XOR/XNOR GATE Logic Gates 110

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
MC100E107FNR2G	Onsemi	XOR/XNOR GATE	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5	ECL	2	TR	5	-4.5	CHIP CARRIER	LDCC28,.5SQ	.6 ns	Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN	QUAD	S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified	4.2 V	58 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e3		260	11.505 mm	100E
MC10H107FN	Onsemi	XOR/XNOR GATE	COMMERCIAL EXTENDED	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	3	ECL	2	RAIL	-5.2		CHIP CARRIER	LDCC20,.4SQ	1.6 ns	Gates	1.27 mm	75 Cel		0 Cel	TIN LEAD	QUAD	S-PQCC-J20	1	-5.46 V	4.57 mm	8.965 mm	Not Qualified	-4.94 V			e0		235	8.965 mm	10H
MC10H107M	Onsemi	XOR/XNOR GATE	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	ECL	2	RAIL	-5.2		SMALL OUTLINE	SOP16,.3	1.6 ns	Gates	1.27 mm	75 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		-5.46 V	2.05 mm	5.275 mm	Not Qualified	-4.94 V			e4		260	10.2 mm	10H
MC100E107FNR2	Onsemi	XOR/XNOR GATE	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5	ECL	2	TR	5	-4.5	CHIP CARRIER	LDCC28,.5SQ	.6 ns	Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	5.7 V	4.57 mm	11.505 mm	Not Qualified	4.2 V	58 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e0		235	11.505 mm	100E
MC100EL07MNR4G	Onsemi	XOR/XNOR GATE	INDUSTRIAL	NO LEAD	8	HVSSON	SQUARE	UNSPECIFIED	NO	YES	1	ECL	2	TR	5	-4.5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH	SOLCC8,.08,20	.395 ns	Gates	.5 mm	85 Cel		-40 Cel	TIN	DUAL	S-XDSO-N8		5.7 V	1 mm	2 mm	Not Qualified	4.2 V	20 mA	NECL MODE: VCC =0V WITH VEE = -4.2V TO -5.7V	e3		260	2 mm	100EL
MC100EP08DTR2G	Onsemi	XOR/XNOR GATE	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	NO	YES	1	ECL	2	TR	3.3	-4.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.3 ns	Gates	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	3	5.5 V	1.1 mm	3 mm	Not Qualified	3 V	40 mA	NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V	e3	30	260	3 mm	100E
MC10E107FNR2	Onsemi	XOR/XNOR GATE	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5	ECL	2	TR	5	-5.2	CHIP CARRIER	LDCC28,.5SQ	.6 ns	Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	5.7 V	4.57 mm	11.505 mm	Not Qualified	4.2 V	50 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e0		235	11.505 mm	10E
MC10H107MG	Onsemi	XOR/XNOR GATE	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3	ECL	2	RAIL	-5.2		SMALL OUTLINE	SOP16,.3	1.6 ns	Gates	1.27 mm	75 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		-5.46 V	2.05 mm	5.275 mm	Not Qualified	-4.94 V			e4		260	10.2 mm	10H
MC100E107FNG	Onsemi	XOR/XNOR GATE	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5	ECL	2		5	-4.5	CHIP CARRIER	LDCC28,.5SQ	.6 ns	Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN	QUAD	S-PQCC-J28		5.7 V	4.57 mm	11.505 mm	Not Qualified	4.2 V	58 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e3		260	11.505 mm	100E
MC10107L	Onsemi	XOR/XNOR GATE	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	3	ECL	2		-5.2	-5.2	IN-LINE	DIP16,.3	3.7 ns	Gates	2.54 mm	85 Cel		-30 Cel	TIN LEAD	DUAL	R-GDIP-T16		-5.72 V	5.08 mm	7.62 mm	Not Qualified	-4.68 V	31 mA		e0			19.495 mm	10K
100107F	NXP Semiconductors	XOR/XNOR GATE	OTHER	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED		NO	5	ECL	2		-4.5		IN-LINE		1.9 ns			85 Cel		0 Cel	TIN LEAD	DUAL	R-CDIP-T24		-4.8 V				-4.2 V			e0				ECL
10107B	NXP Semiconductors	XOR/XNOR GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	3	ECL	2				IN-LINE		4 ns			85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		28 mA						10K
UPG710B	Renesas Electronics	XOR/XNOR GATE		FLAT	16	QFF	RECTANGULAR	CERAMIC	NO	YES		GAAS				-2,-5.2	FLATPACK	QFL16,.15X.24,40		Gates	1 mm				Tin/Lead (Sn/Pb)	QUAD	R-XQFP-F16					Not Qualified				e0
UPG710P	Renesas Electronics	XOR/XNOR GATE							NO			GAAS				-2,-5.2		DIE OR CHIP		Gates												Not Qualified

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.