Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | Input Conditioning | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | No. of Inverted Outputs | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Maximum Same Edge Skew (tskwd) | Minimum Operating Temperature | Terminal Finish | No. of True Outputs | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
TR |
3 |
FLATPACK |
FL16,.3 |
1.27 mm |
150 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
TRUE |
2 V |
1 |
9.94 mm |
AC |
||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
4 |
4.5 |
2/6 |
50 pF |
FLATPACK |
FL16,.3 |
175 ns |
4 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
Not Qualified |
TRUE |
2 V |
e0 |
1 |
9.94 mm |
HC/UH |
||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
TR |
4.5 |
2/6 |
50 pF |
FLATPACK |
FL16,.3 |
150 ns |
4 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
Not Qualified |
TRUE |
2 V |
e0 |
1 |
9.94 mm |
HC/UH |
||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC |
YES |
1 |
CMOS |
ESCC9000 |
8 |
5/15 |
FLATPACK |
FL16,.3 |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
5 |
FLATPACK |
9.5 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
1 |
ACT |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MULTIPLEXER |
FLAT |
16 |
DFP |
RECTANGULAR |
3k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
STRIP PACK |
5 |
FLATPACK |
FL16,.3 |
1.27 mm |
150 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.38 mm |
6.91 mm |
COMPLEMENTARY |
4.5 V |
1 |
9.94 mm |
ACT |
|||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
4 |
CMOS |
MIL-STD-883 |
2 |
4.5 |
2/6 |
50 pF |
FLATPACK |
FL16,.3 |
190 ns |
6 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDFP-F16 |
6 V |
Not Qualified |
TRUE |
2 V |
e0 |
1 |
HC/UH |
||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
3 |
FLATPACK |
11 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
Not Qualified |
TRUE |
2 V |
1 |
AC |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
TR |
3 |
FLATPACK |
FL16,.3 |
1.27 mm |
150 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
COMPLEMENTARY |
2 V |
1 |
9.94 mm |
AC |
||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
3 |
3.3/5 |
50 pF |
FLATPACK |
FL16,.3 |
11 ns |
12 Amp |
Multiplexer/Demultiplexer |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
1 |
6 V |
Qualified |
TRUE |
2 V |
1 |
AC |
|||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
4 |
CMOS |
38535V;38534K;883S |
2 |
2/6 |
50 pF |
FLATPACK |
FL16,.3 |
6 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F16 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
4.5 |
3.3/5 |
50 pF |
FLATPACK |
FL16,.3 |
11 ns |
24 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
INVERTED |
3 V |
e4 |
1 |
AC |
||||||||||||||||||||||||||
|
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
TR |
3 |
FLATPACK |
FL16,.3 |
1.27 mm |
150 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
TRUE |
2 V |
1 |
9.94 mm |
AC |
||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
5 |
5 |
50 pF |
FLATPACK |
FL16,.3 |
9.5 ns |
24 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
INVERTED |
4.5 V |
e4 |
1 |
ACT |
||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
4.5 |
2/6 |
50 pF |
FLATPACK |
FL16,.3 |
150 ns |
4 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
Not Qualified |
TRUE |
2 V |
e0 |
1 |
9.94 mm |
HC/UH |
|||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
3 |
FLATPACK |
11 ns |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
Qualified |
TRUE |
2 V |
1 |
AC |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-STD-883 |
2 |
5 |
5 |
50 pF |
FLATPACK |
FL16,.3 |
11 ns |
24 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
e0 |
1 |
ACT |
||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class Q |
2 |
5 |
FLATPACK |
11 ns |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
e0 |
1 |
ACT |
||||||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-STD-883 |
2 |
5 |
5 |
50 pF |
FLATPACK |
FL16,.3 |
11 ns |
24 Amp |
Multiplexer/Demultiplexer |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
1 |
5.5 V |
Qualified |
TRUE |
4.5 V |
1 |
ACT |
||||||||||||||||||||||||||
|
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
3 |
FLATPACK |
FL16,.3 |
1.27 mm |
150 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
Qualified |
COMPLEMENTARY |
2 V |
1 |
9.94 mm |
AC |
||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class Q |
2 |
5 |
FLATPACK |
11 ns |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
e4 |
1 |
ACT |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
FLATPACK |
9.5 ns |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
11.176 mm |
F/FAST |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
TTL |
4 |
5 |
50 pF |
FLATPACK |
14 ns |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
11.176 mm |
F/FAST |
||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
2 |
TTL |
4 |
5 |
FLATPACK |
65 ns |
125 Cel |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
1 |
LS |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
TTL |
4 |
5 |
50 pF |
FLATPACK |
14 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
F/FAST |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
FLATPACK |
10 ns |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
INVERTED |
4.5 V |
15 mA |
1 |
11.176 mm |
F/FAST |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
FLATPACK |
10 ns |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
