Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Nominal Total Delay (td) | Surface Mount | No. of Functions | No. of Taps/Steps | Technology | Screening Level | Nominal Output Impedance (Z0) | Programmable Delay Line | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family | Maximum Input Frequency (fmax) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
6 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS/TTL |
83.3333 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
255 |
CMOS |
YES |
5 |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T16 |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.175 mm |
1000 |
|||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
GWDIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS |
22.2222 MHz |
||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
4 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
45 mA |
e0 |
19.05 mm |
CMOS |
|||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
e0 |
19.05 mm |
CMOS |
||||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
NO |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
9.375 mm |
|||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
20 ns |
NO |
4 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
45 mA |
e0 |
19.05 mm |
CMOS |
|||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
200 ns |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
75 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS/TTL |
3.125 MHz |
|||||||||||
Maxim Integrated |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T8 |
Not Qualified |
75 mA |
e0 |
|||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
GWDIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS |
13.3333 MHz |
|||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
NO |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
9.375 mm |
|||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
GWDIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS |
13.3333 MHz |
|||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
12 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
GWDIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS |
27.7778 MHz |
|||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS |
||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
69 ns |
NO |
2 |
15 |
CMOS |
YES |
5 |
5 |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
35 mA |
TWO INDEPENDENTLY PROGRAMMABLE OUTPUTS FROM A SINGLE INPUT |
e0 |
19.175 mm |
CMOS/TTL |
3.62319 MHz |
|||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
450 ns |
NO |
1 |
10 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
1010 |
1.38889 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
30 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS |
||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
80 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS/TTL |
4.16667 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
14 ns |
NO |
4 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS/TTL |
35.7143 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
268 ns |
NO |
1 |
255 |
CMOS |
YES |
5 |
5 |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
60 mA |
e0 |
19.175 mm |
CMOS/TTL |
25 MHz |
|||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
75 mA |
INPUT TO 1ST TAP DELAY = 5NS |
e0 |
245 |
9.375 mm |
CMOS |
25 MHz |
|||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
20 ns |
NO |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
3.6 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
2.7 V |
e0 |
9.375 mm |
|||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
9.375 mm |
1000 |
||||||||||||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e3 |
30 |
260 |
9.375 mm |
CMOS |
3.33333 MHz |
|||||||||||
Maxim Integrated |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T14 |
Not Qualified |
75 mA |
e0 |
20 |
240 |
|||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
48.25 ns |
NO |
1 |
255 |
CMOS |
YES |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
PROGRAMMABLE USING 3-WIRE SERIAL PORT OR 8-BIT PARALLEL PORT; ENABLE |
e0 |
19.175 mm |
CMOS/TTL |
6.90846 MHz |
|||||||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
125 ns |
NO |
1 |
5 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e3 |
30 |
260 |
19.05 mm |
1005 |
5 MHz |
|||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
8 ns |
NO |
3 |
1 |
50 ohm |
NO |
5 |
5 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
35 mA |
e0 |
9.375 mm |
1135 |
||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
NO |
1 |
10 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
1010 |
3.57143 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T14 |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.05 mm |
1000 |
|||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
30 ns |
NO |
3 |
1 |
CMOS |
NO |
3.3 |
3.3 |
IN-LINE |
DIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
3.6 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
2.7 V |
25 mA |
e0 |
9.375 mm |
1000 |
|||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.375 mm |
CMOS |
||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
75 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
245 |
19.05 mm |
CMOS |
4.44444 MHz |
|||||||||||||
Maxim Integrated |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T14 |
Not Qualified |
75 mA |
e0 |
|||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
35 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
e0 |
19.05 mm |
CMOS |
||||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
80 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e3 |
9.375 mm |
CMOS |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
GWDIP8,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
9.375 mm |
CMOS |
3.33333 MHz |
|||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
NO |
1 |
10 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
75 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
1010 |
1.25 MHz |
||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
18 ns |
NO |
4 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS/TTL |
27.7778 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
73.75 ns |
NO |
1 |
255 |
CMOS |
YES |
5 |
5 |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
PROGRAMMABLE USING 3-WIRE SERIAL PORT OR 8-BIT PARALLEL PORT |
e0 |
19.175 mm |
CMOS |
6.77966 MHz |
||||||||||
Maxim Integrated |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
NO |
1 |
5 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T14 |
Not Qualified |
75 mA |
e0 |
20 |
240 |
|||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
16 ns |
NO |
7 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
'7 INDEPENDENT BUFFERED DELAYS WITH DELAY[NS] = 4,6,8,10,12,14,16' |
e0 |
19.175 mm |
CMOS/TTL |
20.8333 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
40 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS/TTL |
8.33333 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
75 ns |
NO |
1 |
10 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS/TTL |
8.33333 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
300 ns |
NO |
1 |
10 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
1010 |
2.08333 MHz |
|||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T14 |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.05 mm |
1000 |
|||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
150 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
CMOS |
2.22222 MHz |
||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
40 ns |
NO |
3 |
1 |
CMOS |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e3 |
30 |
260 |
9.375 mm |
CMOS |
A delay line is an electronic component used in digital systems to introduce a delay or a time lag in a signal. Delay lines are commonly used in digital systems that require precise timing, synchronization, or control of signals.
Delay lines can be passive or active, depending on the method used to introduce the delay in the signal. Passive delay lines use passive components, such as capacitors, inductors, and resistors, to introduce the delay in the signal. Active delay lines use active components, such as amplifiers, to introduce the delay in the signal.
Delay lines can also be fixed or variable, depending on whether the delay introduced in the signal is fixed or can be adjusted. Fixed delay lines introduce a fixed delay in the signal, while variable delay lines can be adjusted to introduce a variable delay in the signal.
Delay lines are often used in digital systems that require precise timing or synchronization between different components or devices. For example, in a memory system, a delay line may be used to ensure that the signals sent to and received from the memory chips are synchronized and aligned with the clock signal.
Delay lines can also be used to compensate for signal propagation delays caused by long transmission lines or cables. In this case, the delay line is used to introduce a delay in the signal to compensate for the delay caused by the transmission line or cable.