Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Nominal Total Delay (td) | Surface Mount | No. of Functions | No. of Taps/Steps | Technology | Screening Level | Nominal Output Impedance (Z0) | Programmable Delay Line | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family | Maximum Input Frequency (fmax) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
SILICON DELAY LINE |
MILITARY |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
YES |
TR |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1 mm |
1.625 mm |
TRUE |
2.25 V |
e3 |
30 |
260 |
2.9 mm |
6994 |
|||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
800 ns |
NO |
1 |
20 |
500 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Pca Electronics |
ACTIVE DELAY LINE |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
YES |
1 |
5 |
TTL |
NO |
5 |
5 |
SMALL OUTLINE |
GWDIP8,.4 |
Delay Lines |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3 |
5.25 V |
6.35 mm |
Not Qualified |
TRUE |
4.75 V |
75 mA |
MAX RISE TIME CAPTURED |
e0 |
225 |
1140 |
5.71429 MHz |
|||||||||||
|
Pca Electronics |
ACTIVE DELAY LINE |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
YES |
1 |
5 |
TTL |
NO |
5 |
SMALL OUTLINE |
2.54 mm |
125 Cel |
-55 Cel |
MATTE TIN OVER NICKEL |
DUAL |
R-PDSO-G8 |
5.25 V |
6.35 mm |
Not Qualified |
TRUE |
4.75 V |
MAX RISE TIME CAPTURED |
e3 |
1140 |
|||||||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
MILITARY |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
YES |
TR |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1 mm |
1.625 mm |
TRUE |
2.25 V |
e3 |
30 |
260 |
2.9 mm |
6994 |
|||||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
MILITARY |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
YES |
TR |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1 mm |
1.625 mm |
TRUE |
2.25 V |
e3 |
30 |
260 |
2.9 mm |
6994 |
|||||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
MILITARY |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
YES |
TR |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1 mm |
1.625 mm |
TRUE |
2.25 V |
e3 |
30 |
260 |
2.9 mm |
6994 |
|||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
NO |
1 |
20 |
100 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
600 ns |
NO |
1 |
20 |
100 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
120 ns |
NO |
1 |
10 |
100 ohm |
NO |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T14 |
Not Qualified |
TRUE |
MEETS MIL-D-23859/23; MAX DISTORTION 10%; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
MILITARY |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
YES |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1 mm |
1.625 mm |
TRUE |
2.25 V |
e3 |
30 |
260 |
2.9 mm |
6994 |
||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
200 ns |
NO |
1 |
20 |
200 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
400 ns |
NO |
1 |
20 |
100 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
|
Analog Devices |
MILITARY |
GULL WING |
6 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
CMOS |
YES |
2.5/5 |
SMALL OUTLINE, THIN PROFILE |
TSOP6,.11,37 |
Delay Lines |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
COMPLEMENTARY |
.2 mA |
e3 |
30 |
260 |
||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
750 ns |
NO |
1 |
20 |
500 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
600 ns |
NO |
1 |
20 |
200 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
200 ns |
NO |
1 |
20 |
500 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
400 ns |
NO |
1 |
20 |
200 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
|
Ttm Technologies |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
4 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
YES |
TR |
MICROELECTRONIC ASSEMBLY |
140 Cel |
-55 Cel |
TIN |
QUAD |
R-XQMA-N4 |
2 |
2.61 mm |
5.08 mm |
30 |
260 |
10.16 mm |
||||||||||||||||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
105 ns |
NO |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
105 ns |
YES |
1 |
0 |
TTL |
38535Q/M;38534H;883B |
NO |
5 |
5 |
15 pF |
CHIP CARRIER |
LCC20,.35SQ |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
105 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
CHIP CARRIER |
LCC20,.35SQ |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
2.03 mm |
8.89 mm |
Not Qualified |
TRUE |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
105 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
FLATPACK |
FL16,.3 |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
2.03 mm |
6.755 mm |
Not Qualified |
TRUE |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
9.79 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
105 ns |
YES |
1 |
0 |
TTL |
38535Q/M;38534H;883B |
NO |
5 |
5 |
15 pF |
FLATPACK |
FL16,.3 |
Delay Lines |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
2.03 mm |
6.755 mm |
Not Qualified |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
9.79 mm |
LS |
|||||||||||
Texas Instruments |
ACTIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
105 ns |
NO |
1 |
0 |
TTL |
38535Q/M;38534H;883B |
NO |
5 |
5 |
15 pF |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
LS |
|||||||||||
Analog Devices |
SILICON DELAY LINE |
MILITARY |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
YES |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
5.5 V |
1 mm |
1.625 mm |
TRUE |
2.25 V |
e0 |
2.9 mm |
6994 |
A delay line is an electronic component used in digital systems to introduce a delay or a time lag in a signal. Delay lines are commonly used in digital systems that require precise timing, synchronization, or control of signals.
Delay lines can be passive or active, depending on the method used to introduce the delay in the signal. Passive delay lines use passive components, such as capacitors, inductors, and resistors, to introduce the delay in the signal. Active delay lines use active components, such as amplifiers, to introduce the delay in the signal.
Delay lines can also be fixed or variable, depending on whether the delay introduced in the signal is fixed or can be adjusted. Fixed delay lines introduce a fixed delay in the signal, while variable delay lines can be adjusted to introduce a variable delay in the signal.
Delay lines are often used in digital systems that require precise timing or synchronization between different components or devices. For example, in a memory system, a delay line may be used to ensure that the signals sent to and received from the memory chips are synchronized and aligned with the clock signal.
Delay lines can also be used to compensate for signal propagation delays caused by long transmission lines or cables. In this case, the delay line is used to introduce a delay in the signal to compensate for the delay caused by the transmission line or cable.