Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | Input Conditioning | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | No. of Inverted Outputs | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Maximum Same Edge Skew (tskwd) | Minimum Operating Temperature | Terminal Finish | No. of True Outputs | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
2 |
1.8 |
1.8/2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
250 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1.89 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
1.71 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
TR |
5 |
-4.5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
.34 ns |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
5.7 V |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
19 mA |
NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V |
e0 |
1 |
2 mm |
100EL |
|||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.8 |
1.8 |
CHIP CARRIER |
LCC32,.2SQ,20 |
.3 ns |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1.89 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
1.71 V |
e3 |
30 |
1 |
260 |
5 mm |
7V |
|||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
ECL |
2 |
TR |
3.3 |
-5.2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
.47 ns |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
SERIES-RESISTOR |
-40 Cel |
TIN |
QUAD |
S-XQCC-N20 |
1 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
78 mA |
NECL MODE OPERATING RANGE: VCC = 0 V WITH VEE = -3.0 V TO -5.5 V |
e3 |
1 |
260 |
4 mm |
10E |
|||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
ECL |
4 |
RAIL |
3.3 |
-4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
.475 ns |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
65 mA |
NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; |
e3 |
30 |
1 |
260 |
4 mm |
100E |
|||||||||||||||||||
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
ECL |
2 |
TR |
2.5 |
-3.3/-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.65 ns |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
65 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V |
e0 |
1 |
235 |
4 mm |
100LVE |
||||||||||||||||||||||
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 |
ECL |
2 |
RAIL |
2.5 |
-3.3/-5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.65 ns |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
5.5 V |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
65 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -5.5V |
e0 |
1 |
235 |
4 mm |
100LVE |
||||||||||||||||||||||
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
TR |
3.3 |
-3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
.57 ns |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 |
3.8 V |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
30 mA |
NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V |
e0 |
1 |
2 mm |
100LVEL |
||||||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
2 |
TR |
1.2 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
47.7 ns |
.5 Amp |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
DUAL |
R-XDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
Not Qualified |
INVERTED |
.9 V |
e4 |
30 |
1 |
260 |
1.45 mm |
P |
|||||||||||||||||||
|
Onsemi |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
2 |
TR |
1.2 |
1.2/3.3 |
15 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
18.8 ns |
2 Amp |
Multiplexer/Demultiplexers |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
DUAL |
R-XDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
Not Qualified |
INVERTED |
.9 V |
e4 |
30 |
1 |
260 |
1.45 mm |
AUP/ULP/V |
|||||||||||||||||||
|
STMicroelectronics |
MULTIPLEXER AND DEMUX/DECODER |
NO LEAD |
56 |
RECTANGULAR |
UNSPECIFIED |
YES |
TR |
CHIP CARRIER |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N56 |
1 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
NO LEAD |
16 |
DIE |
RECTANGULAR |
300k Rad(Si) |
UNSPECIFIED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
3 |
UNCASED CHIP |
11 ns |
125 Cel |
-55 Cel |
UPPER |
R-XUUC-N16 |
6 V |
Qualified |
TRUE |
2 V |
1 |
AC |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
MULTIPLEXER |
MILITARY |
NO LEAD |
16 |
DIE |
RECTANGULAR |
300k Rad(Si) |
UNSPECIFIED |
YES |
4 |
CMOS |
MIL-PRF-38535 Class V |
2 |
3 |
UNCASED CHIP |
11 ns |
125 Cel |
-55 Cel |
UPPER |
R-XUUC-N16 |
6 V |
Qualified |
TRUE |
2 V |
1 |
AC |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
138 ns |
.35 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N6 |
2.75 V |
.35 mm |
1 mm |
TRUE |
.7 V |
1 |
1 mm |
AXP |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.3 ns |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
2.3 V |
ALSO OPERATES AT 3.6V TO 5.5V SUPPLY |
40 |
1 |
260 |
5 mm |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
TTL |
4 |
5 |
CHIP CARRIER |
15 ns |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
1.9 mm |
8.89 mm |
Not Qualified |
INVERTED |
4.5 V |
1 |
8.89 mm |
F/FAST |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
8 |
5 |
UNCASED CHIP |
57 ns |
125 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
5.5 V |
Not Qualified |
COMPLEMENTARY |
4.5 V |
1 |
HCT |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
CHIP CARRIER |
9.5 ns |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
1.905 mm |
8.89 mm |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
8.89 mm |
F/FAST |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
CHIP CARRIER |
10 ns |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
Not Qualified |
INVERTED |
4.5 V |
15 mA |
1 |
F/FAST |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
1 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
4 V |
e4 |
2 |
3.5 mm |
5DV |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
8 |
5 |
UNCASED CHIP |
255 ns |
125 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
6 V |
Not Qualified |
COMPLEMENTARY |
2 V |
1 |
HC/UH |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
1 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
1 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4 V |
e4 |
30 |
2 |
260 |
3.5 mm |
5DV |
||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
CHIP CARRIER |
10 ns |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
1.905 mm |
8.89 mm |
Not Qualified |
INVERTED |
4.5 V |
15 mA |
1 |
8.89 mm |
F/FAST |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
TTL |
4 |
5 |
50 pF |
CHIP CARRIER |
14 ns |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
1.905 mm |
8.89 mm |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
8.89 mm |
F/FAST |
||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
50 pF |
CHIP CARRIER |
9.5 ns |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
F/FAST |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
