MILITARY Clock Drivers & Buffers 69

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	Surface Mount	Input Conditioning	No. of Functions	Technology	Screening Level	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	No. of Inverted Outputs	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Maximum Same Edge Skew (tskwd)	Minimum Operating Temperature	Terminal Finish	No. of True Outputs	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
100E511/BYAJC	Onsemi		MILITARY	FLAT	28	QFF	SQUARE		CERAMIC	YES			ECL100K	38535Q/M;38534H;883B			-4.5		FLATPACK	QFL28,.4SQ			Clock Drivers	1.27 mm	125 Cel			-55 Cel	Tin/Lead (Sn/Pb)		QUAD		S-XQFP-F28					Not Qualified		e0
SC14046BDWR2G	Onsemi	PLL BASED CLOCK DRIVER	MILITARY	GULL WING	16	SOP	RECTANGULAR		PLASTIC/EPOXY	YES	STANDARD	1				5		0	SMALL OUTLINE					1.27 mm	125 Cel			-55 Cel	TIN	2	DUAL	1.4 MHz	R-PDSO-G16	3	18 V	2.65 mm	7.5 mm	Not Qualified	3 V	e3	30	260	10.3 mm	4000/14000/40000
RHFAC2525K1	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V	TR	3		0	FLATPACK	FL14,.25				1.27 mm	150 Cel			-55 Cel		8	DUAL		R-CDFP-F14		6 V	2.72 mm	6.345 mm		2 V				9.5 mm	AC
RHFAC2525K03V	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V	TR	3		0	FLATPACK	FL14,.25				1.27 mm	150 Cel			-55 Cel		8	DUAL		R-CDFP-F14		6 V	2.72 mm	6.345 mm		2 V				9.5 mm	AC
5962F9217402VXC	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V		3	2/5.5	0	FLATPACK	FL14,.25	8.5 ns	50 Amp	Clock Drivers	1.27 mm	125 Cel		.7 ns	-55 Cel		8	DUAL		R-CDFP-F14		5.5 V			Qualified	2 V					AC
RHFAC2525K04V	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V	TR	3		0	FLATPACK	FL14,.25				1.27 mm	150 Cel			-55 Cel		8	DUAL		R-CDFP-F14		6 V	2.72 mm	6.345 mm		2 V				9.5 mm	AC
RHFAC2525K01V	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	48	DFP	RECTANGULAR		CERAMIC	YES			CMOS	38535V;38534K;883S	TR		2/6		FLATPACK	FL48,.4,25			Clock Drivers	.635 mm	150 Cel			-55 Cel			DUAL		R-XDFP-F48					Not Qualified
RHFAC2525K02V	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V	TR	3		0	FLATPACK	FL14,.25				1.27 mm	150 Cel			-55 Cel		8	DUAL		R-CDFP-F14		6 V	2.72 mm	6.345 mm		2 V				9.5 mm	AC
5962F9217402VYC	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V		3		0	FLATPACK	FL14,.25				1.27 mm	150 Cel			-55 Cel		8	DUAL		R-CDFP-F14		6 V	2.72 mm	6.345 mm	Qualified	2 V				9.5 mm	AC
5962F9217402VYA	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V		3		0	FLATPACK	FL14,.25				1.27 mm	150 Cel			-55 Cel		8	DUAL		R-CDFP-F14		6 V	2.72 mm	6.345 mm	Qualified	2 V				9.5 mm	AC
5962F9217402VXA	STMicroelectronics	LOW SKEW CLOCK DRIVER	MILITARY	FLAT	14	DFP	RECTANGULAR	300k Rad(Si)	CERAMIC, METAL-SEALED COFIRED	YES	STANDARD	1	CMOS	MIL-PRF-38535 Class V		3	2/5.5	0	FLATPACK	FL14,.25	8.5 ns	50 Amp	Clock Drivers	1.27 mm	125 Cel		.7 ns	-55 Cel		8	DUAL		R-CDFP-F14		5.5 V			Qualified	2 V					AC
IDT54FCT388915T55J	Renesas Electronics		MILITARY	J BEND	28	QCCJ	SQUARE		PLASTIC/EPOXY	YES			CMOS			3.3	3.3		CHIP CARRIER	LDCC28,.5SQ			Clock Drivers	1.27 mm	125 Cel			-55 Cel	TIN LEAD		QUAD		S-PQCC-J28	1				Not Qualified		e0	20	225
IDT54FCT388915T55PY	Renesas Electronics		MILITARY	GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES			CMOS			3.3	3.3		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3			Clock Drivers	.635 mm	125 Cel			-55 Cel	TIN LEAD		DUAL		R-PDSO-G28	1				Not Qualified		e0	20	240
IDT54FCT388915T55L	Renesas Electronics		MILITARY	NO LEAD	28	QCCN	SQUARE		CERAMIC	YES			CMOS			3.3	3.3		CHIP CARRIER	LCC28,.45SQ			Clock Drivers	1.27 mm	125 Cel			-55 Cel	TIN LEAD		QUAD		S-XQCC-N28					Not Qualified		e0
