Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
4 |
.04 mA |
1.5 V |
1.2/3.6,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
Other Interface ICs |
1.2 V |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
1 mm |
3.5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
|||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
8 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
R-PQCC-N20 |
1 |
1 mm |
2.5 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
4.5 mm |
||||||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
.005 mA |
LATCH |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.14X.16,20 |
1.2 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 mm |
3.5 mm |
4 mm |
|||||||||||||||||||||
|
Onsemi |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
4 |
100 mA |
1.2 V |
1.5/3.3 |
22 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
1 |
.8 mm |
2.5 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
3.5 mm |
|||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 |
1 mm |
2.5 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
3.5 mm |
||||||||||||||||
|
Onsemi |
TTL/CMOS TO CMOS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
8 |
NONE |
1.3 V |
1.2/3.3 |
6.9 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
R-PQCC-N20 |
1 |
.8 mm |
2.5 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
4.5 mm |
|||||||||||
Renesas Electronics |
CMOS TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
3.3 V |
2.5/3.3 |
0 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Level Translators |
2.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
Renesas Electronics |
CMOS TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
3.3 V |
2.5/3.3 |
0 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Level Translators |
2.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
1.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||||
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
AEC-Q100 |
8 |
LATCH |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
0 V |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
R-PQCC-N20 |
1 mm |
2.5 mm |
4.5 mm |
||||||||||||||||||||||
Micrel |
PECL-TTL/TTL-PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3.3 |
2.5 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N8 |
2 |
.9754 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
30 |
240 |
2 mm |
|||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
8 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N20 |
1 |
1 mm |
2.5 mm |
Not Qualified |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
e4 |
4.5 mm |
|||||||||||||
|
M/a-com Technology Solutions |
TTL TO GAAS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
1 |
.02 mA |
5 V |
+-5 |
-5 V |
25 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Interface ICs |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N20 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4 mm |
|||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
4 mm |
||||||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
AEC-Q100 |
8 |
LATCH |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
0 V |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N20 |
1 |
1 mm |
2.5 mm |
e4 |
260 |
4.5 mm |
|||||||||||||||||
|
Onsemi |
PECL TO LVPECL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
4 |
NONE |
2.5 V |
10 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
Onsemi |
PECL TO LVPECL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
4 |
NONE |
2.5 V |
10 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
3 mm |
||||||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
3 mm |
||||||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
3 mm |
||||||||||||||||
|
Onsemi |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
8 |
100 mA |
1.2 V |
1.5/3.3 |
24 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.17X.14,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N24 |
1 |
.8 mm |
3.5 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
4.5 mm |
|||||||||||
|
Onsemi |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.47 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML, LVCMOS, LVTTL OR LVDS TO LVDS TRANSLATION ALSO POSSIBLE |
260 |
3 mm |
||||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
52 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.95 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N52 |
1 |
1 mm |
8 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
8 mm |
|||||||||||||||
|
Onsemi |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.47 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML, LVCMOS, LVTTL OR LVDS TO LVDS TRANSLATION ALSO POSSIBLE |
e4 |
260 |
3 mm |
|||||||||||||||
|
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
3 |
1 |
NONE |
3.3 V |
2.5/3.3,-3.3/-5 |
.75 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
4 mm |
|||||||||||||
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
52 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.95 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
QUAD |
S-XQCC-N52 |
1 mm |
8 mm |
Not Qualified |
COMPLEMENTARY |
8 mm |
|||||||||||||||||||||
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
52 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.95 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
QUAD |
S-XQCC-N52 |
1 mm |
8 mm |
Not Qualified |
COMPLEMENTARY |
8 mm |
|||||||||||||||||||||
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
3 |
1 |
NONE |
3.3 V |
2.5/3.3,-3.3/-5 |
.75 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
4 mm |
||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
52 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.95 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N52 |
1 |
1 mm |
8 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
8 mm |
|||||||||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
COMMERCIAL EXTENDED |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
4 |
ECL |
2 |
NONE |
5 V |
5,-5.2 |
-5.2 V |
3.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Level Translators |
4.75 V |
.5 mm |
75 Cel |
OPEN-EMITTER |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
3 mm |
||||||||||||
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
3 |
1 |
NONE |
3.3 V |
2.5/3.3,-3.3/-5 |
.75 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
30 |
235 |
4 mm |
||||||||||||||
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e0 |
30 |
235 |
4 mm |
||||||||||||||
|
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
3 |
1 |
NONE |
3.3 V |
2.5/3.3,-3.3/-5 |
.75 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4 mm |
||||||||||||
|
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e3 |
30 |
260 |
4 mm |
||||||||||||
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e0 |
235 |
4 mm |
|||||||||||||||
|
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e3 |
260 |
4 mm |
|||||||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
COMMERCIAL EXTENDED |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
4 |
ECL |
2 |
NONE |
5 V |
5,-5.2 |
-5.2 V |
3.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Level Translators |
4.75 V |
.5 mm |
75 Cel |
OPEN-EMITTER |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
3 mm |
|||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
1.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
4 mm |
||||||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
8 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
R-PQCC-N20 |
1 mm |
2.5 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
4.5 mm |
||||||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 mm |
2.5 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3.5 mm |
||||||||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3 mm |
||||||||||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
4 mm |
||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3.5 mm |
|||||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
3 mm |
||||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
e4 |
4 mm |
|||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24/28,.14X.2,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
R-PQCC-N24 |
1 |
1 mm |
3.5 mm |
Not Qualified |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
5.5 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.