10 Clock Drivers & Buffers 26

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Input Conditioning	No. of Functions	Technology	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	No. of Inverted Outputs	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Maximum Same Edge Skew (tskwd)	Minimum Operating Temperature	Terminal Finish	No. of True Outputs	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
MAX9174EUB-T	Maxim Integrated	LOW SKEW CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.23 ns			.5 mm	85 Cel		.045 ns	-40 Cel	TIN LEAD	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e0			3 mm
MAX9174EUB+T	Analog Devices	LOW SKEW CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.23 ns			.5 mm	85 Cel		.045 ns	-40 Cel	Matte Tin (Sn) - annealed	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e3	30	260	3 mm
MAX9175EUB	Maxim Integrated	CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3	3.3	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3.23 ns		Clock Drivers	.5 mm	85 Cel		.045 ns	-40 Cel	TIN LEAD	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e0			3 mm
MAX9175EUB+	Analog Devices	CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.23 ns			.5 mm	85 Cel		.045 ns	-40 Cel	Matte Tin (Sn) - annealed	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e3	30	260	3 mm
SL18861DIT	Silicon Labs	LOW SKEW CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1			1.8		0	SMALL OUTLINE, VERY THIN PROFILE					.4 mm	85 Cel	3-STATE		-40 Cel		3	DUAL		R-PDSO-N10		1.9 V	.8 mm	1.4 mm	Not Qualified	1.7 V						2 mm	18861
SL18861DI	Silicon Labs	LOW SKEW CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1			1.8		0	SMALL OUTLINE, VERY THIN PROFILE					.4 mm	85 Cel	3-STATE		-40 Cel		3	DUAL		R-PDSO-N10		1.9 V	.8 mm	1.4 mm	Not Qualified	1.7 V						2 mm	18861
MAX9175EUB+T	Analog Devices	CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.23 ns			.5 mm	85 Cel		.045 ns	-40 Cel	Matte Tin (Sn) - annealed	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e3	30	260	3 mm
MAX9174EUB+	Analog Devices	LOW SKEW CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3	3.3	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3.23 ns		Clock Drivers	.5 mm	85 Cel		.045 ns	-40 Cel	Matte Tin (Sn) - annealed	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e3	30	260	3 mm
STCD1030RDH6E	STMicroelectronics	PLL BASED CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1			2.8	2.8	0	SMALL OUTLINE, VERY THIN PROFILE	SOLCC10,.08,20			Clock Drivers	.5 mm	85 Cel			-40 Cel		3	DUAL		R-PDSO-N10		3.6 V	.8 mm	2 mm	Not Qualified	2.5 V				NOT SPECIFIED	NOT SPECIFIED	2.5 mm	1030
STCD1030RDH6F	STMicroelectronics		INDUSTRIAL	NO LEAD	10	SON	RECTANGULAR	PLASTIC/EPOXY	YES					2.8	2.8		SMALL OUTLINE	SOLCC10,.08,20			Clock Drivers	.5 mm	85 Cel			-40 Cel			DUAL		R-PDSO-N10					Not Qualified
74AVC1T1022GU	NXP Semiconductors	LOW SKEW CLOCK DRIVER	AUTOMOTIVE	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1	CMOS		1.2		0	CHIP CARRIER, VERY THIN PROFILE		15.7 ns			.4 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	QUAD		R-PQCC-N10	1	3.6 V	.5 mm	1.4 mm		.8 V			e4	30	260	1.8 mm	AVC
74AVC1T1022DP	NXP Semiconductors	LOW SKEW CLOCK DRIVER	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	STANDARD	1	CMOS		1.2		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		15.7 ns			.5 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm		.8 V			e4	30	260	3 mm	AVC
935305832115	Nexperia	LOW SKEW CLOCK DRIVER	AUTOMOTIVE	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1	CMOS	TR, 7 INCH	1.2		0	CHIP CARRIER, VERY THIN PROFILE		15.7 ns			.4 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	QUAD		R-PQCC-N10	1	3.6 V	.5 mm	1.4 mm		.8 V			e4	30	260	1.8 mm	AVC
935305831118	Nexperia	LOW SKEW CLOCK DRIVER	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	STANDARD	1	CMOS	TR, 13 INCH	1.2		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		15.7 ns			.5 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm		.8 V			e4	30	260	3 mm	AVC
74AVC1T1004GU33	Nexperia	LOW SKEW CLOCK DRIVER		NO LEAD	10	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1	CMOS		1.2		0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC10,.06X.07,16	15.7 ns	12 Amp		.4 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	DUAL		R-PQCC-N10	1	3.6 V	.33 mm	1.3 mm		.8 V	.05 mA		e4	30	260	1.6 mm	AVC
74AVC1T1022DPJ	Nexperia	LOW SKEW CLOCK DRIVER	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	STANDARD	1	CMOS	TR, 13 INCH	1.2		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		15.7 ns			.5 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm		.8 V			e4	30	260	3 mm	AVC
