINK |
8.65 mm |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
1 |
.67 mm |
3.06 mm |
Not Qualified |
e0 |
245 |
SINK |
3.06 mm |
|||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
SINK |
5 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
245 |
SINK |
5 mm |
|||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1.2/5,1.8/5 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
Peripheral Drivers |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
SINK |
5 mm |
||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
SINK |
5 mm |
|||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
245 |
SINK |
5 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
245 |
SINK |
5 mm |
|||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
SINK |
5 mm |
|||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
1 |
.67 mm |
3.06 mm |
Not Qualified |
e0 |
SINK |
3.06 mm |
||||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1.2/5,1.8/5 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
Peripheral Drivers |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5 V |
.02 us |
1.2/5,1.8/5 |
GRID ARRAY |
BGA36,6X6,20 |
Peripheral Drivers |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
.69 mm |
3.065 mm |
.02 us |
Not Qualified |
e1 |
30 |
260 |
SOURCE AND SINK |
3.065 mm |
||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
SINK |
5 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
SINK |
5 mm |
||||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
SINK |
5 mm |
|||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
SINK |
5 mm |
|||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
1 |
.67 mm |
3.06 mm |
Not Qualified |
e0 |
245 |
SINK |
3.06 mm |
|||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
SINK |
5 mm |
|||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
SINK |
5 mm |
|||||||||||||||||||||||||||
|
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Peripheral Drivers |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
SINK |
5 mm |
|||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
.8 mm |
5 mm |
Not Qualified |
e0 |
SINK |
5 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
TELEPHONE RELAY DRIVER |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
TRANSIENT |
1.65 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
1 |
.67 mm |
3.06 mm |
Not Qualified |
e0 |
245 |
SINK |
3.06 mm |
Peripheral drivers are electronic components that control and drive the operation of peripheral devices in electronic systems, such as motors, sensors, and actuators. They are commonly used in industrial and commercial applications that require precise and reliable control of peripheral devices.
Peripheral drivers can be classified into several types based on their specific functions and applications, including motor drivers, sensor drivers, and actuator drivers. These drivers can also include power supplies, amplifiers, and motor controllers, among other components.
Motor drivers are used to control and drive the operation of DC and stepper motors, and they typically include a microcontroller, power MOSFETs, and protection circuitry. Sensor drivers are used to interface with and drive sensors, which are electronic devices that detect and respond to physical stimuli. They typically include an analog-to-digital converter and signal conditioning circuitry. Actuator drivers are used to control and drive the operation of actuators, which are devices that produce a mechanical motion when energized. They are commonly used in industrial automation and control applications.
Peripheral drivers are typically characterized by their voltage and current ratings, as well as their efficiency and reliability. They play a critical role in ensuring the precise and reliable control of peripheral devices in electronic systems.