Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Nominal Total Delay (td) | Surface Mount | No. of Functions | No. of Taps/Steps | Technology | Screening Level | Nominal Output Impedance (Z0) | Programmable Delay Line | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family | Maximum Input Frequency (fmax) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
750 ns |
NO |
1 |
20 |
500 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
4 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
8 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
|||||||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
600 ns |
NO |
1 |
20 |
200 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Engineered Components |
ACTIVE DELAY LINE |
OTHER |
PIN/PEG |
8 |
QIP |
RECTANGULAR |
UNSPECIFIED |
12 ns |
NO |
2 |
1 |
ECL |
NO |
-4.5 |
-4.5 |
IN-LINE |
DIP12,.7 |
Delay Lines |
2.54 mm |
85 Cel |
OPEN-EMITTER |
0 Cel |
DUAL |
R-XDIP-P8 |
-4.725 V |
8.255 mm |
17.78 mm |
Not Qualified |
COMPLEMENTARY |
-4.275 V |
BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED |
22.225 mm |
100K |
||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
20 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
10 mA |
e0 |
245 |
3 mm |
1100 |
||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
20 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
3 V |
e3 |
30 |
260 |
3 mm |
1100 |
|||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
10 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.75 V |
150 mA |
e0 |
5 mm |
|||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
10 |
CMOS |
NO |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.75 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
10 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Delay Lines |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.75 V |
150 mA |
e0 |
5 mm |
|||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
10 |
CMOS |
NO |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
5.25 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4.75 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
Pca Electronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
NO |
1 |
10 |
TTL |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
3 |
5.25 V |
6.35 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
150 mA |
MAX RISE TIME CAPTURED |
e0 |
225 |
8301 |
20 MHz |
||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
1023 |
50 ohm |
YES |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
75 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N24 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
1600 MHz |
||||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
1023 |
50 ohm |
YES |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
75 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N24 |
2 |
2.625 V |
.9 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
1600 MHz |
|||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
1038 ns |
NO |
1 |
255 |
CMOS |
YES |
5 |
5 |
IN-LINE |
DIP16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
60 mA |
e0 |
245 |
19.175 mm |
CMOS/TTL |
10 MHz |
||||||||||
|
Analog Devices |
SILICON DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
76 ns |
YES |
1 |
255 |
CMOS |
YES |
5 |
5 |
SMALL OUTLINE |
SOP16,.3 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.75 V |
60 mA |
e3 |
30 |
260 |
10.3 mm |
25 MHz |
|||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
76 ns |
YES |
1 |
255 |
CMOS |
YES |
5 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.75 V |
e0 |
10.3 mm |
25 MHz |
||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e0 |
20 |
240 |
4.9 mm |
1100 |
|||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
4.9 mm |
1100 |
||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
200 ns |
NO |
1 |
20 |
500 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e0 |
4.9 mm |
1100 |
|||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
4.9 mm |
1100 |
||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
60 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
6.98 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
20.32 mm |
|||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
175 ns |
NO |
1 |
10 |
CMOS |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
1 |
5.25 V |
4.572 mm |
7.62 mm |
Not Qualified |
TRUE |
4.75 V |
75 mA |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
e0 |
19.05 mm |
1010 |
3.57143 MHz |
||||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
5 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e0 |
20 |
240 |
4.9 mm |
1100 |
||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
500 ns |
YES |
1 |
5 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
4.9 mm |
1100 |
|||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
-4.5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Delay Lines |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
2 |
3.6 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
170 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
7 mm |
100E |
||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
YES |
TRAY |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
2 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e4 |
7 mm |
100E |
||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
C BEND |
8 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
5 ns |
YES |
1 |
5 |
NO |
5 |
5 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XDSO-C8 |
5.25 V |
4.545 mm |
12.19 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
12.95 mm |
602 |
||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
C BEND |
8 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
8 ns |
YES |
1 |
5 |
NO |
5 |
5 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XDSO-C8 |
5.25 V |
4.545 mm |
12.19 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
12.95 mm |
