Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
ECL |
1 |
NONE |
5 V |
5 |
5.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.75 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.45 ns |
SMALL OUTLINE |
SOP8,.25 |
Level Translators |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4.9 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.45 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.45 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SOP8,.25 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.7 ns |
SMALL OUTLINE |
SOP8,.25 |
Level Translators |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4.9 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.7 ns |
SMALL OUTLINE |
SOP8,.25 |
Level Translators |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4.9 mm |
|||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
1.8 ns |
SMALL OUTLINE |
SOP8,.25 |
Level Translators |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
4.9 mm |
|||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e0 |
235 |
3 mm |
|||||||||||||
|
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
4 mm |
||||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Microchip Technology |
LVPECL TO LVTTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
2 |
1 |
30 mA |
NONE |
DIFFERENTIAL |
3.3 V |
2.5 ns |
SMALL OUTLINE |
SOP8,.25 |
3.135 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.73 mm |
3.94 mm |
TRUE |
e4 |
30 |
260 |
4.93 mm |
|||||||||||||
|
Microchip Technology |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
20 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Microchip Technology |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.465 V |
2 |
1 |
25 mA |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE |
SOP8,.25 |
3.135 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.73 mm |
3.94 mm |
Not Qualified |
COMPLEMENTARY |
CAN ALSO OPERATE WITH 5V SUPPLY |
e4 |
30 |
260 |
4.93 mm |
||||||||||||
|
Microchip Technology |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1 |
30 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e4 |
40 |
260 |
3 mm |
|||||||||||||
|
Microchip Technology |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.7 V |
2 |
1 |
80 mA |
NONE |
3.3 V |
.7 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML-TO-LVDS TRANSLATION ALSO POSSIBLE |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Microchip Technology |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1 |
25 mA |
NONE |
STANDARD |
3.3 V |
.6 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.9754 mm |
2 mm |
COMPLEMENTARY |
ALSO OPERATES AT 5V SUPPLY |
e4 |
40 |
260 |
2 mm |
||||||||||||
|
Micrel |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
S-PDSO-N8 |
1 |
.9754 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
ALSO OPERATES AT 5V SUPPLY |
e4 |
40 |
260 |
2 mm |
||||||||||||||
|
Microchip Technology |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
45 mA |
3.3 V |
.4 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.9754 mm |
2 mm |
TRUE |
e4 |
2 mm |
|||||||||||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
2 |
.012 mA |
LATCH |
1.8 V |
1.8/3.3,2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B8 |
1 |
.625 mm |
.9 mm |
Not Qualified |
e1 |
30 |
260 |
1.9 mm |
||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
36 mA |
NONE |
STANDARD |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
36 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
48 mA |
NONE |
STANDARD |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
36 mA |
NONE |
STANDARD |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
|||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
Texas Instruments |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Level Translators |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
|||||||||||||||||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
48 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
48 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
NOT SPECIFIED |
260 |
2 mm |
|||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
48 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
48 mA |
NONE |
STANDARD |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||
Texas Instruments |
TTL TO ECL TRANSCEIVER |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
BIPOLAR |
1 |
74 mA |
LATCH |
STANDARD |
5,-4.5 |
0 ns |
CHIP CARRIER |
LDCC28,.5SQ |
Level Translators |
4.5 V |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
TRUE |
e0 |
11.5062 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.