Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
6 |
CMOS |
1 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
190 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
HC/UH |
|||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
130 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
HC/UH |
|||||||||||
|
Texas Instruments |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
6 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
11 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
3.6 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
.01 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LVC/LCX/Z |
||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
6 |
CMOS |
1 |
TR |
2.7 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
10 ns |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
3.6 V |
1 mm |
1.5 mm |
Not Qualified |
1.2 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
||||||||||||
|
NXP Semiconductors |
BUFFER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
4.5 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
1.65 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
OR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
2.5 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
19 ns |
12 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LV/LV-A/LVX/H |
||||||||||
|
NXP Semiconductors |
OR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
30 |
260 |
3 mm |
HC/UH |
||||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
e3 |
30 |
260 |
3 mm |
HC/UH |
||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
AEC-Q100 |
1 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
30 |
260 |
3 mm |
HC/UH |
|||||||||||
|
NXP Semiconductors |
OR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
HC/UH |
|||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
6 |
CMOS |
AEC-Q100 |
1 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
190 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
30 |
260 |
3 mm |
HC/UH |
||||||||||||
|
Texas Instruments |
INVERTER |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
1.2 |
1.2/2.5 |
15 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
3.3 ns |
9 Amp |
Gates |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N14 |
2 |
2.7 V |
1 mm |
3.5 mm |
Not Qualified |
.8 V |
.01 mA |
e4 |
30 |
260 |
3.5 mm |
AUC |
|||||||||
|
Texas Instruments |
OR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
10.2 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
3.6 V |
1 mm |
3.5 mm |
Not Qualified |
1.65 V |
.01 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LVC/LCX/Z |
||||||||||
|
NXP Semiconductors |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
HC/UH |
|||||||||||
|
NXP Semiconductors |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
30 |
260 |
3 mm |
HC/UH |
||||||||||||
|
NXP Semiconductors |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
29 ns |
5.2 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
4.5 V |
30 |
260 |
3 mm |
HCT |
||||||||||||
|
Texas Instruments |
NAND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
4 |
CMOS |
2 |
TR |
3.3 |
2/5.5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
17.5 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
AHC/VHC/H/U/V |
||||||||||
|
Analog Devices |
XOR/XNOR GATE |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1 |
2 |
TR |
-3.3 |
-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
-3.6 V |
1 mm |
3 mm |
Not Qualified |
-3 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
721 |
||||||||||||||||||
NXP Semiconductors |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
9.5 ns |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
4.5 V |
3 mm |
AHCT/VHCT/VT |
||||||||||||||||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
AEC-Q100 |
1 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
105 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
3 mm |
HC/UH |
|||||||||||||||
|
NXP Semiconductors |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
2/6 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
135 ns |
4 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
30 |
260 |
3 mm |
HC/UH |
||||||||||||
|
Onsemi |
INVERTER |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
6 |
CMOS |
1 |
TR |
2.5 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
7.8 ns |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N14 |
1 |
3.6 V |
.8 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
||||||||||||
|
Texas Instruments |
BUFFER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
5.6 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
1.65 V |
.04 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LVC/LCX/Z |
|||||||||
NXP Semiconductors |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
14.5 ns |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
2 V |
3 mm |
AHC/VHC/H/U/V |
||||||||||||||||||||||||
|
NXP Semiconductors |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
5 |
2/5.5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
15.5 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
AHC/VHC/H/U/V |
||||||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
6 |
CMOS |
1 |
TR |
5 |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
10 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
4.5 V |
e4 |
30 |
260 |
3 mm |
AHCT/VHCT/VT |
|||||||||||
|
NXP Semiconductors |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
135 ns |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
1 |
6 V |
1 mm |
2.5 mm |
2 V |
3 mm |
HC/UH |
||||||||||||||||||||||
|
Onsemi |
AND GATE |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
NO |
YES |
3 |
CMOS |
3 |
TR |
2.5 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
7.2 ns |
24 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N14 |
1 |
3.6 V |
.8 mm |
2.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
|||||||||||
|
Onsemi |
NAND GATE |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
NO |
YES |
4 |
CMOS |
2 |
TR |
1.5 |
3.3 |
30 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
