SQUARE Latches & Flip-Flops 1,754

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	Screening Level	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVC1G74DP,125	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.4 ns	24 Amp	FF/Latches	.65 mm	125 Cel			POSITIVE EDGE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	200 MHz	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
74LVC1G74DP-Q100,125	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		13.4 ns			.65 mm	125 Cel			POSITIVE EDGE	-40 Cel		DUAL	200 MHz	S-PDSO-G8		5.5 V	1.1 mm	3 mm		COMPLEMENTARY	1.65 V						3 mm	LVC/LCX/Z
SN74LVC1G74RSER	Texas Instruments	D FLIP-FLOP	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3		CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	8.2 ns	32 Amp	FF/Latches	.5 mm	125 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	200 MHz	S-PQCC-N8	1	5.5 V	.6 mm	1.5 mm	Not Qualified	COMPLEMENTARY	1.65 V	.01 mA		e4	30	260	1.5 mm	LVC/LCX/Z
74LVC1G74DP-Q100H	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS	AEC-Q100	1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.4 ns	24 Amp	FF/Latches	.65 mm	125 Cel			POSITIVE EDGE	-40 Cel		DUAL	200 MHz	S-PDSO-G8		5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	1.65 V						3 mm	LVC/LCX/Z
NB4L52MNG	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2500000000 Hz	ECL		1	RAIL	2.5	2.5/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	.5 ns		FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N16	1	5.5 V	1 mm	3 mm	Not Qualified	COMPLEMENTARY	2.375 V		LVPECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V		30	260	3 mm	4L
MC100E143FNR2	Onsemi	D FLIP-FLOP	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		ECL		9		5			CHIP CARRIER		1 ns			1.27 mm	85 Cel		OPEN-EMITTER	POSITIVE EDGE	0 Cel	TIN LEAD	QUAD	700 MHz	S-PQCC-J28	1	5.7 V	4.57 mm	11.505 mm	Not Qualified	TRUE	4.2 V		NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e0		235	11.505 mm	100E
74LVC1G74DP	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.4 ns	24 Amp	FF/Latches	.65 mm	125 Cel			POSITIVE EDGE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	200 MHz	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
SN74LVC1G74RSE2	Texas Instruments	D FLIP-FLOP	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3		CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	8.2 ns	32 Amp	FF/Latches	.5 mm	125 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	200 MHz	S-PQCC-N8	1	5.5 V	.6 mm	1.5 mm	Not Qualified	COMPLEMENTARY	1.65 V	.01 mA		e4	30	260	1.5 mm	LVC/LCX/Z
MC100EP131FAR2G	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1		ECL		4	TR	3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.6 ns		FF/Latches	.8 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32	2	5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V	130 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	7 mm	100E
MC100EP131FAG	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1		ECL		4	TRAY	3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.6 ns		FF/Latches	.8 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32	2	5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V	130 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	7 mm	100E
NC7SZ74L8X	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3	15 pF	CHIP CARRIER	LCC8,.06SQ,20	13 ns	32 Amp	FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	250 MHz	S-XQCC-N8	1	5.5 V	.55 mm	1.6 mm	Not Qualified	COMPLEMENTARY	1.65 V	50 mA		e4	NOT SPECIFIED	NOT SPECIFIED	1.6 mm	LVC/LCX/Z
74LVC2G74DP,125	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.4 ns	24 Amp	FF/Latches	.65 mm	125 Cel			POSITIVE EDGE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	200 MHz	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
SY55852UKG	Microchip Technology	D FLIP-FLOP	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				1	TUBE				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.4 ns			.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2500 MHz	S-PDSO-G10	2	5.7 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	2.3 V			e4	40	260	3 mm	55852
MC100EP131FA	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		4	TRAY	3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.6 ns		FF/Latches	.8 mm	85 Cel			POSITIVE EDGE	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V	130 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e0		235	7 mm	100E
MC100EP131FAR2	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		4	TR	3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.6 ns		FF/Latches	.8 mm	85 Cel			POSITIVE EDGE	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V	130 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e0		235	7 mm	100E
MC100EP131MNR4G	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	3000000000 Hz	ECL		4	TR	3.3	-4.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.6 ns		FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	TIN	QUAD		S-XQCC-N32	1	5.5 V	1 mm	5 mm	Not Qualified	COMPLEMENTARY	3 V	130 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	5 mm	100E
MC100EL51DTR2G	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1800000000 Hz	ECL		1	TR	5	-4.5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.565 ns		FF/Latches	.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	TIN	DUAL	2200 MHz	S-PDSO-G8		5.7 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	4.2 V	36 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e3		260	3 mm	100EL
