J BEND Logic Gates 733

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	No. of Bits	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Length	Family
HCF4072BC1	STMicroelectronics	OR GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	4		5	3/15	50 pF	CHIP CARRIER	LDCC20,.4SQ	250 ns		Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	15 V	4.57 mm	8.9662 mm	Not Qualified		3 V		e0	8.9662 mm	4000/14000/40000
M74HC4072C1R	STMicroelectronics	OR GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	4		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	25 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	6 V	4.57 mm	8.9662 mm	Not Qualified		2 V		e3	8.9662 mm	HC/UH
M74HC86C1R	STMicroelectronics	XOR GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	4	CMOS	2		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	28 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	6 V	4.57 mm	8.9662 mm	Not Qualified		2 V		e3	8.9662 mm	HC/UH
HCF4011BC1	STMicroelectronics	NAND GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	4	CMOS	2		5	3/15	50 pF	CHIP CARRIER	LDCC20,.4SQ	250 ns		Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	15 V	4.57 mm	8.965 mm	Not Qualified		3 V		e3	8.965 mm	4000/14000/40000
HCF4048BC1	STMicroelectronics	AND-OR GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	8		5	3/15	50 pF	CHIP CARRIER	LDCC20,.4SQ	600 ns		Gates	1.27 mm	85 Cel	3-STATE	-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	15 V	4.57 mm	8.965 mm	Not Qualified		3 V	CONFIGURABLE AS NOR/OR/NAND/AND/OR-AND/OR-NAND/AND-NOR; EXPANDABLE	e3	8.965 mm	4000/14000/40000
M74HC30C1	STMicroelectronics	NAND GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	8		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	31 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	6 V	4.57 mm	8.9662 mm	Not Qualified		2 V		e0	8.9662 mm	HC/UH
M74HC14C1R	STMicroelectronics	INVERTER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	YES	6	CMOS	1		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	31 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	6 V	4.57 mm	8.9662 mm	Not Qualified		2 V		e3	8.9662 mm	HC/UH
M74HCT08C1R	STMicroelectronics	AND GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	4	CMOS	2		5	5	50 pF	CHIP CARRIER	LDCC20,.4SQ	26 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	5.5 V	4.57 mm	8.9662 mm	Not Qualified		4.5 V		e3	8.9662 mm	HCT
M74HC266C1R	STMicroelectronics	XNOR GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	4	CMOS	2		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	23 ns	4 Amp	Gates	1.27 mm	85 Cel	OPEN-DRAIN	-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	6 V	4.57 mm	8.965 mm	Not Qualified		2 V		e3	8.965 mm	HC/UH
M74HCT07C1	STMicroelectronics	BUFFER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES		CMOS						CHIP CARRIER	LDCC20,.4SQ			Gates	1.27 mm	85 Cel		-40 Cel		QUAD	S-PQCC-J20				Not Qualified
M74HC51C1	STMicroelectronics	AND-OR-INVERT GATE	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	6		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	26 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	6 V	4.57 mm	8.9662 mm	Not Qualified		2 V	ASYMMETRICAL INPUTS	e0	8.9662 mm	HC/UH
M74HC04C1	STMicroelectronics	INVERTER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	6	CMOS	1		5	2/6	50 pF	CHIP CARRIER	LDCC20,.4SQ	23 ns	4 Amp	Gates	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	6 V	4.57 mm	8.9662 mm	Not Qualified		2 V		e0	8.9662 mm	HC/UH
PI74FCT890TJ	Diodes Incorporated	INVERTER	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY		YES	6	CMOS	1	6	5	5	150 pF	CHIP CARRIER	LDCC20,.4SQ	9 ns	100 Amp	Bus Driver/Transceivers	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-J20	5.25 V			Not Qualified	INVERTED	4.75 V	STROBED O/P'S	e0		FCT

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.