| Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
24000000 Hz |
CMOS |
8 |
TR |
4.5 |
2/6 |
FLATPACK |
FL16,.3 |
225 ns |
Shift Registers |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
TIN LEAD |
DUAL |
28 MHz |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
9.94 mm |
HC/UH |
|||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
RIGHT |
-55 Cel |
DUAL |
R-CDFP-F16 |
15 V |
2.38 mm |
6.91 mm |
3 V |
9.94 mm |
HC |
||||||||||||||||||||||||
|
STMicroelectronics |
SERIAL IN SERIAL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
5 |
5 |
3/18 |
FLATPACK |
FL14,.3 |
Shift Register |
1.27 mm |
125 Cel |
RIGHT |
NEGATIVE EDGE |
-55 Cel |
DUAL |
R-CDFP-F14 |
18 V |
6.9 mm |
Not Qualified |
TRUE |
3 V |
9.95 mm |
4000/14000/40000 |
||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
20 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
70000000 Hz |
CMOS |
MIL-PRF-38535 Class V |
8 |
3 |
3.3/5 |
FLATPACK |
FL20,.3 |
26.5 ns |
Shift Registers |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-55 Cel |
Gold (Au) |
DUAL |
90 MHz |
R-XDFP-F20 |
6 V |
2.16 mm |
7.115 mm |
Not Qualified |
TRUE |
2 V |
e4 |
12.955 mm |
AC |
||||||||||||
|
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
4 |
5 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
RIGHT |
-55 Cel |
DUAL |
R-CDFP-F16 |
15 V |
2.38 mm |
6.91 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.94 mm |
HC |
|||||||||||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
RIGHT |
-55 Cel |
DUAL |
R-CDFP-F16 |
15 V |
2.38 mm |
6.91 mm |
3 V |
9.94 mm |
HC |
||||||||||||||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
20000000 Hz |
CMOS |
8 |
4.5 |
2/6 |
FLATPACK |
FL16,.25 |
285 ns |
Shift Registers |
1.27 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-55 Cel |
TIN LEAD |
DUAL |
24 MHz |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
Not Qualified |
TRUE |
2 V |
e0 |
9.94 mm |
HC/UH |
|||||||||||||
|
|
STMicroelectronics |
PARALLEL IN SERIAL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
RIGHT |
-55 Cel |
DUAL |
R-CDFP-F16 |
15 V |
2.38 mm |
6.91 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.94 mm |
HC |
|||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
4.5 |
FLATPACK |
225 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
25 MHz |
R-CDFP-F16 |
6 V |
Not Qualified |
COMPLEMENTARY |
2 V |
HC/UH |
||||||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
21000000 Hz |
CMOS |
MIL-PRF-38535 Class V |
8 |
4.5 |
2/6 |
FLATPACK |
FL16,.25 |
225 ns |
Shift Registers |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
GOLD |
DUAL |
25 MHz |
R-CDFP-F16 |
6 V |
Not Qualified |
COMPLEMENTARY |
2 V |
e4 |
HC/UH |
||||||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
RIGHT |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
2 V |
9.94 mm |
HC |
||||||||||||||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
4.5 |
FLATPACK |
265 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
R-CDFP-F14 |
6 V |
Not Qualified |
TRUE |
2 V |
HC/UH |
|||||||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
20 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
3 |
FLATPACK |
26.5 ns |
125 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-55 Cel |
DUAL |
90 MHz |
R-GDFP-F20 |
6 V |
Not Qualified |
TRUE |
2 V |
AC |
||||||||||||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
4.5 |
FLATPACK |
265 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
R-CDFP-F14 |
6 V |
Not Qualified |
TRUE |
2 V |
HC/UH |
|||||||||||||||||||||||||
|
STMicroelectronics |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
20 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
70000000 Hz |
CMOS |
MIL-PRF-38535 Class V |
8 |
3 |
3.3/5 |
FLATPACK |
FL20,.3 |
26.5 ns |
Shift Registers |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-55 Cel |
Gold (Au) |
DUAL |
90 MHz |
R-GDFP-F20 |
6 V |
Not Qualified |
TRUE |
2 V |
e4 |
AC |
|||||||||||||||
|
STMicroelectronics |
SERIAL IN PARALLEL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
RIGHT |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
2 V |
9.94 mm |
HC |
||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
13 ns |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
70 MHz |
R-CDFP-F24 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
110 mA |
HOLD MODE; EXTERNAL CLOCK GATED WITH MODE CONTROL AND USED AS SHIFT CLOCK |
F/FAST |
|||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
20 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
11.5 ns |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-55 Cel |
DUAL |
85 MHz |
R-CDFP-F20 |
5.5 V |
2.54 mm |
6.9215 mm |
Not Qualified |
TRUE |
4.5 V |
85 mA |
HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL |
13.716 mm |
F/FAST |
||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