MC100EP31DTG	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		1	RAIL	3.3	-4.5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.41 ns		FF/Latches	.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	3	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	3 V	47 mA	NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V	e3	30	260	3 mm	100E
MC100EP451FAG	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		6		3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.55 ns		Shift Registers	.8 mm	85 Cel	RIGHT		POSITIVE EDGE	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32	2	5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	7 mm	100E
MC100E150FNG	Onsemi	D LATCH	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		ECL		6		5	-4.5		CHIP CARRIER	LDCC28,.5SQ	.8 ns		FF/Latches	1.27 mm	85 Cel		OPEN-EMITTER	LOW LEVEL	0 Cel	TIN	QUAD	900 MHz	S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified	COMPLEMENTARY	4.2 V	72 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e3		260	11.505 mm	100E
SN74AUP1G74RSER	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	40000000 Hz	CMOS		1	TR	1.2	1.2/3.3	30 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	27 ns	4 Amp	FF/Latches	.5 mm	85 Cel		3-STATE	POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	180 MHz	S-PQCC-N8	1	3.6 V	.6 mm	1.5 mm	Not Qualified	COMPLEMENTARY	.8 V	.0009 mA		e4	30	260	1.5 mm	AUP/ULP/V
MC100EP451FAR2	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		6		3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.55 ns		Shift Registers	.8 mm	85 Cel	RIGHT		POSITIVE EDGE	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e0		235	7 mm	100E
MC100EP451FAR2G	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		6		3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.55 ns		Shift Registers	.8 mm	85 Cel	RIGHT		POSITIVE EDGE	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32	2	5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	7 mm	100E
MC100EP451MNR4G	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		6		3.3	-4.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.55 ns		Shift Registers	.5 mm	85 Cel	RIGHT		POSITIVE EDGE	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	5.5 V	1 mm	5 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	5 mm	100E
NB4L52MNR2G	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2500000000 Hz	ECL		1	TR	2.5	2.5/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	.5 ns		FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N16	1	5.5 V	1 mm	3 mm	Not Qualified	COMPLEMENTARY	2.375 V		LVPECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V		30	260	3 mm	4L
MC100EP51DTG	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		1	RAIL	3.3	-4.5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.45 ns		FF/Latches	.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	3	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	3 V	47 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	3 mm	100E
SY10EP51VKG	Microchip Technology	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		ECL		1	TUBE	3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.37 ns			.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	3000 MHz	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e4	40	260	3 mm	10E
74LVC2G74DP-Q100H	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS	AEC-Q100	1	TR	1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.4 ns	24 Amp	FF/Latches	.65 mm	125 Cel			POSITIVE EDGE	-40 Cel		DUAL	200 MHz	S-PDSO-G8		5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	1.65 V						3 mm	LVC/LCX/Z
MC100EP131MNG	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	3000000000 Hz	ECL		4	TRAY	3.3	-4.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.6 ns		FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	TIN	QUAD		S-XQCC-N32	1	5.5 V	1 mm	5 mm	Not Qualified	COMPLEMENTARY	3 V	130 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	5 mm	100E
MC100EP52DTG	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	4000000000 Hz	ECL		1	TUBE	3.3	-4.5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.38 ns		FF/Latches	.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	3	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	3 V	47 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	3 mm	100E
NC7SZ74L8X-L22185	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3	15 pF	CHIP CARRIER	LCC8,.06SQ,20	13 ns	32 Amp	FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	250 MHz	S-XQCC-N8	1	5.5 V	.55 mm	1.6 mm	Not Qualified	COMPLEMENTARY	1.65 V	50 mA		e4	NOT SPECIFIED	NOT SPECIFIED	1.6 mm	LVC/LCX/Z
NC7SZ74L8X_F113	Onsemi	D FLIP-FLOP		NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1	TR	1.8		50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	13 ns	32 Amp		.5 mm	85 Cel			POSITIVE EDGE	-40 Cel		QUAD		S-XQCC-N8		5.5 V	.55 mm	1.6 mm		COMPLEMENTARY	1.65 V	50 mA					1.6 mm	LVC/LCX/Z
74LVC2G74DP	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1		1.8	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	13.4 ns	24 Amp	FF/Latches	.65 mm	125 Cel			POSITIVE EDGE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	200 MHz	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	1.65 V			e4	30	260	3 mm	LVC/LCX/Z
