Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.7 |
CHIP CARRIER, VERY THIN PROFILE |
173 ns |
12 Amp |
.4 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.65 V |
.012 mA |
e4 |
30 |
260 |
1 mm |
AXC |
||||||||||||||||||||
|
Nexperia |
BUS DRIVER |
INDUSTRIAL |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
210 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
2.75 V |
.5 mm |
1 mm |
TRUE |
.7 V |
e3 |
30 |
260 |
1.45 mm |
AXP |
|||||||||||||||||||||
|
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
4 Amp |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
S-PBCC-B5 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.0009 mA |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.7 |
CHIP CARRIER, VERY THIN PROFILE |
181 ns |
12 Amp |
125 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.65 V |
.014 mA |
e4 |
30 |
260 |
1 mm |
AXC |
||||||||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
NO LEAD |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
1.2 |
15 pF |
CHIP CARRIER, VERY THIN PROFILE |
55 ns |
32 Amp |
.6 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-N6 |
1 |
5.5 V |
.4 mm |
.8 mm |
TRUE |
1.1 V |
.004 mA |
e4 |
260 |
1 mm |
LXC |
||||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
NO LEAD |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
1 |
1.2 |
15 pF |
CHIP CARRIER, VERY THIN PROFILE |
55 ns |
32 Amp |
.6 mm |
125 Cel |
BIDIRECTIONAL |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-N6 |
1 |
5.5 V |
.4 mm |
.8 mm |
TRUE |
1.1 V |
.004 mA |
e4 |
260 |
1 mm |
LXC |
||||||||||||||||||
|
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
4 Amp |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
S-PBCC-B5 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.0009 mA |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
S-PBCC-B5 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||||||||||
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
S-PBCC-B5 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
24 ns |
1.7 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
ENABLE LOW |
S-PBCC-B8 |
1 |
3.6 V |
.5 mm |
1.6 mm |
Not Qualified |
TRUE |
.8 V |
e4 |
30 |
260 |
1.6 mm |
AUP/ULP/V |
|||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
24 ns |
1.7 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
ENABLE HIGH |
S-PBCC-B8 |
1 |
3.6 V |
.5 mm |
1.6 mm |
Not Qualified |
TRUE |
.8 V |
e4 |
30 |
260 |
1.6 mm |
AUP/ULP/V |
|||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
1.1 |
CHIP CARRIER, VERY THIN PROFILE |
26.8 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
S-PBCC-B8 |
1 |
3.6 V |
.5 mm |
1.6 mm |
Not Qualified |
INVERTED |
.8 V |
30 |
260 |
1.6 mm |
AUP/ULP/V |
||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
8 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
24 ns |
1.7 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
ENABLE LOW |
S-PBCC-B8 |
1 |
3.6 V |
.5 mm |
1.6 mm |
Not Qualified |
TRUE |
.8 V |
e4 |
30 |
260 |
1.6 mm |
AUP/ULP/V |
|||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
BICMOS |
4 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
4 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.6 mm |
4 mm |
Not Qualified |
TRUE |
2.7 V |
6 mm |
LVT |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
BICMOS |
4 |
TR |
3.3 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
LGA60,8X12,20 |
4 ns |
64 Amp |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
ENABLE LOW |
R-PBCC-B60 |
2 |
3.6 V |
.5 mm |
4 mm |
Not Qualified |
TRUE |
2.7 V |
e4 |
30 |
260 |
6 mm |
LVT |
|||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
TR |
3.3 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
SLGA60,8X12,20 |
3.5 ns |
64 Amp |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
Not Qualified |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
BICMOS |
4 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
4 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.6 mm |
4 mm |
Not Qualified |
TRUE |
2.7 V |
6 mm |
LVT |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
2.7 |
CHIP CARRIER, VERY THIN PROFILE |
7.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B60 |
