Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Nominal Total Delay (td) | Surface Mount | No. of Functions | No. of Taps/Steps | Technology | Screening Level | Nominal Output Impedance (Z0) | Programmable Delay Line | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family | Maximum Input Frequency (fmax) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
+-3.3 |
FLATPACK |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
7 mm |
100E |
|||||||||
Pca Electronics |
ACTIVE DELAY LINE |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
YES |
1 |
5 |
TTL |
NO |
5 |
5 |
SMALL OUTLINE |
GWDIP8,.4 |
Delay Lines |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3 |
5.25 V |
6.35 mm |
Not Qualified |
TRUE |
4.75 V |
75 mA |
MAX RISE TIME CAPTURED |
e0 |
225 |
1140 |
5.71429 MHz |
|||||||||||
|
Pca Electronics |
ACTIVE DELAY LINE |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
YES |
1 |
5 |
TTL |
NO |
5 |
SMALL OUTLINE |
2.54 mm |
125 Cel |
-55 Cel |
MATTE TIN OVER NICKEL |
DUAL |
R-PDSO-G8 |
5.25 V |
6.35 mm |
Not Qualified |
TRUE |
4.75 V |
MAX RISE TIME CAPTURED |
e3 |
1140 |
|||||||||||||||||
Lexor |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
NO |
1 |
5 |
TTL |
NO |
5 |
IN-LINE |
DIP8/14,.3 |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T14 |
5.25 V |
7.62 mm |
TRUE |
4.75 V |
21 mm |
84316 |
||||||||||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
50 ohm |
YES |
TUBE |
2.5 |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
4 mm |
89297 |
||||||||||||||
Princeton Advanced Components |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
40 ns |
YES |
1 |
5 |
NO |
5 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G14 |
5.25 V |
5.842 mm |
6.35 mm |
TRUE |
4.75 V |
9.525 mm |
4438 |
|||||||||||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
16.6 ns |
YES |
2 |
511 |
ECL |
50 ohm |
YES |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
3.6 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
215 mA |
e3 |
30 |
260 |
4 mm |
6L |
20 MHz |
|||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
18.2 ns |
YES |
2 |
511 |
ECL |
YES |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
3.6 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
170 mA |
e3 |
30 |
260 |
4 mm |
6L |
20 MHz |
||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
170 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
40 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
6.98 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
20.32 mm |
|||||||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
50 ohm |
YES |
TR |
2.5 |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
4 mm |
89297 |
||||||||||||||
Lexor |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
150 ns |
NO |
1 |
5 |
TTL |
NO |
5 |
IN-LINE |
DIP8/14,.3 |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T14 |
5.25 V |
7.62 mm |
TRUE |
4.75 V |
21 mm |
84309 |
||||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
SIP8,.17 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
SINGLE |
R-PSIP-T8 |
5.25 V |
8.89 mm |
5.08 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
610 |
||||||||||||||||
|
Analog Devices |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
255 |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
e3 |
30 |
260 |
3 mm |
1124 |
|||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V |
e3 |
30 |
260 |
7 mm |
100E |
||||||||
|
Analog Devices |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
255 |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
e3 |
30 |
260 |
3 mm |
1124 |
|||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
YES |
TUBE |
2.5 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE |
e4 |
40 |
260 |
5 mm |
CMOS |
1500 MHz |
||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
6 ns |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
SIP8,.1 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
SINGLE |
R-XSIP-T8 |
5.25 V |
8.89 mm |
5.08 mm |
Not Qualified |
INVERTED |
4.75 V |
5 mA |
22.86 mm |
||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
4 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
8 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
|||||||||||||||||
Engineered Components |
ACTIVE DELAY LINE |
OTHER |
PIN/PEG |
8 |
QIP |
RECTANGULAR |
UNSPECIFIED |
12 ns |
NO |
2 |
1 |
ECL |
NO |
-4.5 |
-4.5 |
IN-LINE |
DIP12,.7 |
Delay Lines |
2.54 mm |
85 Cel |
OPEN-EMITTER |
0 Cel |
DUAL |
R-XDIP-P8 |
-4.725 V |
8.255 mm |
17.78 mm |
Not Qualified |
COMPLEMENTARY |
-4.275 V |
BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED |
22.225 mm |
100K |
||||||||||||||
Pca Electronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
NO |
1 |
10 |
TTL |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
3 |
5.25 V |
6.35 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
150 mA |
MAX RISE TIME CAPTURED |
e0 |
225 |
8301 |
20 MHz |
||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
1023 |
50 ohm |
YES |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
75 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
1600 MHz |
||||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
1023 |
50 ohm |
YES |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
75 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N24 |
2 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
1600 MHz |
|||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
60 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
6.98 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
20.32 mm |
|||||||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
170 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
7 mm |
100E |
||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
YES |
TRAY |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
