Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Onsemi |
INVERTER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
CMOS |
1 |
RAIL |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
140 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
18 V |
4.44 mm |
7.62 mm |
Not Qualified |
3 V |
e0 |
30 |
235 |
19.175 mm |
4000/14000/40000 |
||||||||||||||
|
NXP Semiconductors |
BUFFER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
CMOS |
1 |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
110 ns |
.36 Amp |
Gates |
2.54 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
15 V |
4.2 mm |
7.62 mm |
Not Qualified |
3 V |
CMOS-TTL LEVEL TRANSLATOR |
e4 |
19.025 mm |
4000/14000/40000 |
||||||||||||||
|
NXP Semiconductors |
BUFFER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
CMOS |
1 |
BULK |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
70 ns |
Gates |
2.54 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
15 V |
4.7 mm |
7.62 mm |
Not Qualified |
3 V |
CMOS-TTL LEVEL TRANSLATOR |
e4 |
21.6 mm |
4000/14000/40000 |
||||||||||||||
Toshiba |
BUFFER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
5 |
SMALL OUTLINE |
130 ns |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
18 V |
1.9 mm |
5.3 mm |
3 V |
10.3 mm |
4000/14000/40000 |
|||||||||||||||||||||||||
Defense Logistics Agency |
BUFFER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
6 |
CMOS |
MIL-PRF-38535 Class V |
1 |
5 |
FLATPACK |
189 ns |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
18 V |
Not Qualified |
3 V |
e4 |
4000/14000/40000 |
||||||||||||||||||||||||
Toshiba |
BUFFER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
4.5 |
150 pF |
SMALL OUTLINE |
SOP16,.24 |
175 ns |
7.8 Amp |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
2 V |
10.2 mm |
HC/UH |
||||||||||||||||||||||
Motorola |
INVERTER/BUFFER |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
2200 ns |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
18 V |
1.75 mm |
3.9 mm |
Not Qualified |
3 V |
PROGRAMMABLE HYSTERESIS VOLTAGE; INVERTED OUTPUTS TRI-STATE; OUTPUTS CASCADED XOR |
e0 |
9.9 mm |
4000/14000/40000 |
|||||||||||||||||
National Semiconductor |
INVERTER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
CMOS |
4.5/12.5 |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||
|
Toshiba |
BUFFER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
CMOS |
1 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
130 ns |
Gates |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
18 V |
Not Qualified |
3 V |
|||||||||||||||||||||||
Toshiba |
BUFFER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
5 |
2/6 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
175 ns |
6 Amp |
Gates |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
Not Qualified |
2 V |
|||||||||||||||||||||
Motorola |
OR/NOR GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
ECL |
38535Q/M;38534H;883B |
3 |
-5.2 |
-5.2 |
5 pF |
IN-LINE |
DIP16,.3 |
3.7 ns |
Gates |
2.54 mm |
125 Cel |
OPEN-EMITTER |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
-5.72 V |
5.08 mm |
7.62 mm |
Not Qualified |
-4.68 V |
24 mA |
ASYMMETRICAL INPUTS |
e0 |
19.495 mm |
10K |
|||||||||||||
Renesas Electronics |
INVERTER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
6 |
CMOS |
MIL-PRF-38535 Class V |
1 |
5 |
FLATPACK |
162 ns |
1.27 mm |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
18 V |
2.92 mm |
6.73 mm |
Qualified |
3 V |
RADIATION HARDENED; WITH EXTENDED INPUT VOLTAGE; IOL = 2.4MA @ VOL = 0.4V; IOH = 1.55MA @ VOH = 2.5V |
e4 |
4000/14000/40000 |
||||||||||||||||||||
Onsemi |
BUFFER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
CMOS |
1 |
RAIL |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
140 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
4.44 mm |
7.62 mm |
Not Qualified |
3 V |
e0 |
30 |
235 |
19.175 mm |
4000/14000/40000 |
||||||||||||||
Motorola |
AND-OR-INVERT GATE |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
CMOS |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||
Motorola |
XNOR GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
4 |
CMOS |
2 |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
500 ns |
.64 Amp |
Multiplexer/Demultiplexers |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T16 |
18 V |
4.19 mm |
7.62 mm |
Not Qualified |
3 V |
CONFIGURABLE AS 2:1 MUX |
e0 |