2 |
3.6 V |
.6 mm |
4 mm |
TRUE |
1.2 V |
e4 |
30 |
260 |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
TR |
2.7 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
LCC(UNSPEC) |
6 ns |
24 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
ENABLE LOW |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
Not Qualified |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
CHIP CARRIER, VERY THIN PROFILE |
6 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
100000000 Hz |
CMOS |
8 |
TR |
2.7 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
LGA60,8X12,20 |
7.5 ns |
24 Amp |
FF/Latches |
.5 mm |
125 Cel |
3-STATE |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B60 |
2 |
3.6 V |
.6 mm |
4 mm |
Not Qualified |
TRUE |
1.2 V |
e4 |
30 |
260 |
6 mm |
LVC/LCX/Z |
||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
100000000 Hz |
CMOS |
8 |
TR |
2.7 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
LGA60,8X12,20 |
7.5 ns |
24 Amp |
FF/Latches |
.5 mm |
125 Cel |
3-STATE |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B60 |
2 |
3.6 V |
.6 mm |
4 mm |
Not Qualified |
TRUE |
1.2 V |
e4 |
30 |
260 |
6 mm |
LVC/LCX/Z |
||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
2.7 |
CHIP CARRIER, VERY THIN PROFILE |
7.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B60 |
2 |
3.6 V |
.6 mm |
4 mm |
TRUE |
1.2 V |
e4 |
30 |
260 |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
TR |
3.3 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
SLGA60,8X12,20 |
3.5 ns |
64 Amp |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
Not Qualified |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
CHIP CARRIER, VERY THIN PROFILE |
6 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
TR |
2.7 |
3.3 |
50 pF |
CHIP CARRIER, VERY THIN PROFILE |
LCC(UNSPEC) |
6 ns |
24 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
ENABLE LOW |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
Not Qualified |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
||||||||||||||||||
|
Nexperia |
BUS TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
0.9/5V & 0.9/5V |
1.2 |
5 pF |
CHIP CARRIER, VERY THIN PROFILE |
SOLCC6,.03,20 |
38 ns |
12 Amp |
.5 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-N8 |
1 |
5.5 V |
.35 mm |
.8 mm |
TRUE |
.9 V |
.013 mA |
e4 |
30 |
260 |
1.35 mm |
AXP |
|||||||||||||
|
Nexperia |
BUS DRIVER |
INDUSTRIAL |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
210 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
2.75 V |
.5 mm |
1 mm |
TRUE |
.7 V |
e3 |
30 |
260 |
1.45 mm |
AXP |
|||||||||||||||||||||
|
Nexperia |
BUS TRANSCEIVER |
NO LEAD |
8 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
TR, 7 INCH |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
SOLCC6,.03,20 |
38 ns |
12 Amp |
.5 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
DUAL |
2 |
COMMON CONTROL |
R-PBCC-N8 |
1 |
5.5 V |
.35 mm |
.8 mm |
TRUE |
.9 V |
.013 mA |
30 |
260 |
1.35 mm |
AXP |
||||||||||||||||||
|
Nexperia |
BUS TRANSCEIVER |
NO LEAD |
8 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
SOLCC8,.03,20 |
9 ns |
12 Amp |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
COMMON CONTROL |
R-PBCC-N8 |
1 |
3.6 V |
.35 mm |
.8 mm |
TRUE |
.8 V |
.016 mA |
e4 |
30 |
260 |
1.35 mm |
AVC |
|||||||||||||||||
|
Diodes Incorporated |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.5 |
CHIP CARRIER, VERY THIN PROFILE |
5.6 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B6 |
3.6 V |
.4 mm |
.9 mm |
TRUE |
1.2 V |
WITH BUS HOLD AND DIRECTION CONTROL |
e4 |
30 |
260 |
1.4 mm |
AVC |
|||||||||||||||||||||
|
Diodes Incorporated |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.5 |
CHIP CARRIER, VERY THIN PROFILE |
5.6 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B6 |
3.6 V |
.4 mm |
.9 mm |
TRUE |
1.2 V |
WITH DIRECTION CONTROL |
e4 |
260 |
1.4 mm |
AVC |
A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.
The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.
Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).
In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.
Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.