SN74AUC74RGYR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2	225000000 Hz	CMOS		1	TR	1.2	1.2/2.5	15 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14/18,.14SQ,20	4 ns	9 Amp	FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	350 MHz	S-PQCC-N14	2	2.7 V	1 mm	3.5 mm	Not Qualified	COMPLEMENTARY	.8 V	.01 mA		e4	30	260	3.5 mm	AUC
74AUP1G80GS,132	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	27.2 ns	1.7 Amp	FF/Latches	.35 mm	125 Cel			POSITIVE EDGE	-40 Cel	TIN	DUAL	510 MHz	S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	INVERTED	.8 V			e3	30	260	1 mm	AUP/ULP/V
MC100E151FNG	Onsemi	D FLIP-FLOP	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	1100000000 Hz	ECL		6		5	-4.5		CHIP CARRIER	LDCC28,.5SQ	.9 ns		FF/Latches	1.27 mm	85 Cel		OPEN-EMITTER	POSITIVE EDGE	0 Cel	MATTE TIN	QUAD	900 MHz	S-PQCC-J28	3	5.7 V	4.57 mm	11.505 mm	Not Qualified	COMPLEMENTARY	4.2 V	90 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e3	30	260	11.505 mm	100E
MC10EP51DTG	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		1	RAIL	3.3	-5.2		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.37 ns		FF/Latches	.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	3	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	3 V	47 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	3 mm	10E
MC10EP52MNR4G	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1	4000000000 Hz	ECL		1	TR	3.3	-5.2		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	.38 ns		FF/Latches	.5 mm	85 Cel			POSITIVE EDGE	-40 Cel	NICKEL GOLD PALLADIUM	DUAL		S-XDSO-N8	1	5.5 V	1 mm	2 mm	Not Qualified	COMPLEMENTARY	3 V	47 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V		30	260	2 mm	10E
74LVC1G175GS,132	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1		1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	17 ns	24 Amp	FF/Latches	.35 mm	125 Cel			POSITIVE EDGE	-40 Cel	TIN	DUAL	200 MHz	S-PDSO-N6	1	5.5 V	.35 mm	1 mm	Not Qualified	TRUE	1.65 V			e3	30	260	1 mm	LVC/LCX/Z
SNJ54LS259BFK	Texas Instruments	D LATCH	MILITARY	NO LEAD	20	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1		TTL	38535Q/M;38534H;883B	1		5	5	15 pF	CHIP CARRIER	LCC20,.35SQ	24 ns	4 Amp	FF/Latches	1.27 mm	125 Cel			LOW LEVEL	-55 Cel		QUAD		S-CQCC-N20		5.5 V	2.03 mm	8.89 mm	Not Qualified	TRUE	4.5 V	36 mA	1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH		NOT SPECIFIED	NOT SPECIFIED	8.89 mm	LS
74LVC1G74DP-Q100	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		13.4 ns			.65 mm	125 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	200 MHz	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm		COMPLEMENTARY	1.65 V			e4			3 mm	LVC/LCX/Z
MC100E143FNR2G	Onsemi	D FLIP-FLOP	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		ECL		9		5			CHIP CARRIER		1 ns			1.27 mm	85 Cel			POSITIVE EDGE	0 Cel	TIN	QUAD	700 MHz	S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified	TRUE	4.2 V		NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e3		260	11.505 mm	100E
MC100EP451FA	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		6		3.3	-4.5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	.55 ns		Shift Registers	.8 mm	85 Cel	RIGHT		POSITIVE EDGE	-40 Cel	Tin/Lead (Sn80Pb20)	QUAD		S-PQFP-G32		5.5 V	1.6 mm	7 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e0	30	235	7 mm	100E
MC100EP451MNG	Onsemi	D FLIP-FLOP	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	3000000000 Hz	ECL		6		3.3	-4.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.55 ns		Shift Registers	.5 mm	85 Cel	RIGHT		POSITIVE EDGE	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	5.5 V	1 mm	5 mm	Not Qualified	COMPLEMENTARY	3 V		NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	5 mm	100E
MC100EP52DTR2G	Onsemi	D FLIP-FLOP	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	4000000000 Hz	ECL		1	TR	3.3	-4.5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.38 ns		FF/Latches	.65 mm	85 Cel			POSITIVE EDGE	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	3	5.5 V	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	3 V	47 mA	NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V	e3	30	260	3 mm	100E
SSTVF16859BS	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				13		2.5	2.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	2.5 ns		Other Logic ICs	.5 mm	70 Cel			POSITIVE EDGE	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	210 MHz	S-PQCC-N56	1	2.7 V	1 mm	8 mm	Not Qualified	TRUE	2.3 V			e4	40	260	8 mm	SSTV
74AUP1G74GM,125	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	70000000 Hz	CMOS		1	TR	1.2	1.2/3.3	30 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	23.3 ns	1.7 Amp	FF/Latches	.5 mm	125 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	510 MHz	S-PQCC-N8	1	3.6 V	.5 mm	1.6 mm	Not Qualified	COMPLEMENTARY	.8 V			e4	30	260	1.6 mm	AUP/ULP/V
74LVC1G74GM,125	NXP Semiconductors	D FLIP-FLOP	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	175000000 Hz	CMOS		1	TR	1.8	3.3		CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	13.4 ns	24 Amp	FF/Latches	.5 mm	125 Cel			POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	200 MHz	S-PQCC-N8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	COMPLEMENTARY	1.65 V			e4	30	260	1.6 mm	LVC/LCX/Z

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.