Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Nominal Total Delay (td) | Surface Mount | No. of Functions | No. of Taps/Steps | Technology | Screening Level | Nominal Output Impedance (Z0) | Programmable Delay Line | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family | Maximum Input Frequency (fmax) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
+-3.3 |
FLATPACK |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
7 mm |
100E |
|||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
50 ohm |
YES |
TUBE |
2.5 |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
4 mm |
89297 |
||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
10 mA |
e0 |
3 mm |
1100 |
|||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
10 mA |
e0 |
3 mm |
1100 |
|||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
16.6 ns |
YES |
2 |
511 |
ECL |
50 ohm |
YES |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
3.6 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
215 mA |
e3 |
30 |
260 |
4 mm |
6L |
20 MHz |
|||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e0 |
3 mm |
1100 |
||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
18.2 ns |
YES |
2 |
511 |
ECL |
YES |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
3.6 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
170 mA |
e3 |
30 |
260 |
4 mm |
6L |
20 MHz |
||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
3 mm |
1100 |
|||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
1100 |
||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
170 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
50 ohm |
YES |
TR |
2.5 |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
4 mm |
89297 |
||||||||||||||
|
Analog Devices |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
255 |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
e3 |
30 |
260 |
3 mm |
1124 |
|||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V |
e3 |
30 |
260 |
7 mm |
100E |
||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
30 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
10 mA |
e0 |
3 mm |
1100 |
|||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
30 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Analog Devices |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
255 |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
e3 |
30 |
260 |
3 mm |
1124 |
|||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
YES |
TUBE |
2.5 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE |
e4 |
40 |
260 |
5 mm |
CMOS |
1500 MHz |
||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
20 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
10 mA |
e0 |
245 |
3 mm |
1100 |
||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
20 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
1023 |
50 ohm |
YES |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
75 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
1600 MHz |
||||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
1023 |
50 ohm |
YES |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
75 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N24 |
2 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
1600 MHz |
|||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
170 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
7 mm |
100E |
||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
YES |
TRAY |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
2 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e4 |
7 mm |
100E |
||||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.4 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
TRAY |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V |
e4 |
260 |
7 mm |
100E |
||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
TR |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
2 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V |
e4 |
7 mm |
100E |
|||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
CMOS |
YES |
TUBE |
2.5 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE |
e4 |
40 |
260 |
5 mm |
1500 MHz |
||||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
105 ns |
YES |
1 |
0 |
TTL |
38535Q/M;38534H;883B |
NO |
5 |
5 |
15 pF |
CHIP CARRIER |
LCC20,.35SQ |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
105 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
CHIP CARRIER |
LCC20,.35SQ |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
TRUE |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
LS |
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Texas Instruments |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
6 |
1 |
TTL |
NO |
5 |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
20 mA |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
6 |
1 |
TTL |
NO |
5 |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
Not Qualified |
20 mA |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
Analog Devices |
ACTIVE DELAY LINE |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
44.5 ns |
YES |
1 |
0 |
ECL |
50 ohm |
YES |
5.2 |
5.2 |
CHIP CARRIER |
LDCC44,.7SQ |
Delay Lines |
1.27 mm |
70 Cel |
OPEN-EMITTER |
-55 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.585 mm |
Not Qualified |
COMPLEMENTARY |
290 mA |
e0 |
16.585 mm |
53020 |
|||||||||||||
Analog Devices |
ACTIVE DELAY LINE |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
44.5 ns |
YES |
1 |
0 |
ECL |
50 ohm |
CHIP CARRIER |
1.27 mm |
70 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.585 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
16.585 mm |
|||||||||||||||||||||
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
60 ns |
YES |
1 |
5 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
e0 |
3 mm |
1000 |
||||||||||||
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
75 ns |
YES |
1 |
5 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
70 mA |
e0 |
3 mm |
1000 |
||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
3 mm |
1100 |
||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
200 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
3 mm |
1100 |
||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
300 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
5.25 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
3 mm |
1100 |
||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
30 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
25 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
200 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
3 mm |
1100 |
|||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
250 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
25 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
A delay line is an electronic component used in digital systems to introduce a delay or a time lag in a signal. Delay lines are commonly used in digital systems that require precise timing, synchronization, or control of signals.
Delay lines can be passive or active, depending on the method used to introduce the delay in the signal. Passive delay lines use passive components, such as capacitors, inductors, and resistors, to introduce the delay in the signal. Active delay lines use active components, such as amplifiers, to introduce the delay in the signal.
Delay lines can also be fixed or variable, depending on whether the delay introduced in the signal is fixed or can be adjusted. Fixed delay lines introduce a fixed delay in the signal, while variable delay lines can be adjusted to introduce a variable delay in the signal.
Delay lines are often used in digital systems that require precise timing or synchronization between different components or devices. For example, in a memory system, a delay line may be used to ensure that the signals sent to and received from the memory chips are synchronized and aligned with the clock signal.
Delay lines can also be used to compensate for signal propagation delays caused by long transmission lines or cables. In this case, the delay line is used to introduce a delay in the signal to compensate for the delay caused by the transmission line or cable.