| Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
SERIAL IN PARALLEL OUT |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
TR, 7 INCH |
2.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
25 ns |
12 Amp |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
65 MHz |
R-PQCC-N14 |
1 |
5.5 V |
.8 mm |
2.5 mm |
TRUE |
2 V |
.02 mA |
AND-GATED SERIAL INPUTS (A AND B) |
e4 |
260 |
3 mm |
LV/LV-A/LVX/H |
||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
MILITARY |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-55 Cel |
MATTE TIN |
QUAD |
R-XQCC-N16 |
1 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
e3 |
30 |
260 |
3.5 mm |
HC/UH |
|||||||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.795 ns |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
MATTE TIN |
QUAD |
2800 MHz |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V |
e3 |
30 |
260 |
5 mm |
100E |
|||||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.795 ns |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
2800 MHz |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V |
e3 |
30 |
260 |
5 mm |
100E |
|||||||||||||
|
|
Onsemi |
PARALLEL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3000000000 Hz |
ECL |
9 |
3.3 |
+-3.3/+-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.8 ns |
Shift Registers |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V; SIPO OPERATION ALSO AVAILABLE |
e3 |
30 |
260 |
5 mm |
10E |
||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
MILITARY |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
210 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-55 Cel |
MATTE TIN |
QUAD |
R-XQCC-N16 |
1 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
e3 |
30 |
260 |
3.5 mm |
HC/UH |
||||||||||||||
|
|
Onsemi |
PARALLEL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3000000000 Hz |
ECL |
9 |
3.3 |
+-3.3/+-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.8 ns |
Shift Registers |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V; SIPO OPERATION ALSO AVAILABLE |
e3 |
30 |
260 |
5 mm |
100E |
||||||||||
|
|
Onsemi |
PARALLEL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3000000000 Hz |
ECL |
9 |
3.3 |
+-3.3/+-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.8 ns |
Shift Registers |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V; SIPO OPERATION ALSO AVAILABLE |
e3 |
30 |
260 |
5 mm |
100E |
||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.795 ns |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
2800 MHz |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V |
e3 |
260 |
5 mm |
10E |
||||||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.795 ns |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
2800 MHz |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V |
e3 |
260 |
5 mm |
10E |
||||||||||||||
|
|
Onsemi |
PARALLEL IN PARALLEL OUT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3000000000 Hz |
ECL |
9 |
3.3 |
+-3.3/+-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.8 ns |
Shift Registers |
.5 mm |
85 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
TIN |
QUAD |
S-PQCC-N32 |
1 |
5.5 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V; SIPO OPERATION ALSO AVAILABLE |
e3 |
30 |
260 |
5 mm |
10E |
||||||||||
|
|
Onsemi |
PARALLEL IN SERIAL OUT |
MILITARY |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
20000000 Hz |
CMOS |
8 |
3 |
2/6 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
225 ns |
Shift Registers |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
MATTE TIN |
QUAD |
R-XQCC-N16 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e3 |
30 |
260 |
3.5 mm |
HC/UH |
|||||||||||
|
|
Onsemi |
SERIAL IN PARALLEL OUT |
MILITARY |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER |
210 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-55 Cel |
MATTE TIN |
QUAD |
R-XQCC-N16 |
1 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
e3 |
30 |
260 |
3.5 mm |
HC/UH |
|||||||||||||||
|
|
Onsemi |
PARALLEL IN SERIAL OUT |
MILITARY |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
20000000 Hz |
CMOS |
8 |
TR |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
225 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-55 Cel |
QUAD |
R-XQCC-N16 |
6 V |
1 mm |
2.5 mm |
COMPLEMENTARY |
2 V |
.16 mA |
3.5 mm |
HC/UH |
||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
49 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
30 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
1 V |
3 mm |
LV/LV-A/LVX/H |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
14 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
85 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3 mm |
AHCT/VHCT/VT |
||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
51 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
17 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
COMPLEMENTARY |
4.5 V |
CLOCK INHIBIT |
e4 |
3.5 mm |
HCT |
||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
OPEN-DRAIN |
POSITIVE EDGE |
-40 Cel |
QUAD |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
NPIC |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.5 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
85 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3 mm |
AHC/VHC/H/U/V |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
11 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
70 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
AHCT/VHCT/VT |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
54 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
18 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3 mm |
HCT |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
12 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
AHCT/VHCT/VT |
|||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
12 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
INVERTED |
4.5 V |
3.5 mm |
AHCT/VHCT/VT |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
49 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
30 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
1 V |
e4 |
3 mm |
LV/LV-A/LVX/H |
|||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
18.2 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
115 MHz |
R-PQCC-N16 |
3.6 V |
1 mm |
2.5 mm |
TRUE |
