Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | Input Conditioning | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | No. of Inverted Outputs | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Maximum Same Edge Skew (tskwd) | Minimum Operating Temperature | Terminal Finish | No. of True Outputs | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
TUBE |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.54 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.95 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e4 |
1 |
260 |
5 mm |
89547 |
||||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.39 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
140 mA |
SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY |
e4 |
1 |
260 |
5 mm |
58029 |
|||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
3.3 |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.25 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
3.3 |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.25 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.1 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
2.625 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
130 mA |
e4 |
1 |
260 |
5 mm |
89847 |
||||||||||||||||||||||||
|
Analog Devices |
MULTIPLEXER |
NO LEAD |
32 |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
CHIP CARRIER |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N32 |
3 |
Not Qualified |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQCC-N32 |
3 |
3.6 V |
1 mm |
3 mm |
CONFIGURABLE |
3 V |
30 |
1 |
260 |
6 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
4 |
TR |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.6 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.95 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e4 |
40 |
1 |
260 |
5 mm |
89545 |
||||||||||||||||||||||||
|
Analog Devices |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
.416 ns |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
LVECL/ECL OPERATING RANGE: VEE=-2.375 TO -5.5V |
e3 |
30 |
1 |
260 |
5 mm |
|||||||||||||||||||||||||
|
Analog Devices |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
.416 ns |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
LVECL/ECL OPERATING RANGE: VEE=-2.375 TO -5.5V |
e3 |
30 |
1 |
260 |
5 mm |
|||||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
16 |
TR |
3.3 |
-3.3 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
.85 ns |
Multiplexer/Demultiplexers |
.8 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN |
QUAD |
S-PQFP-G32 |
2 |
3.8 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
45 mA |
NECL MODE: VCC=0 WITH VEE=-3V TO -3.8 |
e3 |
30 |
1 |
260 |
7 mm |
100LVE |
||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
2 |
1.8 |
1.8/2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
250 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1.89 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
1.71 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
16 |
3.3 |
-3.3 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
.85 ns |
Multiplexer/Demultiplexers |
.8 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN |
QUAD |
S-PQFP-G32 |
2 |
3.8 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
45 mA |
NECL MODE: VCC=0 WITH VEE=-3V TO -3.8 |
e3 |
30 |
1 |
260 |
7 mm |
100LVE |
|||||||||||||||||||
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
16 |
TR |
3.3 |
-3.3 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
.85 ns |
Multiplexer/Demultiplexers |
.8 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
2 |
3.8 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
45 mA |
NECL MODE: VCC=0 WITH VEE=-3V TO -3.8 |
e0 |
1 |
235 |
7 mm |
100LVE |
||||||||||||||||||||
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
16 |
3.3 |
-3.3 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
.85 ns |
Multiplexer/Demultiplexers |
.8 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
3.8 V |
1.6 mm |
7 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
45 mA |
NECL MODE: VCC=0 WITH VEE=-3V TO -3.8 |
e0 |
1 |
235 |
7 mm |
100LVE |
||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1.8 |
1.8 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5/3.3 |
FLATPACK |
QFP32,.35SQ,32 |
24 Amp |
Clock Drivers |
.8 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G32 |
2 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5,3.3 |
FLATPACK |
QFP32,.35SQ,32 |
24 Amp |
Clock Drivers |
.8 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G32 |
2 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
2 |
1.8 |
1.8/2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
250 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1.89 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
1.71 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.8 |
1.8 |
CHIP CARRIER |
LCC32,.2SQ,20 |
.3 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1.89 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
1.71 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N32 |
3 |
3.6 V |
1 mm |
3 mm |
CONFIGURABLE |
3 V |
e4 |
30 |
1 |
260 |
6 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQCC-N32 |
3.6 V |
1 mm |
3 mm |
CONFIGURABLE |
3 V |
1 |
6 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
R-XQCC-N32 |
3.63 V |
.8 mm |
3 mm |
COMPLEMENTARY |
2.97 V |
2-PORT DEVICE |
NOT SPECIFIED |
2 |
NOT SPECIFIED |
6 mm |
3USB |
|||||||||||||||||||||||||||||
|
Diodes Incorporated |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
3-STATE |
-40 Cel |
QUAD |
R-XQCC-N32 |
3.63 V |
.8 mm |
3 mm |
COMPLEMENTARY |
2.97 V |
2-PORT DEVICE |
NOT SPECIFIED |
2 |
NOT SPECIFIED |
6 mm |
3USB |
|||||||||||||||||||||||||||||
Maxim Integrated |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.416 ns |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
5.5 V |
.8 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
LVECL/ECL OPERATING RANGE: VEE=-2.375 TO -5.5V |
e0 |
1 |
5 mm |
||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
.63 ns |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
3.6 V |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e3 |
30 |
1 |
260 |
5 mm |
93 |
|||||||||||||||||||||||||
Maxim Integrated |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.416 ns |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
5.5 V |
.8 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
LVECL/ECL OPERATING RANGE: VEE=-2.375 TO -5.5V |
e0 |
1 |
5 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
.416 ns |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
LVECL/ECL OPERATING RANGE: VEE=-2.375 TO -5.5V |
e0 |
1 |
5 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
.416 ns |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
5.5 V |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
LVECL/ECL OPERATING RANGE: VEE=-2.375 TO -5.5V |
e0 |
1 |
5 mm |
||||||||||||||||||||||||||||
|
Maxim Integrated |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
.63 ns |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
3.6 V |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e3 |
30 |
1 |
260 |
5 mm |
93 |
Multiplexers and demultiplexers are electronic circuits that are used to transmit and receive multiple signals over a single channel. They are essential components of digital systems and are used to reduce the number of transmission lines required to transmit multiple signals.
A multiplexer, also known as a mux, is a digital circuit that can select one of several input signals and transmit it to a single output line based on a control signal. A multiplexer can have two or more inputs and a single output, and the selection of the input is determined by the binary value of the control signal. Multiplexers are used to reduce the number of transmission lines required to transmit multiple signals over a long distance.
A demultiplexer, also known as a demux, is a digital circuit that can distribute a single input signal to one of several output lines based on a control signal. A demultiplexer can have a single input and two or more outputs, and the selection of the output is determined by the binary value of the control signal. Demultiplexers are used to receive multiple signals transmitted over a single line.
Multiplexers and demultiplexers are commonly used together in digital systems to transmit and receive multiple signals over a single channel. They are used in various applications, including digital signal processing, telecommunications, and data storage systems. Multiplexers and demultiplexers are also used in memory systems to store and retrieve data from memory cells.
Multiplexers and demultiplexers can be designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can also be cascaded together to increase the number of inputs or outputs.