INVERTED |
4.5 V |
15 mA |
1 |
F/FAST |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
FLATPACK |
9.5 ns |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
F/FAST |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
4 |
TTL |
2 |
5 |
FLATPACK |
39 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
Not Qualified |
INVERTED |
4.5 V |
1 |
LS |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
8 |
5 |
FLATPACK |
9 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
Not Qualified |
COMPLEMENTARY |
4.5 V |
1 |
F/FAST |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
TTL |
8 |
5 |
FLATPACK |
9 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
Not Qualified |
COMPLEMENTARY |
4.5 V |
1 |
F/FAST |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
4 |
TTL |
2 |
5 |
FLATPACK |
7.5 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-GDFP-F16 |
5.5 V |
Not Qualified |
INVERTED |
4.5 V |
1 |
F/FAST |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
TTL |
MIL-M-38510 Class B |
4 |
5 |
FLATPACK |
14.5 ns |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDFP-F16 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
1 |
S |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TTL |
MIL-M-38510 Class S |
8 |
5 |
FLATPACK |
18 ns |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
5.5 V |
Not Qualified |
COMPLEMENTARY |
4.5 V |
1 |
S |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TTL |
MIL-M-38510 Class S |
8 |
5 |
FLATPACK |
18 ns |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
5.5 V |
Not Qualified |
COMPLEMENTARY |
4.5 V |
1 |
S |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
37 ns |
1.27 mm |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Qualified |
COMPLEMENTARY |
4.5 V |
e4 |
1 |
HC/UH |
||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
1 |
CMOS |
8 |
5/15 |
50 pF |
FLATPACK |
FL16,.3 |
.36 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
5 |
FLATPACK |
26 ns |
1.27 mm |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
1 |
HCT |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
5 |
5 |
50 pF |
FLATPACK |
FL16,.3 |
30 ns |
6 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
e0 |
1 |
HCT |
||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
8 |
5/15 |
50 pF |
FLATPACK |
FL16,.3 |
.36 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
5 |
5 |
50 pF |
FLATPACK |
FL16,.3 |
30 ns |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
e3 |
1 |
HC/UH |
|||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
37 ns |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Qualified |
COMPLEMENTARY |
4.5 V |
1 |
HC/UH |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
8 |
TRAY |
5 |
FLATPACK |
27 ns |
1.27 mm |
125 Cel |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
COMPLEMENTARY |
4.5 V |
e4 |
1 |
HC/UH |
||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
5 |
FLATPACK |
30 ns |
1.27 mm |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
1 |
HC/UH |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
8 |
5 |
FLATPACK |
27 ns |
1.27 mm |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
COMPLEMENTARY |
4.5 V |
1 |
HC/UH |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
4 |
5 |
FLATPACK |
30 ns |
1.27 mm |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
1 |
HCT |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MULTIPLEXER |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
200k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
CMOS |
MIL-PRF-38535 Class V |
4 |
5 |
5 |
50 pF |
FLATPACK |
FL16,.3 |
34 ns |
4 Amp |
Multiplexer/Demultiplexers |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.92 mm |
6.73 mm |
Not Qualified |
TRUE |
4.5 V |
NOT SPECIFIED |
1 |
NOT SPECIFIED |
HCT |
Multiplexers and demultiplexers are electronic circuits that are used to transmit and receive multiple signals over a single channel. They are essential components of digital systems and are used to reduce the number of transmission lines required to transmit multiple signals.
A multiplexer, also known as a mux, is a digital circuit that can select one of several input signals and transmit it to a single output line based on a control signal. A multiplexer can have two or more inputs and a single output, and the selection of the input is determined by the binary value of the control signal. Multiplexers are used to reduce the number of transmission lines required to transmit multiple signals over a long distance.
A demultiplexer, also known as a demux, is a digital circuit that can distribute a single input signal to one of several output lines based on a control signal. A demultiplexer can have a single input and two or more outputs, and the selection of the output is determined by the binary value of the control signal. Demultiplexers are used to receive multiple signals transmitted over a single line.
Multiplexers and demultiplexers are commonly used together in digital systems to transmit and receive multiple signals over a single channel. They are used in various applications, including digital signal processing, telecommunications, and data storage systems. Multiplexers and demultiplexers are also used in memory systems to store and retrieve data from memory cells.
Multiplexers and demultiplexers can be designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can also be cascaded together to increase the number of inputs or outputs.