1.65 V |
3.5 mm |
LVC/LCX/Z |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.1 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
e4 |
3.5 mm |
AHC/VHC/H/U/V |
||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
12 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
AHCT/VHCT/VT |
|||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
15.1 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
70 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3.5 mm |
AHC/VHC/H/U/V |
||||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
250 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
24 MHz |
R-PQCC-N16 |
6 V |
1 mm |
2.5 mm |
COMPLEMENTARY |
2 V |
3.5 mm |
HC/UH |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
OPEN-DRAIN |
POSITIVE EDGE |
-40 Cel |
QUAD |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
NPIC |
||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
OPEN-DRAIN |
POSITIVE EDGE |
-40 Cel |
QUAD |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2.3 V |
3.5 mm |
NPIC |
||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
255 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
24 MHz |
R-PQCC-N14 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3 mm |
HC/UH |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
OPEN-DRAIN |
POSITIVE EDGE |
-40 Cel |
QUAD |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
NPIC |
||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.1 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3.5 mm |
AHC/VHC/H/U/V |
|||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
14 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
85 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3 mm |
AHCT/VHCT/VT |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
18.2 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
115 MHz |
R-PQCC-N16 |
3.6 V |
1 mm |
2.5 mm |
TRUE |
1.2 V |
e4 |
3.5 mm |
LVC/LCX/Z |
||||||||||||||||||
|
NXP Semiconductors |
PARALLEL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
51 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
17 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
COMPLEMENTARY |
4.5 V |
3.5 mm |
HCT |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
18.2 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
115 MHz |
R-PQCC-N16 |
3.6 V |
1 mm |
2.5 mm |
TRUE |
1.2 V |
3.5 mm |
LVC/LCX/Z |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
12 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
AHCT/VHCT/VT |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
240 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
24 MHz |
R-PQCC-N16 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3.5 mm |
HC/UH |
|||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
54 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
18 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3 mm |
HCT |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
265 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
24 MHz |
R-PQCC-N16 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
SERIAL STANDARD OUTPUT FOR CASCADING |
3.5 mm |
HC/UH |
|||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
15.1 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3.5 mm |
HC/UH |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
15.1 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3.5 mm |
HCT |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
OPEN-DRAIN |
POSITIVE EDGE |
-40 Cel |
QUAD |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3.5 mm |
NPIC |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.1 ns |
.5 mm |
125 Cel |
RIGHT |
3-STATE |
POSITIVE EDGE |
-40 Cel |
QUAD |
90 MHz |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
INVERTED |
2 V |
3.5 mm |
AHC/VHC/H/U/V |
||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN SERIAL OUT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
RIGHT |
OPEN-DRAIN |
POSITIVE EDGE |
-40 Cel |
QUAD |
R-PQCC-N16 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2.3 V |
3.5 mm |
NPIC |
|||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IN PARALLEL OUT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.5 ns |
.5 mm |
125 Cel |
RIGHT |
POSITIVE EDGE |
-40 Cel |
QUAD |
85 MHz |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3 mm |
AHC/VHC/H/U/V |
Digital shift registers are electronic circuits that can store and shift data in a serial-in, serial-out (SISO) or parallel-in, serial-out (PISO) fashion. They are commonly used in digital systems for data storage, data transfer, and signal processing applications.
Shift registers can be designed using various types of flip-flops, such as D flip-flops, JK flip-flops, and T flip-flops. They can also be designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs).
Digital shift registers can be classified into various types based on their operation mode and the direction of data shift. The most common types of shift registers include:
1. Serial-in, serial-out (SISO) shift registers: These shift registers have one serial input and one serial output. They can shift data in one direction, either left or right, and can be used for data storage, delay generation, and signal processing applications.
2. Parallel-in, serial-out (PISO) shift registers: These shift registers have multiple parallel inputs and one serial output. They can shift data from multiple inputs to a single output in a serial fashion and can be used for data transfer and signal processing applications.
3. Serial-in, parallel-out (SIPO) shift registers: These shift registers have one serial input and multiple parallel outputs. They can shift data from a single input to multiple outputs in a parallel fashion and can be used for data storage and signal processing applications.
4. Parallel-in, parallel-out (PIPO) shift registers: These shift registers have multiple parallel inputs and multiple parallel outputs. They can shift data from multiple inputs to multiple outputs in a parallel fashion and can be used for data transfer and signal processing applications.
Digital shift registers are used in various applications, including serial-to-parallel conversion, parallel-to-serial conversion, data storage, data transfer, and signal processing. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.