37 ns |
24 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N14 |
1 |
3.6 V |
.8 mm |
2.5 mm |
Not Qualified |
1.2 V |
e4 |
30 |
260 |
3 mm |
ALVC/VCX/A |
|||||||||||
|
Texas Instruments |
NAND GATE |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
4 |
CMOS |
2 |
TR |
3.3 |
2/5.5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
17.5 ns |
8 Amp |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
3.5 mm |
AHC/VHC/H/U/V |
|||||||||||
|
Texas Instruments |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
5 |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
9 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
4.5 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
AHCT/VHCT/VT |
||||||||||
|
Texas Instruments |
OR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
5 |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
9 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
4.5 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
AHCT/VHCT/VT |
||||||||||
|
Texas Instruments |
OR GATE |
INDUSTRIAL |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
1.2 |
1.2/2.5 |
15 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
3.5 ns |
9 Amp |
Gates |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N14 |
2 |
2.7 V |
1 mm |
3.5 mm |
Not Qualified |
.8 V |
.01 mA |
e4 |
30 |
260 |
3.5 mm |
AUC |
|||||||||
|
NXP Semiconductors |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
3.3 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
10.2 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
3.6 V |
1 mm |
2.5 mm |
Not Qualified |
1.2 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
|||||||||||
|
Texas Instruments |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
6 |
CMOS |
1 |
TR |
3.3 |
2/5.5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
13 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
.02 mA |
IT CAN ALSO OPERATE AT 5 V NOMINAL |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
AHC/VHC/H/U/V |
|||||||||
|
Texas Instruments |
INVERTER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
6 |
CMOS |
1 |
TR |
3.3 |
2/5.5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
18.5 ns |
8 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
AHC/VHC/H/U/V |
||||||||||
|
Texas Instruments |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
2.5 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
20 ns |
12 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
2 V |
.02 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LV/LV-A/LVX/H |
||||||||||
|
Texas Instruments |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
8.9 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
3.6 V |
1 mm |
3.5 mm |
Not Qualified |
1.5 V |
.01 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LVC/LCX/Z |
||||||||||
|
Texas Instruments |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
8.9 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N14 |
2 |
3.6 V |
1 mm |
3.5 mm |
Not Qualified |
1.65 V |
e4 |
30 |
260 |
3.5 mm |
LVC/LCX/Z |
|||||||||||
|
Texas Instruments |
XOR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
1.8 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
9.9 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
3.6 V |
1 mm |
3.5 mm |
Not Qualified |
1.65 V |
.01 mA |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
LVC/LCX/Z |
||||||||||
|
NXP Semiconductors |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
2.7 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
9 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
3.6 V |
1 mm |
2.5 mm |
Not Qualified |
1.2 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
|||||||||||
|
NXP Semiconductors |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR |
3.3 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
10.4 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
3.6 V |
1 mm |
2.5 mm |
Not Qualified |
1.65 V |
3 mm |
LVC/LCX/Z |
|||||||||||||||
|
NXP Semiconductors |
OR GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
TR |
2.7 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
5.5 ns |
24 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N14 |
1 |
3.6 V |
1 mm |
2.5 mm |
Not Qualified |
1.2 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
||||||||||||
Texas Instruments |
AND GATE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR, 7 INCH |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
27 ns |
5.5 Amp |
0 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
5.5 V |
0 mm |
2.5 mm |
1.6 V |
.02 mA |
3 mm |
LV/LV-A/LVX/H |
|||||||||||||||||||
Texas Instruments |
AND GATE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
9 ns |
8 Amp |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
5.5 V |
.8 mm |
2.5 mm |
4.5 V |
.02 mA |
3 mm |
AHCT/VHCT/VT |
||||||||||||||||||||
|
Texas Instruments |
AND GATE |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
2 |
TR |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
11.3 ns |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N14 |
2 |
3.6 V |
1 mm |
3.5 mm |
1.65 V |
e4 |
30 |
260 |
3.5 mm |
LVC/LCX/Z |
|||||||||||||||||||
|
Texas Instruments |
AND GATE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR, 7 INCH |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
27 ns |
5.5 Amp |
0 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N14 |
1 |
5.5 V |
0 mm |
2.5 mm |
1.6 V |
.02 mA |
260 |
3 mm |
LV/LV-A/LVX/H |
|||||||||||||||
Texas Instruments |
NAND GATE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR, 7 INCH |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
9 ns |
8 Amp |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N14 |
5.5 V |
.8 mm |
2.5 mm |
4.5 V |
.02 mA |
3 mm |
AHCT/VHCT/VT |
Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.
Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.
Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.
Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.
Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.
Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.