Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
5 |
50 pF |
FLATPACK |
5.9 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
TRUE |
4.5 V |
60 mA |
DIRECTION CONTROL |
10 mm |
MB |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
4 |
5 |
5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
4 |
260 |
6.2 mm |
CBT/FST/QS/5C/B |
|||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
14 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
5 |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP14,.3 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G14 |
1 |
5.5 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
6.2 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
BICMOS |
4 |
5 |
50 pF |
FLATPACK |
5.1 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
TRUE |
4.5 V |
60 mA |
OUTPUT ENABLE ACTIVE HIGH FOR TWO FUNCTIONS |
10 mm |
MB |
|||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
12 |
5 |
SMALL OUTLINE, SHRINK PITCH |
.25 ns |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G56 |
5.5 V |
2.8 mm |
7.5 mm |
TRUE |
4.5 V |
e4 |
18.425 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||||
NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
8 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
6.9 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G24 |
3.6 V |
1.1 mm |
4.4 mm |
TRUE |
2.7 V |
7.8 mm |
LVT |
||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G24 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
40 |
260 |
7.8 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
9 |
5 |
50 pF |
FLATPACK |
6.1 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
TRUE |
4.5 V |
68 mA |
WITH CLEAR AND CLOCK ENABLE |
10 mm |
MB |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
OTHER |
BALL |
72 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
11 |
1.8 |
1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA72,11X11,20 |
.1 ns |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
3-STATE |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 |
S-PBGA-B72 |
3 |
1.9 V |
1.5 mm |
7 mm |
Not Qualified |
TRUE |
1.7 V |
e1 |
30 |
260 |
7 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
5 |
50 pF |
SMALL OUTLINE |
190 ns |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
1 |
15 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
3 V |
e4 |
12.8 mm |
4000/14000/40000 |
|||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
1 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
5 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
4 |
TTL |
MIL-M-38510 Class B |
1 |
5 |
IN-LINE |
22 ns |
125 Cel |
3-STATE |
-55 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-GDIP-T14 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
e3/e4 |
TTL/H/L |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
OTHER |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
.75 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE WITH SERIES RESISTOR |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G24 |
3.6 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
3 V |
e4 |
7.8 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
5 |
50 pF |
SMALL OUTLINE |
340 ns |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G16 |
15 V |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
LOW TO HIGH VOLTAGE TRANSLATOR |
e4 |
9.9 mm |
4000/14000/40000 |
||||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
4 |
N/A |
5 |
5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.25 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
DUAL |
5 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.73 mm |
3.9 mm |
Not Qualified |
TRUE |
4.5 V |
.003 mA |
30 |
4 |
260 |
4.9 mm |
CBT/FST/QS/5C/B |
||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G24 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
40 |
260 |
7.8 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
5 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
.25 ns |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 |
R-PQCC-N20 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
4 V |
e4 |
4.5 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
6 |
5 |
50 pF |
IN-LINE |
160 ns |
2.54 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
2 |
R-GDIP-T16 |
15 V |
5.08 mm |
7.62 mm |
Not Qualified |
INVERTED |
3 V |
ONE FUNCTION WITH TWO BITS |
4000/14000/40000 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
10 |
5 |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
.25 ns |
Bus Driver/Transceivers |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G48 |
1 |
5.5 V |
2.8 mm |
7.5 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
15.875 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
10 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.3,20 |
.25 ns |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G48 |
5.5 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
12.5 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN LEAD |
DUAL |
2 |
R-PDSO-G48 |
5.5 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
4.5 V |
e0 |
12.5 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
5 |
FLATPACK |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
TRUE |
4.5 V |
60 mA |
WITH DUAL OUTPUT ENABLE |
10 mm |
MB |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
2 |
TTL |
MIL-PRF-38535 Class B |
4 |
5 |
IN-LINE |
23 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
2 |
R-GDIP-T16 |
5.5 V |
Not Qualified |
INVERTED |
4.5 V |
ONE FUNCTION WIYTH TWO BITS |
LS |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
CMOS |
4 |
5 |
50 pF |
IN-LINE |
190 ns |
2.54 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDIP-T20 |
15 V |
4.2 mm |
7.62 mm |
Not Qualified |
TRUE |
3 V |
e4 |
26.73 mm |
4000/14000/40000 |
||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G24 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4 V |
e4 |
7.8 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G20 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
4 V |
e4 |
30 |
260 |
6.5 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
5 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
.25 ns |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
2 |
R-PQCC-N20 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
4.5 mm |
3244 |
|||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
5 |
SMALL OUTLINE, VERY THIN PROFILE |
135 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-N8 |
6 V |
.5 mm |
2 mm |
TRUE |
2 V |
e4 |
3 mm |
HC/UH |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
1 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G8 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.5 V |
4.4 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
7.3 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
3.6 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
1.2 V |
WITH DIRECTION CONTROL |
e4 |
6.5 mm |
LVC/LCX/Z |
||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN LEAD |
DUAL |
2 |
R-PDSO-G48 |
5.5 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
4 V |
AVAILABLE ONLY IN NORTH AMERICA |
e0 |
12.5 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
4 |
N/A |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
.003 mA |
e4 |
30 |
4 |
260 |
5 mm |
CBT/FST/QS/5C/B |
|||||||||||||
NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
18 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
4.9 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G56 |
3.6 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
3 V |
14 mm |
GTLP |
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|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G24 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
7.8 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
6.5 ns |
.65 mm |
70 Cel |
OPEN-COLLECTOR/3-STATE |
0 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
INVERTED |
4.5 V |
75 mA |
MULTIPLEXED REAL TIME/REGISTERED/LATCHED DATA; OPEN COLLECTOR BTL PORT OUTPUTS |
10 mm |
TTL/H/L |
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NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
8 |
N/A |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP24,.4 |
10.5 ns |
36 Amp |
Bus Driver/Transceivers |
1.27 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-40 Cel |
DUAL |
2 |
INDEPENDENT CONTROL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.5 V |
165 mA |
SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA |
15.4 mm |
F/FAST |
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|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
1 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
5 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G48 |
2 |
5.5 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
4 V |
AVAILABLE ONLY IN NORTH AMERICA |
e4 |
12.5 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||
NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
5 |
FLATPACK |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
TRUE |
4.5 V |
60 mA |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
10 mm |
MB |
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|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
10 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.25 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G24 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
7.8 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
8 |
5 |
50 pF |
IN-LINE |
300 ns |
2.54 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDIP-T20 |
15 V |
4.2 mm |
7.62 mm |
Not Qualified |
TRUE |
3 V |
IOH = 9.3MA @ VOH = 3.6V |
26.73 mm |
4000/14000/40000 |
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|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
14 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
1 |
5 |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP14,.3 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G14 |
1 |
5.5 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
6.2 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G20 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
6.5 mm |
3244 |
|||||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
4 |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
4 |
260 |
5 mm |
CBT/FST/QS/5C/B |
|||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
10 |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
.25 ns |
Bus Driver/Transceivers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 |
R-PDSO-G24 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
7.8 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
4 |
5 |
50 pF |
IN-LINE |
340 ns |
2.54 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-GDIP-T16 |
15 V |
5.08 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
LOW TO HIGH VOLTAGE TRANSLATOR |
4000/14000/40000 |
A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.
The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.
Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).
In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.
Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.