19.3 mm |
4000/14000/40000 |
||||||||||||||||
Motorola |
INVERTER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
6 |
CMOS |
1 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
26 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
6 V |
5.08 mm |
7.62 mm |
Not Qualified |
2 V |
CMOS-TTL LEVEL TRANSLATOR |
e0 |
19.495 mm |
HC/UH |
|||||||||||||||
Motorola |
NAND GATE |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
4 |
2 |
15 |
IN-LINE |
75 Cel |
-30 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
16 V |
Not Qualified |
14 V |
e0 |
MC66 |
||||||||||||||||||||||||||||
Motorola |
NAND GATE |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
2 |
2 |
15 |
IN-LINE |
DIP14,.3 |
Gates |
2.54 mm |
75 Cel |
-30 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
16 V |
Not Qualified |
14 V |
e0 |
MC67 |
||||||||||||||||||||||||
|
Toshiba |
INVERTER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
6 |
CMOS |
1 |
5 |
IN-LINE |
120 ns |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
18 V |
4.45 mm |
7.62 mm |
3 V |
30 |
260 |
19.25 mm |
4000/14000/40000 |
||||||||||||||||||||||
Toshiba |
BUFFER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
6 |
CMOS |
1 |
5 |
50 pF |
IN-LINE |
4000 ns |
2.54 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
4.45 mm |
7.62 mm |
Not Qualified |
3 V |
IOH = 6MA @ VOH = 2V; STROBED OUTPUTS |
e0 |
19.25 mm |
5000 |
|||||||||||||||||||
Toshiba |
INVERTER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
7 |
CMOS |
1 |
5 |
50 pF |
IN-LINE |
4000 ns |
2.54 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
4.45 mm |
7.62 mm |
Not Qualified |
3 V |
IOH = 6MA @ VOH = 2V |
e0 |
19.25 mm |
5000 |
|||||||||||||||||||
|
Toshiba |
NAND GATE |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
13 |
TR |
5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.3 |
165 ns |
4 Amp |
Gates |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
Not Qualified |
2 V |
||||||||||||||||||||
|
Toshiba |
BUFFER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
4.5 |
2/6 |
150 pF |
SMALL OUTLINE |
SOP16,.3 |
145 ns |
7.8 Amp |
Gates |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.9 mm |
5.3 mm |
Not Qualified |
2 V |
75 mA |
40 |
260 |
10.3 mm |
HC |
|||||||||||||
|
Toshiba |
BUFFER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
4.5 |
2/6 |
150 pF |
SMALL OUTLINE |
SOP16,.25 |
145 ns |
6 Amp |
Gates |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2 V |
NOT AVAILABLE IN JAPAN |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
HC/UH |
||||||||||||||
|
Texas Instruments |
BUFFER |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
4.5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.3 |
130 ns |
4 Amp |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
2 V |
.04 mA |
CMOS-TTL LEVEL TRANSLATOR |
e4 |
30 |
260 |
10.2 mm |
HC |
|||||||||
Texas Instruments |
INVERTER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
6 |
CMOS |
1 |
5/15 |
IN-LINE |
DIP16,.3 |
120 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
18 V |
Not Qualified |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
Texas Instruments |
NOR GATE |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
ECL |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||
Texas Instruments |
NAND GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
CMOS |
3 |
5 |
3.3/5 |
50 pF |
IN-LINE |
DIP16,.3 |
7.4 ns |
24 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
3 V |
CENTER PIN VCC AND GND |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
AC |
|||||||||||||||
Texas Instruments |
NOR GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
CMOS |
2 |
5 |
5 |
50 pF |
IN-LINE |
DIP16,.3 |
9.5 ns |
24 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
CENTER PIN VCC AND GND |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
ACT |
|||||||||||||||
Texas Instruments |
NAND GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
1 |
TTL |
13 |
5 |
50 pF |
IN-LINE |
28 ns |
4 Amp |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
Qualified |
4.5 V |
.8 mA |
ALS |
||||||||||||||||||||||||
Texas Instruments |
LOGIC CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||
Texas Instruments |
INVERTER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
6 |
CMOS |
MIL-PRF-38535 Class B |
1 |
5 |
IN-LINE |
345 ns |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