54FCT388915T55J	Renesas Electronics		MILITARY	J BEND	28	QCCJ	SQUARE		PLASTIC/EPOXY	YES			CMOS			3.3	3.3		CHIP CARRIER	LDCC28,.5SQ			Clock Drivers	1.27 mm	125 Cel			-55 Cel	TIN LEAD		QUAD		S-PQCC-J28	1				Not Qualified		e0	20	225
54FCT388915T55PY	Renesas Electronics		MILITARY	GULL WING	28	SSOP	RECTANGULAR		PLASTIC/EPOXY	YES			CMOS			3.3	3.3		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3			Clock Drivers	.635 mm	125 Cel			-55 Cel	Tin/Lead (Sn85Pb15)		DUAL		R-PDSO-G28	1				Not Qualified		e0	20	240
54FCT388915T55L	Renesas Electronics		MILITARY	NO LEAD	28	QCCN	SQUARE		CERAMIC	YES			CMOS			3.3	3.3		CHIP CARRIER	LCC28,.45SQ			Clock Drivers	1.27 mm	125 Cel			-55 Cel	TIN LEAD		QUAD		S-XQCC-N28					Not Qualified		e0
49FCT805BTDB	Renesas Electronics	LOW SKEW CLOCK DRIVER	MILITARY	THROUGH-HOLE	20	DIP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	SCHMITT TRIGGER	2	CMOS	MIL-STD-883 Class B		5	5	0	IN-LINE	DIP20,.3	5.7 ns	32 Amp	Clock Drivers	2.54 mm	125 Cel	3-STATE	.9 ns	-55 Cel	TIN LEAD	5	DUAL		R-CDIP-T20	1	5.5 V			Not Qualified	4.5 V	e0		240		FCT
49FCT805CTLB	Renesas Electronics	LOW SKEW CLOCK DRIVER	MILITARY	NO LEAD	20	HQCCN	SQUARE		CERAMIC, METAL-SEALED COFIRED	YES	SCHMITT TRIGGER	2	CMOS	MIL-STD-883 Class B		5	5	0	CHIP CARRIER, HEAT SINK/SLUG	LCC20,.35SQ	5.2 ns	32 Amp	Clock Drivers	1.27 mm	125 Cel	3-STATE	.7 ns	-55 Cel	TIN LEAD	5	QUAD		S-CQCC-N20	1	5.5 V			Not Qualified	4.5 V	e0		240		FCT
49FCT805BTLB	Renesas Electronics	LOW SKEW CLOCK DRIVER	MILITARY	NO LEAD	20	QCCN	SQUARE		CERAMIC, METAL-SEALED COFIRED	YES	SCHMITT TRIGGER	2	CMOS	MIL-STD-883 Class B		5	5	0	CHIP CARRIER	LCC20,.35SQ	5.7 ns	32 Amp	Clock Drivers	1.27 mm	125 Cel	3-STATE	.9 ns	-55 Cel	TIN LEAD	5	QUAD		S-CQCC-N20	1	5.5 V			Not Qualified	4.5 V	e0		240		FCT
49FCT805CTDB	Renesas Electronics	LOW SKEW CLOCK DRIVER	MILITARY	THROUGH-HOLE	20	DIP	RECTANGULAR		CERAMIC, METAL-SEALED COFIRED	NO	SCHMITT TRIGGER	2	CMOS	MIL-STD-883 Class B		5	5	0	IN-LINE	DIP20,.3	5.2 ns	32 Amp	Clock Drivers	2.54 mm	125 Cel	3-STATE	.7 ns	-55 Cel	TIN LEAD	5	DUAL		R-CDIP-T20	1	5.5 V			Not Qualified	4.5 V	e0		240		FCT

Clock Drivers & Buffers

Clock drivers and buffers are two electronic components commonly used in digital systems to control the timing and distribution of clock signals.

Clock drivers are electronic components that generate a clock signal and distribute it to multiple components or devices within a digital system. The clock signal is a periodic waveform that synchronizes the timing of different operations within the system. The clock driver typically amplifies and shapes the clock signal to ensure that it meets the timing requirements of the system.

Buffers, on the other hand, are electronic components that amplify and isolate signals. In digital systems, buffers are often used to distribute clock signals to multiple components without degrading the quality of the signal. Buffers can help to reduce signal distortion, noise, and jitter, which can be particularly important in high-speed digital systems.

Buffers can also be used to isolate signals and prevent interference between different components or devices. They can be particularly useful in situations where the output of one device or component could damage another device or component.

Clock drivers and buffers can be used together to distribute clock signals throughout a digital system while maintaining signal integrity. The clock driver generates the clock signal and distributes it to the buffers, which then amplify and isolate the signal before distributing it to the various components or devices within the system.