74AVC1T1022GUX	Nexperia	LOW SKEW CLOCK DRIVER	AUTOMOTIVE	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1	CMOS	TR, 7 INCH	1.2		0	CHIP CARRIER, VERY THIN PROFILE		15.7 ns			.4 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	QUAD		R-PQCC-N10	1	3.6 V	.5 mm	1.4 mm		.8 V			e4	30	260	1.8 mm	AVC
74AVC1T1004DP	Nexperia	LOW SKEW CLOCK DRIVER		GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	STANDARD	1	CMOS		1.2		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	15.7 ns	12 Amp		.5 mm	125 Cel	3-STATE	.9 ns	-40 Cel	NICKEL PALLADIUM GOLD	4	DUAL		R-PDSO-G10	1	3.6 V	1.1 mm	3 mm		.8 V	.05 mA		e4	30	260	3 mm	AVC
PI6UMC10802-1ZME	Diodes Incorporated	LOW SKEW CLOCK DRIVER		NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	STANDARD	1			1.8		0	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16				.4 mm	85 Cel			-30 Cel		2	QUAD	52 MHz	R-XQCC-N10		1.89 V	.55 mm	1.4 mm		1.71 V	3.5 mA					1.8 mm	PI6
PI6UMC10802-1ZMEX	Diodes Incorporated	LOW SKEW CLOCK DRIVER		NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	STANDARD	1		TR	1.8		0	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16				.4 mm	85 Cel			-30 Cel		2	QUAD	52 MHz	R-XQCC-N10		1.89 V	.55 mm	1.4 mm		1.71 V	3.5 mA					1.8 mm	PI6
MAX9174EUB	Maxim Integrated	LOW SKEW CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3	3.3	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3.23 ns		Clock Drivers	.5 mm	85 Cel		.045 ns	-40 Cel	TIN LEAD	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e0			3 mm
MAX9175EUB-T	Maxim Integrated	LOW SKEW CLOCK DRIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	DIFFERENTIAL	1	CMOS		3.3		0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.23 ns			.5 mm	85 Cel		.045 ns	-40 Cel	TIN LEAD	2	DUAL		S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	Not Qualified	3 V			e0		245	3 mm
MAX9174ETB	Maxim Integrated	LOW SKEW CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	HVQCCN	SQUARE	UNSPECIFIED	YES	DIFFERENTIAL	1	CMOS		3.3	3.3	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20	3.23 ns		Clock Drivers	.5 mm	85 Cel		.045 ns	-40 Cel	TIN LEAD	2	QUAD		S-XQCC-N10	1	3.6 V	.8 mm	3 mm	Not Qualified	3 V			e0			3 mm
MAX9175ETB	Maxim Integrated	LOW SKEW CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	HVQCCN	SQUARE	UNSPECIFIED	YES	DIFFERENTIAL	1	CMOS		3.3	3.3	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20	3.23 ns		Clock Drivers	.5 mm	85 Cel		.045 ns	-40 Cel	TIN LEAD	2	QUAD		S-XQCC-N10	1	3.6 V	.8 mm	3 mm	Not Qualified	3 V			e0			3 mm
8N3PG10MBKI-062LF	Renesas Electronics	LOW SKEW CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	HQCCN	RECTANGULAR	UNSPECIFIED	YES	DIFFERENTIAL	1			2.5		0	CHIP CARRIER, HEAT SINK/SLUG						85 Cel			-40 Cel	MATTE TIN	2	QUAD	311.04 MHz	R-XQCC-N10	3	2.625 V	1 mm	5 mm		2.375 V		ALSO OPERATES AT 3.135 TO 3.465 V SUPPLY	e3		260	7 mm	8N
8N3PG10MBKI-062LFT	Renesas Electronics	LOW SKEW CLOCK DRIVER	INDUSTRIAL	NO LEAD	10	HQCCN	RECTANGULAR	UNSPECIFIED	YES	DIFFERENTIAL	1			2.5		0	CHIP CARRIER, HEAT SINK/SLUG						85 Cel			-40 Cel	MATTE TIN	2	QUAD	311.04 MHz	R-XQCC-N10	3	2.625 V	1 mm	5 mm		2.375 V		ALSO OPERATES AT 3.135 TO 3.465 V SUPPLY	e3		260	7 mm	8N

Clock Drivers & Buffers

Clock drivers and buffers are two electronic components commonly used in digital systems to control the timing and distribution of clock signals.

Clock drivers are electronic components that generate a clock signal and distribute it to multiple components or devices within a digital system. The clock signal is a periodic waveform that synchronizes the timing of different operations within the system. The clock driver typically amplifies and shapes the clock signal to ensure that it meets the timing requirements of the system.

Buffers, on the other hand, are electronic components that amplify and isolate signals. In digital systems, buffers are often used to distribute clock signals to multiple components without degrading the quality of the signal. Buffers can help to reduce signal distortion, noise, and jitter, which can be particularly important in high-speed digital systems.

Buffers can also be used to isolate signals and prevent interference between different components or devices. They can be particularly useful in situations where the output of one device or component could damage another device or component.

Clock drivers and buffers can be used together to distribute clock signals throughout a digital system while maintaining signal integrity. The clock driver generates the clock signal and distributes it to the buffers, which then amplify and isolate the signal before distributing it to the various components or devices within the system.