12.5 V |
Not Qualified |
4.5 V |
CMOS-TTL LEVEL TRANSLATOR |
4000/14000/40000 |
||||||||||||||||||||||||||
Texas Instruments |
NOR GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
2 |
TTL |
4 |
5 |
15 pF |
IN-LINE |
15 ns |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
19 mA |
STROBED OUTPUTS; WITH 2 EXPAND INPUTS |
19.56 mm |
TTL/H/L |
|||||||||||||||||||||
Texas Instruments |
NAND GATE |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
NO |
YES |
1 |
TTL |
MIL-STD-883 Class B (Modified) |
13 |
5 |
5 |
FLATPACK |
FL16,.3 |
7 ns |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
5.5 V |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Texas Instruments |
NAND GATE |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
85 Cel |
-30 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||
Texas Instruments |
BUFFER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
6 |
CMOS |
MIL-PRF-38535 Class B |
1 |
5 |
IN-LINE |
345 ns |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
12.5 V |
Not Qualified |
4.5 V |
4000/14000/40000 |
|||||||||||||||||||||||||||
Texas Instruments |
NAND GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
1 |
TTL |
MIL-STD-883 Class B (Modified) |
12 |
5 |
5 |
IN-LINE |
DIP16,.3 |
7.5 ns |
Gates |
2.54 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
Texas Instruments |
XOR GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
CMOS |
2 |
5 |
3.3/5 |
50 pF |
IN-LINE |
DIP16,.3 |
8.7 ns |
24 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
AC |
||||||||||||||||
Texas Instruments |
INVERTER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
6 |
CMOS |
38535Q/M;38534H;883B |
1 |
TUBE |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
130 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
6 V |
5.08 mm |
7.62 mm |
Not Qualified |
2 V |
.02 mA |
CMOS-TTL LEVEL TRANSLATOR |
e0 |
19.56 mm |
HC |
||||||||||||
Texas Instruments |
INVERTER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
6 |
CMOS |
1 |
5 |
3/15 |
50 pF |
IN-LINE |
DIP16,.3 |
125 ns |
3 Amp |
Gates |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
18 V |
Not Qualified |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
Texas Instruments |
XOR/XNOR GATE |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
NO |
YES |
4 |
TTL |
MIL-STD-883 Class B (Modified) |
3 |
5 |
5 |
FLATPACK |
FL16,.3 |
14.5 ns |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
5.5 V |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Texas Instruments |
INVERTER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
6 |
CMOS |
1 |
5 |
5/15 |
IN-LINE |
DIP16,.3 |
125 ns |
Gates |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDIP-T16 |
18 V |
Not Qualified |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||
Texas Instruments |
NAND GATE |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
85 Cel |
-30 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||
Texas Instruments |
BUFFER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
CMOS |
5/15 |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Texas Instruments |
NAND GATE |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
IN-LINE |
DIP16,.3 |
Gates |
2.54 mm |
85 Cel |
-30 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||
Texas Instruments |
BUFFER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
CMOS |
5 |
3/15 |
50 pF |
IN-LINE |
DIP16,.3 |
3 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
15 V |
Not Qualified |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
Texas Instruments |
AND GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
CMOS |
3 |
5 |
5 |
50 pF |
IN-LINE |
DIP16,.3 |
9.2 ns |
24 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
CENTER PIN VCC AND GND |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
ACT |
|||||||||||||||
Texas Instruments |
NOR GATE |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
2 |
TTL |
MIL-STD-883 Class B (Modified) |
4 |
5 |
IN-LINE |
DIP16,.3 |
22 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
4.5 V |
Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.
Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.
Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.
Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.
Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.
Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.