32 Bus Driver & Transceivers 13

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935262846518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32		3.6 V	1.1 mm	6.1 mm		TRUE	2.7 V		e4			11 mm	LVT
935262846118	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32		3.6 V	1.1 mm	6.1 mm		TRUE	2.7 V		e4			11 mm	LVT
935262846112	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32		3.6 V	1.1 mm	6.1 mm		TRUE	2.7 V		e4			11 mm	LVT
935262846512	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32		3.6 V	1.1 mm	6.1 mm		TRUE	2.7 V		e4			11 mm	LVT
74LVT1403DR,118	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32	2	3.6 V	1.1 mm	6.1 mm	Not Qualified	TRUE	2.7 V		e4			11 mm	LVT
74LVT1403DR,518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32		3.6 V	1.1 mm	6.1 mm		TRUE	2.7 V		e4			11 mm	LVT
74LVT1403DR	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8	N/A		3.3	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.3	6.4 ns	64 Amp	Bus Driver/Transceivers	.65 mm	85 Cel	UNIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	COMMON CONTROL	R-PDSO-G32	1	3.6 V	1.1 mm	6.1 mm	Not Qualified	TRUE	2.7 V	11 mA	e4	30	260	11 mm	LVT
74LVT1403DR,112	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8	N/A		3.3	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.3	6.4 ns	64 Amp	Bus Driver/Transceivers	.65 mm	85 Cel	UNIDIRECTIONAL	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	COMMON CONTROL	R-PDSO-G32	2	3.6 V	1.1 mm	6.1 mm	Not Qualified	TRUE	2.7 V	11 mA	e4	30	260	11 mm	LVT
74LVT1403DR-T	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32	2	3.6 V	1.1 mm	6.1 mm	Not Qualified	TRUE	2.7 V		e4			11 mm	LVT
74LVT1403DR,512	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	GULL WING	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	8			3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6.4 ns			.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G32		3.6 V	1.1 mm	6.1 mm		TRUE	2.7 V		e4			11 mm	LVT
PI4ULS3V08MZLEX	Diodes Incorporated	BUS TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	2	CMOS	4		TR	1.5	1.2/3.3	10 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.12X.24,16	7 ns	2 Amp	Bus Driver/Transceivers	.4 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2	COMMON CONTROL	R-XQCC-N32		3.6 V	.8 mm	3 mm	Not Qualified	TRUE	1.2 V		e4			6 mm	4ULS
PI4ULS3V08MZLE	Diodes Incorporated	BUS TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	2	CMOS	4			1.5	1.2/3.3	10 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.12X.24,16	7 ns	2 Amp	Bus Driver/Transceivers	.4 mm	85 Cel	BIDIRECTIONAL	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2	COMMON CONTROL	R-XQCC-N32		3.6 V	.8 mm	3 mm	Not Qualified	TRUE	1.2 V		e4			6 mm	4ULS
MM66307SP/FP	Renesas Electronics	BUS DRIVER	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	16			5			SMALL OUTLINE						70 Cel			0 Cel		DUAL	2		R-PDSO-G32		5.5 V			Not Qualified	TRUE	4.5 V						LV/LV-A/LVX/H

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.