BALL Bus Driver & Transceivers 1,086

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	Screening Level	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935281134557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		5.6 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V		e0			7 mm	LVT
935263933557	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32		CMOS		1			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		5.5 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm	LVC/LCX/Z
935270793557	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		6 ns			.65 mm	125 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e0			7 mm	LVC/LCX/Z
935270795118	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		3.5 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V	WITH DIRECTION CONTROL	e0			7 mm	LVT
935281131518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		6 ns			.65 mm	125 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e0			7 mm	LVC/LCX/Z
935271944157	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		8			2.7			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		5.5 ns			.65 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	7 mm	LVC/LCX/Z
935281136518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		6.2 ns			.8 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	2.7 V		e0			13.5 mm	LVT
935281141551	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		5.8 ns			.8 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	1.2 V		e0			13.5 mm	LVC/LCX/Z
935281132551	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS		4			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		4 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V		e0			7 mm	LVT
935264448518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32		CMOS		1			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		5.8 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm	LVC/LCX/Z
935281142551	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		6.4 ns			.8 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	1.2 V		e0			13.5 mm	LVC/LCX/Z
935281133551	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		3.5 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V	WITH DIRECTION CONTROL	e0			7 mm	LVT
935263930557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32		CMOS		1			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		7.3 ns			.8 mm	85 Cel		3-STATE WITH SERIES RESISTOR		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm	LVC/LCX/Z
935270793551	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		6 ns			.65 mm	125 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e0			7 mm	LVC/LCX/Z
935281136557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		6.2 ns			.8 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	2.7 V		e0			13.5 mm	LVT
935279012551	NXP Semiconductors	BUS TRANSCEIVER	OTHER	BALL	72	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		11			1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		.1 ns			.5 mm	85 Cel		3-STATE		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2		S-PBGA-B72		1.9 V	1.5 mm	7 mm		TRUE	1.7 V		e1			7 mm	CBT/FST/QS/5C/B
935284599551	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			1.2			GRID ARRAY, LOW PROFILE, FINE PITCH		10.2 ns			.8 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	.8 V					13.5 mm	AVC
935281132557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS		4			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		4 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V		e0			7 mm	LVT
935266783518	NXP Semiconductors	REGISTERED BUS TRANSCEIVER	INDUSTRIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	36		CMOS		1			2.5			GRID ARRAY, LOW PROFILE, FINE PITCH		6.1 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B114		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	16 mm	ALVC/VCX/A
935263933551	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32		CMOS		1			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		5.5 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm	LVC/LCX/Z
935299479518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	AEC-Q100	8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		13.8 ns			.65 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	1.2 V	ALSO OPERATES AT 1.65 TO 3.6V SUPPLY				7 mm	LVC/LCX/Z
935271933551	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		5.6 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V		e0			7 mm	LVT
935270792518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		4			2.7			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		6 ns			.65 mm	125 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	1.2 V		e0			7 mm	LVC/LCX/Z
935270792118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		4			2.7			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		6 ns			.65 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	7 mm	LVC/LCX/Z
NTS0104UK-Q100	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	4			1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.4 mm	125 Cel		OPEN-DRAIN/3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B12		3.6 V	.615 mm	1.2 mm		TRUE	1.65 V	SECOND POWER SUPPLY VOLTAGE VCC(B) RANGES FROM 2.3 V TO 5.5 V				1.6 mm	NTS0104
935271944518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		6 ns			.65 mm	125 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e0			7 mm	LVC/LCX/Z
935281139518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			2.7			GRID ARRAY, LOW PROFILE, FINE PITCH		4.7 ns			.8 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	1.2 V		e0			13.5 mm	LVC/LCX/Z
935284953518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		4.7 ns			.8 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	1.2 V		e0			13.5 mm	LVC/LCX/Z
935270390518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32		BICMOS		1			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		6.2 ns			.8 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96	4	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.7 V					13.5 mm	LVT