4 |
5 |
50 pF |
FLATPACK |
8.5 ns |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
90 MHz |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
46 mA |
HOLD MODE |
F/FAST |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
13 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
80 MHz |
R-CDFP-F14 |
5.5 V |
2.159 mm |
6.2865 mm |
Not Qualified |
TRUE |
4.5 V |
50 mA |
9.906 mm |
F/FAST |
||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
10000000 Hz |
TTL |
8 |
5 |
5 |
15 pF |
FLATPACK |
FL14,.3 |
40 ns |
Shift Registers |
1.27 mm |
125 Cel |
RIGHT |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
18 MHz |
R-CDFP-F14 |
Not Qualified |
COMPLEMENTARY |
50 mA |
e0 |
TTL/H/L |
||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
MIL-PRF-38535 |
8 |
5 |
FLATPACK |
13 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
TIN LEAD |
DUAL |
80 MHz |
R-GDFP-F14 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
e0 |
F/FAST |
|||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
20 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
11.5 ns |
125 Cel |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
-55 Cel |
DUAL |
85 MHz |
R-CDFP-F20 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
85 mA |
HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL |
F/FAST |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
MIL-STD-883 |
8 |
5 |
FLATPACK |
15 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
R-GDFP-F14 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
ALS |
||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
MIL-STD-883 |
8 |
5 |
FLATPACK |
15 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
R-GDFP-F14 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
ALS |
||||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
13 ns |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
70 MHz |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
TRUE |
4.5 V |
110 mA |
HOLD MODE; EXTERNAL CLOCK GATED WITH MODE CONTROL AND USED AS SHIFT CLOCK |
16.256 mm |
F/FAST |
|||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
8 |
5 |
50 pF |
FLATPACK |
13 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
80 MHz |
R-CDFP-F14 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
50 mA |
F/FAST |
||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
8 |
5 |
FLATPACK |
9 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
60 MHz |
R-GDFP-F14 |
5.5 V |
2.032 mm |
6.2865 mm |
Not Qualified |
TRUE |
4.5 V |
F/FAST |
|||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TTL |
4 |
5 |
50 pF |
FLATPACK |
8.5 ns |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
90 MHz |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
TRUE |
4.5 V |
46 mA |
HOLD MODE |
11.176 mm |
F/FAST |
|||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
4 |
5 |
FLATPACK |
26 ns |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
36 MHz |
R-GDFP-F16 |
5.5 V |
2.03 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
HOLD MODE |
10.2 mm |
TTL/H/L |
|||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
4 |
5 |
FLATPACK |
26 ns |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
36 MHz |
R-GDFP-F16 |
5.5 V |
2.03 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
HOLD MODE |
10.2 mm |
TTL/H/L |
|||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
MIL-PRF-38535 Class B |
4 |
5 |
FLATPACK |
8.5 ns |
125 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-55 Cel |
DUAL |
80 MHz |
R-GDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
F/FAST |
|||||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
MIL-PRF-38535 Class B |
4 |
5 |
FLATPACK |
56 ns |
125 Cel |
RIGHT |
3-STATE |
NEGATIVE EDGE |
-55 Cel |
DUAL |
20 MHz |
R-GDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
LS |
||||||||||||||||||||||
|
Renesas Electronics |
PARALLEL IN PARALLEL OUT |
FLAT |
20 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
34 ns |
1.27 mm |
BIDIRECTIONAL |
3-STATE |
POSITIVE EDGE |
DUAL |
R-CDFP-F20 |
5.5 V |
2.92 mm |
6.92 mm |
Not Qualified |
TRUE |
4.5 V |
HCT |
||||||||||||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
4 |
5 |
FLATPACK |
432 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
8.5 MHz |
R-CDFP-F16 |
20 V |
Qualified |
TRUE |
3 V |
4000/14000/40000 |
||||||||||||||||||||||||
|
Renesas Electronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
5 |
5 |
FLATPACK |
FL16,.3 |
37 ns |
Shift Registers |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
20 MHz |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
HC/UH |
||||||||||||||
|
Renesas Electronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
FLATPACK |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
12 MHz |
R-CDFP-F16 |
2.92 mm |
6.73 mm |
Qualified |
TRUE |