138 ns |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
2.75 V |
.5 mm |
1 mm |
TRUE |
.7 V |
1 |
1.45 mm |
AXP |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
6 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE |
138 ns |
.3 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
2.75 V |
.35 mm |
.9 mm |
TRUE |
.7 V |
1 |
1 mm |
AXP |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
TTL |
2 |
5 |
CHIP CARRIER |
9.5 ns |
125 Cel |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
1 |
F/FAST |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
TTL |
4 |
5 |
CHIP CARRIER |
14 ns |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
1.9 mm |
8.89 mm |
Not Qualified |
INVERTED |
4.5 V |
1 |
8.89 mm |
F/FAST |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
6 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE |
138 ns |
.3 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
2.75 V |
.35 mm |
.9 mm |
TRUE |
.7 V |
1 |
1 mm |
AXP |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.3 ns |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
2.3 V |
ALSO OPERATES AT 3.6V TO 5.5V SUPPLY |
40 |
1 |
260 |
5 mm |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
2 |
TTL |
4 |
5 |
50 pF |
CHIP CARRIER |
14 ns |
125 Cel |
3-STATE |
-55 Cel |
QUAD |
S-CQCC-N20 |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
23 mA |
1 |
F/FAST |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
4 |
CMOS |
2 |
5 |
UNCASED CHIP |
41 ns |
125 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
NOT APPLICABLE |
5.5 V |
Not Qualified |
TRUE |
4.5 V |
NOT SPECIFIED |
1 |
NOT SPECIFIED |
HCT |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
10 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N10 |
1 |
3.6 V |
.5 mm |
1.55 mm |
TRUE |
3 V |
e4 |
30 |
1 |
260 |
2 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.3 ns |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N20 |
3.6 V |
1 mm |
5 mm |
TRUE |
2.3 V |
ALSO OPERATES WITH 3.6 TO 5.5V SUPPLY |
e4 |
1 |
5 mm |
9544 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
21.7 ns |
1.7 Amp |
Decoder/Drivers |
.5 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
COMPLEMENTARY |
.8 V |
e3 |
30 |
2 |
260 |
1.45 mm |
AUP/ULP/V |
|||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
11.8 ns |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 |
3.6 V |
1 mm |
2.5 mm |
TRUE |
1.2 V |
1 |
3.5 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
1 |
5 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
.25 ns |
Other Logic ICs |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N16 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
2 |
260 |
3.5 mm |
3257 |
||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.3 ns |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
TRUE |
2.3 V |
ALSO OPERATES AT 3.6V TO 5.5V SUPPLY |
e4 |
1 |
5 mm |
9545 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.04,14 |
22.8 ns |
1.7 Amp |
Multiplexer/Demultiplexers |
.35 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
COMPLEMENTARY |
.8 V |
e3 |
30 |
1 |
260 |
1.35 mm |
AUP/ULP/V |
|||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
190 ns |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N16 |
1 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
e4 |
1 |
3.5 mm |
HC/UH |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.8 |
SMALL OUTLINE, VERY THIN PROFILE |
13 ns |
.35 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-N6 |
1 |
5.5 V |
.35 mm |
1 mm |
Not Qualified |
TRUE |
1.65 V |
e3 |
1 |
1 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
TR |
1.2 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
21.9 ns |
1.7 Amp |
Multiplexer/Demultiplexers |
.5 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
TRUE |
.8 V |
e3 |
30 |
1 |
260 |
1.45 mm |
AUP/ULP/V |
|||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
2 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
56 ns |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N16 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
4.5 V |
1 |
3.5 mm |
HCT |
|||||||||||||||||||||||||||||
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
8 |
5 |
UNCASED CHIP |
255 ns |
125 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
6 V |
Not Qualified |
COMPLEMENTARY |
2 V |
1 |
HC/UH |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
1 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.25 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N16 |
1 |
5.5 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
2 |
260 |
3.5 mm |
3257 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
21 ns |
1.7 Amp |
Multiplexer/Demultiplexers |
.5 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
INVERTED |
.8 V |
e3 |
30 |
1 |
260 |
1.45 mm |
AUP/ULP/V |
|||||||||||||||||||
|
NXP Semiconductors |
MULTIPLEXER AND DEMUX/DECODER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
18.9 ns |
1.7 Amp |
Decoder/Drivers |
.35 mm |
125 Cel |
3-STATE |
-40 Cel |
Tin (Sn) |
DUAL |
S-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
TRUE |
.8 V |
e3 |
30 |
2 |
260 |
1 mm |
AUP/ULP/V |
Multiplexers and demultiplexers are electronic circuits that are used to transmit and receive multiple signals over a single channel. They are essential components of digital systems and are used to reduce the number of transmission lines required to transmit multiple signals.
A multiplexer, also known as a mux, is a digital circuit that can select one of several input signals and transmit it to a single output line based on a control signal. A multiplexer can have two or more inputs and a single output, and the selection of the input is determined by the binary value of the control signal. Multiplexers are used to reduce the number of transmission lines required to transmit multiple signals over a long distance.
A demultiplexer, also known as a demux, is a digital circuit that can distribute a single input signal to one of several output lines based on a control signal. A demultiplexer can have a single input and two or more outputs, and the selection of the output is determined by the binary value of the control signal. Demultiplexers are used to receive multiple signals transmitted over a single line.
Multiplexers and demultiplexers are commonly used together in digital systems to transmit and receive multiple signals over a single channel. They are used in various applications, including digital signal processing, telecommunications, and data storage systems. Multiplexers and demultiplexers are also used in memory systems to store and retrieve data from memory cells.
Multiplexers and demultiplexers can be designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can also be cascaded together to increase the number of inputs or outputs.