Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Input Conditioning | No. of Functions | No. of Taps/Steps | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Programmable Delay Line | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | No. of Inverted Outputs | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Trigger Type | Maximum Same Edge Skew (tskwd) | Minimum Operating Temperature | Terminal Finish | No. of True Outputs | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
TR |
3.3 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 ns |
.5 mm |
85 Cel |
3-STATE |
.05 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
4 |
QUAD |
S-XQCC-N16 |
2 |
3.465 V |
.9 mm |
3 mm |
3.135 V |
e4 |
40 |
260 |
3 mm |
75572 |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
4 |
QUAD |
S-XQCC-N16 |
2.625 V |
1 mm |
3 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
3 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
150 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
150 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.15 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.15 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2 ns |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2 ns |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.15 ns |
-40 Cel |
16 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
Microchip Technology |
LOW SKEW CLOCK DRIVER |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
TR |
1.8 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.5 ns |
.5 mm |
105 Cel |
3-STATE |
.03 ns |
-40 Cel |
24 |
QUAD |
250 MHz |
S-PQCC-N56 |
1.98 V |
1 mm |
8 mm |
1.62 V |
35 mA |
ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY |
8 mm |
SY756 |
|||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
TR |
2.5 |
0 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.4 ns |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
15 |
QUAD |
2000 MHz |
S-PQFP-G64 |
3 |
2.625 V |
1.2 mm |
10 mm |
Not Qualified |
2.375 V |
e3 |
10 mm |
89218 |
||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.15 ns |
-40 Cel |
12 |
QUAD |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
CMOS |
TR |
2.5 |
1 pF |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.07 ns |
.5 mm |
85 Cel |
.04 ns |
-40 Cel |
4 |
QUAD |
1600 MHz |
S-XQCC-N32 |
2.625 V |
1 mm |
5 mm |
2.375 V |
197 mA |
HAS ULTRA-LOW ADDITIVE JITTER LVCMOS OUTPUT; ALSO OPERATES AT 3.3 V SUPPLY |
5 mm |
4000/14000/40000 |
|||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
TRAY |
2.5 |
0 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.4 ns |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
15 |
QUAD |
2000 MHz |
S-PQFP-G64 |
3 |
2.625 V |
1.2 mm |
10 mm |
Not Qualified |
2.375 V |
e3 |
10 mm |
89218 |
||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
TR |
2.5 |
0 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.4 ns |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
15 |
QUAD |
2000 MHz |
S-PQFP-G64 |
3 |
2.625 V |
1.2 mm |
10 mm |
Not Qualified |
2.375 V |
CAN ALSO OPERATE WITH 3.3V SUPPLY |
e3 |
10 mm |
89221 |
|||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.34 ns |
.5 mm |
85 Cel |
.02 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
8 |
QUAD |
2000 MHz |
S-XQCC-N16 |
2 |
2.625 V |
.9 mm |
3 mm |
Not Qualified |
2.375 V |
78 mA |
IT ALSO OPERATE ON 3.3V SUPPLY |
e4 |
3 mm |
89854 |
||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.71 ns |
.5 mm |
85 Cel |
.03 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
6 |
QUAD |
2500 MHz |
S-XQCC-N16 |
2 |
3.6 V |
.9 mm |
3 mm |
Not Qualified |
2.37 V |
75 mA |
IT ALSO OPERATE ON 3.3V SUPPLY |
e4 |
3 mm |
89871 |
||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.45 ns |
.5 mm |
85 Cel |
.02 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
8 |
QUAD |
2000 MHz |
S-XQCC-N16 |
2 |
2.625 V |
.95 mm |
3 mm |
Not Qualified |