2 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e4 |
7 mm |
100E |
||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
C BEND |
8 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
5 ns |
YES |
1 |
5 |
NO |
5 |
5 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XDSO-C8 |
5.25 V |
4.545 mm |
12.19 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
12.95 mm |
602 |
||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
C BEND |
8 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
8 ns |
YES |
1 |
5 |
NO |
5 |
5 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XDSO-C8 |
5.25 V |
4.545 mm |
12.19 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
12.95 mm |
602 |
||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
5 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
8 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
|||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
6 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
8 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
|||||||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.4 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
|
Texas Instruments |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
95 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP16,.25 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
LS |
||||||||||
|
Texas Instruments |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
95 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP16,.25 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
LS |
||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
TRAY |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V |
e4 |
260 |
7 mm |
100E |
||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
TR |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
2 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V |
e4 |
7 mm |
100E |
|||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
CMOS |
YES |
TUBE |
2.5 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE |
e4 |
40 |
260 |
5 mm |
1500 MHz |
||||||||||||
Princeton Advanced Components |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
75 ns |
NO |
1 |
5 |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
5.25 V |
7.493 mm |
10.16 mm |
TRUE |
4.75 V |
20.32 mm |
4140 |
|||||||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
5 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
6.98 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
20.32 mm |
|||||||||||||||||
|
Ttm Technologies |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
4 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
YES |
TR |
MICROELECTRONIC ASSEMBLY |
140 Cel |
-55 Cel |
TIN |
QUAD |
R-XQMA-N4 |
2 |
2.61 mm |
5.08 mm |
30 |
260 |
10.16 mm |
||||||||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
200 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
6.98 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
20.32 mm |
|||||||||||||||||
Allen Avionics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
4 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
200 ns |
NO |
1 |
1 |
NO |
5 |
5 |
IN-LINE |
DIP4/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T4 |
5.25 V |
Not Qualified |
TRUE |
4.75 V |
60 mA |
||||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
4 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
6.98 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
20.32 mm |
|||||||||||||||||
|
Texas Instruments |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
95 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP16,.25 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
e4 |
30 |
260 |
9.9 mm |
LS |
|||||||
|
Texas Instruments |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
95 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP16,.25 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
e4 |
30 |
260 |
9.9 mm |
LS |
|||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
105 ns |
NO |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
105 ns |
YES |
1 |
0 |
TTL |
38535Q/M;38534H;883B |
NO |
5 |
5 |
15 pF |
CHIP CARRIER |
LCC20,.35SQ |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
105 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
CHIP CARRIER |
LCC20,.35SQ |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
TRUE |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
LS |
A delay line is an electronic component used in digital systems to introduce a delay or a time lag in a signal. Delay lines are commonly used in digital systems that require precise timing, synchronization, or control of signals.
Delay lines can be passive or active, depending on the method used to introduce the delay in the signal. Passive delay lines use passive components, such as capacitors, inductors, and resistors, to introduce the delay in the signal. Active delay lines use active components, such as amplifiers, to introduce the delay in the signal.
Delay lines can also be fixed or variable, depending on whether the delay introduced in the signal is fixed or can be adjusted. Fixed delay lines introduce a fixed delay in the signal, while variable delay lines can be adjusted to introduce a variable delay in the signal.
Delay lines are often used in digital systems that require precise timing or synchronization between different components or devices. For example, in a memory system, a delay line may be used to ensure that the signals sent to and received from the memory chips are synchronized and aligned with the clock signal.
Delay lines can also be used to compensate for signal propagation delays caused by long transmission lines or cables. In this case, the delay line is used to introduce a delay in the signal to compensate for the delay caused by the transmission line or cable.