935264449557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		6.4 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm	LVC/LCX/Z
935270795551	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		3.5 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V	WITH DIRECTION CONTROL	e0			7 mm	LVT
74LVT16244BEV-T	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BALL	56	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		4		TR	3.3	3.3	50 pF	GRID ARRAY, FINE PITCH	BGA56,6X10,25		64 Amp	Bus Driver/Transceivers	.635 mm	125 Cel		3-STATE		-40 Cel		BOTTOM		ENABLE LOW	R-PBGA-B56					Not Qualified	TRUE
74AVC32T245ECK	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8	1.5/3.3V&1.5/3.3V	TRAY	1.2	1.5/3.3	15 pF	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	10.2 ns	8 Amp	Bus Driver/Transceivers	.8 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		BOTTOM	2	COMMON CONTROL	R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	.8 V					13.5 mm	AVC
74LVCH32245AEC	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8	N/A		2.7	3.3		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	4.7 ns	24 Amp	Bus Driver/Transceivers	.8 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	2	COMMON CONTROL	R-PBGA-B96	4	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V		e0	30	260	13.5 mm	LVC/LCX/Z
74LVC16244AEV-S	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BALL	56	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		4		TRAY	3.3	3.3	50 pF	GRID ARRAY, FINE PITCH	BGA56,6X10,25		24 Amp	Bus Driver/Transceivers	.635 mm	125 Cel		3-STATE		-40 Cel		BOTTOM		ENABLE LOW	R-PBGA-B56					Not Qualified	TRUE
74LVT32374EC/G,557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS		8			3.3			GRID ARRAY, LOW PROFILE, FINE PITCH		6.2 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96	2	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.7 V					13.5 mm	LVT
74LVCH32244AEC,518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	8		CMOS		4			2.7			GRID ARRAY, LOW PROFILE, FINE PITCH		4.7 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96	4	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V					13.5 mm	LVC/LCX/Z
74LVCH32373AEC	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		8			3.3	3.3	50 pF	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	5.8 ns	24 Amp	FF/Latches	.8 mm	85 Cel		3-STATE		-40 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	2		R-PBGA-B96	4	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V		e0	30	260	13.5 mm	LVC/LCX/Z
74LVT16374AEVK	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS		8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		5.6 ns			.65 mm	85 Cel		3-STATE		-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	2.7 V		e0			7 mm	LVT
74ALVCH32501EC	NXP Semiconductors	REGISTERED BUS TRANSCEIVER	INDUSTRIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		18			2.5			GRID ARRAY, LOW PROFILE, FINE PITCH		6.1 ns			.8 mm	85 Cel		3-STATE		-40 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	2		R-PBGA-B114		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V	CAN ALSO OPERATE AT 3.3V SUPPLY	e0			16 mm	ALVC/VCX/A
74LVTH322245EC,557	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS		8		TRAY	3.3	3.3		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,20	3.9 ns	12 Amp	Bus Driver/Transceivers	.8 mm	85 Cel	BIDIRECTIONAL	3-STATE WITH SERIES RESISTOR		-40 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	2	COMMON CONTROL	R-PBGA-B96	4	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.7 V		e0	30	260	13.5 mm	LVT
74LVC322244AEC	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		4			3.3	3.3		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	7.3 ns	12 Amp	Bus Driver/Transceivers	.8 mm	85 Cel		3-STATE WITH SERIES RESISTOR		-40 Cel		BOTTOM	2	ENABLE LOW	R-PBGA-B96		3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.2 V					13.5 mm	LVC/LCX/Z
74AVC16T245EV,557	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS		8	0.8/3.3V&0.8/3.3V	TRAY	1.1	1.2/3.3	15 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,6X10,25	10.2 ns	6 Amp	Bus Driver/Transceivers	.65 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	MATTE TIN	BOTTOM	2	COMMON CONTROL	R-PBGA-B56	1	3.6 V	1 mm	4.5 mm	Not Qualified	TRUE	.8 V		e3			7 mm	AVC
74LVT32374EC,557	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4	150000000 Hz	BICMOS		8			3.3	3.3	50 pF	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	6.2 ns	64 Amp	FF/Latches	.8 mm	85 Cel		3-STATE	POSITIVE EDGE	-40 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	2		R-PBGA-B96	4	3.6 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.7 V		e0	30	260	13.5 mm	LVT
74LVCH322244AEC/G:	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	8		CMOS		4			2.7			GRID ARRAY, LOW PROFILE, FINE PITCH		6.7 ns			.8 mm	85 Cel		3-STATE WITH SERIES RESISTOR		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	1.2 V		e0			13.5 mm	LVC/LCX/Z
74LVCH16244AEV-T	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BALL	56	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS		4		TR	3.3	3.3	50 pF	GRID ARRAY, FINE PITCH	BGA56,6X10,25		24 Amp	Bus Driver/Transceivers	.635 mm	125 Cel		3-STATE		-40 Cel		BOTTOM		ENABLE LOW	R-PBGA-B56					Not Qualified	TRUE
74LVCH32244AEC-T518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	8		CMOS		4			2.7			GRID ARRAY, LOW PROFILE, FINE PITCH		4.7 ns			.8 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B96		3.6 V	1.5 mm	5.5 mm		TRUE	1.2 V					13.5 mm	LVC/LCX/Z
74LVC16245AEV-Q100	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	AEC-Q100	8			3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		13.8 ns			.65 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBGA-B56	2	3.6 V	1 mm	4.5 mm		TRUE	1.2 V	ALSO OPERATES AT 1.65 TO 3.6V SUPPLY				7 mm	LVC/LCX/Z

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.