2.375 V |
IT CAN ALSO OPERATE WITH 3.3V SUPPLY |
e4 |
3 mm |
89831 |
||||||||||||||||||||||
Microchip Technology |
PLL BASED CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
TRAY |
1.8 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
3.8 ns |
.5 mm |
85 Cel |
3-STATE WITH SERIES RESISTOR |
.1 ns |
-40 Cel |
12 |
QUAD |
1045 MHz |
S-XQCC-N56 |
1.89 V |
1 mm |
8 mm |
1.71 V |
852 mA |
ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY |
8 mm |
30265 |
||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
CMOS |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 ns |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
8 |
QUAD |
S-XQCC-N16 |
2.625 V |
1 mm |
3 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
3 mm |
4000/14000/40000 |
||||||||||||||||||||||||||
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
80 |
HBGA |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
CMOS |
TR |
3.3 |
0 |
GRID ARRAY, HEAT SINK/SLUG |
3 ns |
.5 mm |
85 Cel |
3-STATE WITH SERIES RESISTOR |
.05 ns |
-40 Cel |
40 |
BOTTOM |
250 MHz |
S-XBGA-N80 |
3.465 V |
.8 mm |
6 mm |
3.135 V |
308 mA |
6 mm |
4000/14000/40000 |
|||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
COMMERCIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
STANDARD |
1 |
TR |
1.8 |
0 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
70 Cel |
.5 ns |
0 Cel |
2 |
DUAL |
R-PDSO-N6 |
3.63 V |
.6 mm |
1.3 mm |
1.62 V |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
PL133 |
|||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
COMMERCIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
STANDARD |
1 |
BAG |
1.8 |
0 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
.25 ns |
0 Cel |
MATTE TIN |
3 |
DUAL |
R-PDSO-G6 |
1 |
3.63 V |
1.35 mm |
1.6 mm |
1.62 V |
e3 |
40 |
260 |
2.9 mm |
PL133 |
||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
STANDARD |
1 |
TUBE |
2.5 |
0 |
SMALL OUTLINE |
9.2 ns |
1.27 mm |
85 Cel |
.25 ns |
-40 Cel |
MATTE TIN |
4 |
DUAL |
R-PDSO-G8 |
3.63 V |
1.75 mm |
3.9 mm |
2.25 V |
e3 |
4.9 mm |
PL133 |
||||||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
GULL WING |
52 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
TRAY |
3.3 |
0 |
FLATPACK, LOW PROFILE |
1.57 ns |
.65 mm |
85 Cel |
.05 ns |
-40 Cel |
MATTE TIN |
15 |
QUAD |
S-PQFP-G52 |
3 |
3.6 V |
1.6 mm |
10 mm |
Not Qualified |
3 V |
ALSO OPERATES AT -3V TO -3.6V SUPPLY AT VCC = 0V |
e3 |
10 mm |
100E |
|||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
ECL |
TR |
3.3 |
0 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.475 ns |
.65 mm |
.025 ns |
MATTE TIN |
5 |
DUAL |
2000 MHz |
R-PDSO-G20 |
1 |
3.8 V |
1.1 mm |
4.4 mm |
Not Qualified |
2.37 V |
PECL MODE VCC=4.5V TO 5.5V WITH VEE=0V |
e3 |
40 |
260 |
6.5 mm |
100E |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
TUBE |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.36 ns |
.5 mm |
85 Cel |
.015 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
2 |
QUAD |
4500 MHz |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
2.375 V |
e4 |
40 |
260 |
5 mm |
ECL |
|||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
TUBE |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.36 ns |
.5 mm |
85 Cel |
.015 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
2 |
QUAD |
4500 MHz |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
2.375 V |
e4 |
40 |
260 |
5 mm |
56572 |
|||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.25 ns |
.5 mm |
85 Cel |
.015 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
4 |
QUAD |
7000 MHz |
S-XQCC-N16 |
2 |
3.6 V |
.95 mm |
3 mm |
Not Qualified |
2.375 V |
CAN ALSO OPERATE WITH 3.3V SUPPLY |
e4 |
3 mm |
58011 |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.27 ns |
.5 mm |
85 Cel |
.02 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
16 |
QUAD |
6000 MHz |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
2.375 V |