602 |
||||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
5 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
8 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
|||||||||||||||||
Datatronics |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
6 ns |
NO |
1 |
5 |
NO |
5 |
5 |
IN-LINE |
DIP8/16,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
5.25 V |
8 mm |
10.16 mm |
Not Qualified |
INVERTED |
4.75 V |
32 mA |
22.86 mm |
|||||||||||||||||
Kappa Networks |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 |
HYBRID |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T14 |
Not Qualified |
75 mA |
e0 |
||||||||||||||||||||||
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
73.75 ns |
YES |
1 |
255 |
CMOS |
YES |
5 |
5 |
SMALL OUTLINE |
SOP16,.4 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
PROGRAMMABLE USING 3-WIRE SERIAL PORT OR 8-BIT PARALLEL PORT |
e0 |
10.3 mm |
CMOS/TTL |
6.77966 MHz |
||||||||||
|
Maxim Integrated |
SILICON DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
73.75 ns |
YES |
1 |
255 |
CMOS |
YES |
5 |
5 |
SMALL OUTLINE |
SOP16,.4 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.75 V |
30 mA |
PROGRAMMABLE USING 3-WIRE SERIAL PORT OR 8-BIT PARALLEL PORT |
e3 |
30 |
260 |
10.3 mm |
CMOS/TTL |
6.77966 MHz |
|||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e0 |
20 |
240 |
4.9 mm |
1100 |
|||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
50 ns |
YES |
1 |
5 |
CMOS |
50 ohm |
NO |
5 |
5 |
SMALL OUTLINE |
SOP8,.25 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
50 mA |
e3 |
30 |
260 |
4.9 mm |
1100 |
||||||||
Maxim Integrated |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
10 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE |
SOP16,.4 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.75 V |
150 mA |
e0 |
10.3 mm |
|||||||||||||
|
Analog Devices |
SILICON DELAY LINE |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
100 ns |
YES |
1 |
10 |
CMOS |
NO |
5 |
5 |
SMALL OUTLINE |
SOP16,.4 |
Delay Lines |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4.75 V |
150 mA |
e3 |
30 |
260 |
10.3 mm |
||||||||||
Kappa Networks |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
10 |
HYBRID |
NO |
5 |
5 |
IN-LINE |
DIP14,.3 |
Delay Lines |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T14 |
Not Qualified |
150 mA |
e0 |
||||||||||||||||||||||
|
Onsemi |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
12.4 ns |
YES |
1 |
1023 |
ECL |
YES |
3.3 |
+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Delay Lines |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
175 mA |
NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V |
e3 |
30 |
260 |
5 mm |
100E |
||||||||
|
Texas Instruments |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
95 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP16,.25 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
LS |
||||||||||
|
Texas Instruments |
ACTIVE DELAY LINE |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
95 ns |
YES |
1 |
0 |
TTL |
NO |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP16,.25 |
Delay Lines |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.75 V |
20 mA |
INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
LS |
||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
TRAY |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V |
e4 |
260 |
7 mm |
100E |
||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
12.2 ns |
YES |
1 |
1023 |
ECL |
YES |
TR |
3.3 |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
2 |
5.5 V |
1.2 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V |
e4 |
7 mm |
100E |
|||||||||||||
|
Microchip Technology |
ACTIVE DELAY LINE |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1023 |
CMOS |
YES |
TUBE |
2.5 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE |
e4 |
40 |
260 |
5 mm |
1500 MHz |
||||||||||||
Esc Electronics |
PASSIVE DELAY LINE |
MILITARY |
THROUGH-HOLE |
24 |
RECTANGULAR |
PLASTIC/EPOXY |
400 ns |
NO |
1 |
20 |
200 ohm |
NO |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
TRUE |
MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX RISE TIME & TEMP. COEFF. CAPTURED |
|||||||||||||||||||||||||||
Princeton Advanced Components |
ACTIVE DELAY LINE |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
75 ns |
NO |
1 |
5 |
NO |
5 |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
5.25 V |
7.493 mm |
10.16 mm |
TRUE |
4.75 V |
20.32 mm |
4140 |
A delay line is an electronic component used in digital systems to introduce a delay or a time lag in a signal. Delay lines are commonly used in digital systems that require precise timing, synchronization, or control of signals.
Delay lines can be passive or active, depending on the method used to introduce the delay in the signal. Passive delay lines use passive components, such as capacitors, inductors, and resistors, to introduce the delay in the signal. Active delay lines use active components, such as amplifiers, to introduce the delay in the signal.
Delay lines can also be fixed or variable, depending on whether the delay introduced in the signal is fixed or can be adjusted. Fixed delay lines introduce a fixed delay in the signal, while variable delay lines can be adjusted to introduce a variable delay in the signal.
Delay lines are often used in digital systems that require precise timing or synchronization between different components or devices. For example, in a memory system, a delay line may be used to ensure that the signals sent to and received from the memory chips are synchronized and aligned with the clock signal.
Delay lines can also be used to compensate for signal propagation delays caused by long transmission lines or cables. In this case, the delay line is used to introduce a delay in the signal to compensate for the delay caused by the transmission line or cable.