4000/14000/40000 |
|||||||||||||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
MIL-PRF-38535 Class V |
4 |
5 |
FLATPACK |
432 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
GOLD |
DUAL |
8.5 MHz |
R-CDFP-F16 |
20 V |
2.92 mm |
6.73 mm |
Qualified |
TRUE |
3 V |
e4 |
4000/14000/40000 |
|||||||||||||||||
|
Renesas Electronics |
PARALLEL IN SERIAL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
35 ns |
1.27 mm |
RIGHT |
POSITIVE EDGE |
DUAL |
30 MHz |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
COMPLEMENTARY |
4.5 V |
HC/UH |
||||||||||||||||||||||||
|
Renesas Electronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
5 |
5 |
FLATPACK |
FL16,.3 |
41 ns |
Shift Registers |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
20 MHz |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
COMPLEMENTARY |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
HC/UH |
||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
40 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F14 |
5.5 V |
2.92 mm |
6.285 mm |
Qualified |
TRUE |
4.5 V |
e4 |
HCT |
||||||||||||||||||||
|
Renesas Electronics |
PARALLEL IN SERIAL OUT |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
32 ns |
1.27 mm |
RIGHT |
POSITIVE EDGE |
DUAL |
30 MHz |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
HC/UH |
||||||||||||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
32 ns |
1.27 mm |
RIGHT |
POSITIVE EDGE |
DUAL |
R-CDFP-F14 |
5.5 V |
2.92 mm |
6.285 mm |
Not Qualified |
TRUE |
4.5 V |
HC/UH |
|||||||||||||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
4 |
FLATPACK |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
12 MHz |
R-CDFP-F16 |
2.92 mm |
6.73 mm |
Qualified |
TRUE |
4000/14000/40000 |
|||||||||||||||||||||||||
|
Renesas Electronics |
PARALLEL IN SERIAL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
5 |
FLATPACK |
432 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
GOLD |
DUAL |
8.5 MHz |
R-CDFP-F16 |
18 V |
2.92 mm |
6.73 mm |
Qualified |
TRUE |
3 V |
e4 |
4000/14000/40000 |
|||||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
MIL-PRF-38535 Class V |
4 |
5 |
FLATPACK |
432 ns |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
GOLD |
DUAL |
8.5 MHz |
R-CDFP-F16 |
20 V |
Qualified |
TRUE |
3 V |
e4 |
4000/14000/40000 |
||||||||||||||||||||
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
37 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
DUAL |
R-CDFP-F14 |
5.5 V |
2.92 mm |
6.285 mm |
Qualified |
TRUE |
4.5 V |
HC/UH |
||||||||||||||||||||||
|
|
Renesas Electronics |
SERIAL IN PARALLEL OUT |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
5 |
FLATPACK |
37 ns |
1.27 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F14 |
5.5 V |
2.92 mm |
6.285 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
HC/UH |
Digital shift registers are electronic circuits that can store and shift data in a serial-in, serial-out (SISO) or parallel-in, serial-out (PISO) fashion. They are commonly used in digital systems for data storage, data transfer, and signal processing applications.
Shift registers can be designed using various types of flip-flops, such as D flip-flops, JK flip-flops, and T flip-flops. They can also be designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs).
Digital shift registers can be classified into various types based on their operation mode and the direction of data shift. The most common types of shift registers include:
1. Serial-in, serial-out (SISO) shift registers: These shift registers have one serial input and one serial output. They can shift data in one direction, either left or right, and can be used for data storage, delay generation, and signal processing applications.
2. Parallel-in, serial-out (PISO) shift registers: These shift registers have multiple parallel inputs and one serial output. They can shift data from multiple inputs to a single output in a serial fashion and can be used for data transfer and signal processing applications.
3. Serial-in, parallel-out (SIPO) shift registers: These shift registers have one serial input and multiple parallel outputs. They can shift data from a single input to multiple outputs in a parallel fashion and can be used for data storage and signal processing applications.
4. Parallel-in, parallel-out (PIPO) shift registers: These shift registers have multiple parallel inputs and multiple parallel outputs. They can shift data from multiple inputs to multiple outputs in a parallel fashion and can be used for data transfer and signal processing applications.
Digital shift registers are used in various applications, including serial-to-parallel conversion, parallel-to-serial conversion, data storage, data transfer, and signal processing. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.