HVBCC Bus Driver & Transceivers 81

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVT16245BBX,518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8		TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	3.5 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V			30	260	6 mm	LVT
PSN74AXC1T45DTQR	Texas Instruments	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		173 ns				125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B6		36 V	.4 mm	.8 mm		TRUE	.65 V					1 mm	AXC
74AVC1T45GXZ	Nexperia	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1		TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.9 ns				125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		TRUE	.8 V		e4	30	260	1 mm	AVC
935288811515	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V	WITH DIRECTION CONTROL				6 mm	LVT
935295865518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		5.5 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	ALVC/VCX/A
935288809515	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V	WITH DIRECTION CONTROL				6 mm	LVT
935288048518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935295884518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	10			1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	.8 V					6 mm	AVC
935288778518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.6 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935288811518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V	WITH DIRECTION CONTROL				6 mm	LVT
935288809518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V	WITH DIRECTION CONTROL				6 mm	LVT
935288777518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.6 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935295874518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935288813518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V		e4			6 mm	LVT
935288812518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V		e4			6 mm	LVT
935295873518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935295869518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935288048515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935289829115	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	20	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B20		3.6 V	.5 mm	2.5 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e4			4.5 mm	LVC/LCX/Z
935295882518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	LVT
935289828115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	20	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B20		3.6 V	.5 mm	2.5 mm		TRUE	1.2 V		e4			4.5 mm	LVC/LCX/Z
935295872518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935300601115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	20	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		18.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B20		3.6 V	.5 mm	2.5 mm		TRUE	1.65 V					4.5 mm	LVC/LCX/Z
935289934115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	20	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B20		3.6 V	.5 mm	2.5 mm		TRUE	1.2 V		e4			4.5 mm	LVC/LCX/Z
935295883518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	LVT
935295877518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	LVT
935295866518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.2 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	.8 V					6 mm	AVC
935288047518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V		e4			6 mm	LVC/LCX/Z
935289935115	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	20	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B20		3.6 V	.5 mm	2.5 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e4			4.5 mm	LVC/LCX/Z
935295879518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	LVT
935288143518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	10			1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	.8 V					6 mm	AVC
74AUP2G126GX	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	1			1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B8		3.6 V	.35 mm	.8 mm		TRUE	.8 V					1.35 mm	AUP/ULP/V
935295878518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	LVT
935295875518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935288047515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V		e4			6 mm	LVC/LCX/Z
935295867518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	10			1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	.8 V					6 mm	AVC
935288778515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.6 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
935295876518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	2.7 V					6 mm	LVT
74AUP2G125GX	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	1			1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B8		3.6 V	.35 mm	.8 mm		TRUE	.8 V					1.35 mm	AUP/ULP/V
935288777515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.6 mm	4 mm		TRUE	1.2 V					6 mm	LVC/LCX/Z
74LVT16245BBQ	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V	WITH DIRECTION CONTROL				6 mm	LVT
74LVTH16245BBQ	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V	WITH DIRECTION CONTROL				6 mm	LVT
74LVTH16244BBX	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V					6 mm	LVT
74LVT16244BBX	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V					6 mm	LVT
74AVCH16T245BQ	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		14.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	.8 V	TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B	e4			6 mm	AVC
74LVC16244ABQ	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V					6 mm	LVC/LCX/Z
74AVCH16T245BX	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8	0.8/3.3V&0.8/3.3V		1.2	1.2/3.3	15 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	14.4 ns	6 Amp	Bus Driver/Transceivers	.5 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	.8 V	TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B	e4	30	260	6 mm	AVC
74LVC16374ABQ	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	100000000 Hz	CMOS	8			2.7	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC(UNSPEC)	7.5 ns	24 Amp	FF/Latches	.5 mm	125 Cel		3-STATE	POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.6 mm	4 mm	Not Qualified	TRUE	1.2 V		e4	30	260	6 mm	LVC/LCX/Z

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.