330 mA |
e4 |
260 |
5 mm |
58031 |
||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.29 ns |
.5 mm |
85 Cel |
.02 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
12 |
QUAD |
6000 MHz |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
2.375 V |
CAN ALSO OPERATE WITH 3.3V SUPPLY |
e4 |
5 mm |
58034 |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
TUBE |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.93 ns |
.5 mm |
85 Cel |
.05 ns |
-40 Cel |
NICKEL PALLADIUM GOLD |
8 |
QUAD |
1500 MHz |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
2.375 V |
ALSO OPERATES AT 3.3V SUPPLY |
e4 |
5 mm |
89202 |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL MUX |
1 |
TRAY |
2.5 |
0 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
1.2 ns |
.5 mm |
85 Cel |
.3 ns |
-40 Cel |
MATTE TIN |
20 |
QUAD |
1500 MHz |
S-PQFP-G64 |
3 |
2.625 V |
1.2 mm |
10 mm |
Not Qualified |
2.375 V |
IT CAN ALSO OPERATES WITH 3V TO 3.6V SUPPLY |
e3 |
10 mm |
89467 |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
COMMERCIAL |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL |
1 |
TRAY |
3.3 |
0 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
2 ns |
.5 mm |
70 Cel |
.05 ns |
0 Cel |
MATTE TIN |
16 |
QUAD |
500 MHz |
S-PQFP-G48 |
3.465 V |
1.2 mm |
7 mm |
Not Qualified |
3.135 V |
e3 |
7 mm |
898530 |
||||||||||||||||||||||||
|
Microchip Technology |
PLL BASED CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
TRAY |
1.8 |
15 pF |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 Amp |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
6 |
QUAD |
1035 MHz |
S-XQCC-N32 |
1.89 V |
1 mm |
5 mm |
1.71 V |
297 mA |
IT ALSO REQUIRED 3.3V SUPPLY |
e3 |
5 mm |
30253 |
||||||||||||||||||||||
|
Microchip Technology |
LOW SKEW CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL |
1 |
CMOS |
TRAY |
2.375 |
2.5/3.3 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
2 ns |
Clock Drivers |
.5 mm |
85 Cel |
.1 ns |
-40 Cel |
8 |
QUAD |
S-XQCC-N16 |
2.625 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
3 mm |
4000/14000/40000 |
||||||||||||||||||||||
Microchip Technology |
CLOCK DRIVER |
INDUSTRIAL |
NO LEAD |
20 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
DIFFERENTIAL |
1 |
CMOS |
TRAY |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
1 ns |
.5 mm |
85 Cel |
.05 ns |
-40 Cel |
4 |
QUAD |
400 MHz |
S-PQCC-N20 |
2.625 V |
1 mm |
4 mm |
2.375 V |
53 mA |
4 mm |
Clock drivers and buffers are two electronic components commonly used in digital systems to control the timing and distribution of clock signals.
Clock drivers are electronic components that generate a clock signal and distribute it to multiple components or devices within a digital system. The clock signal is a periodic waveform that synchronizes the timing of different operations within the system. The clock driver typically amplifies and shapes the clock signal to ensure that it meets the timing requirements of the system.
Buffers, on the other hand, are electronic components that amplify and isolate signals. In digital systems, buffers are often used to distribute clock signals to multiple components without degrading the quality of the signal. Buffers can help to reduce signal distortion, noise, and jitter, which can be particularly important in high-speed digital systems.
Buffers can also be used to isolate signals and prevent interference between different components or devices. They can be particularly useful in situations where the output of one device or component could damage another device or component.
Clock drivers and buffers can be used together to distribute clock signals throughout a digital system while maintaining signal integrity. The clock driver generates the clock signal and distributes it to the buffers, which then amplify and isolate the signal before distributing it to the various components or devices within the system.