Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | Input Conditioning | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | No. of Inverted Outputs | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Maximum Same Edge Skew (tskwd) | Minimum Operating Temperature | Terminal Finish | No. of True Outputs | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
TUBE |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.54 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.95 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e4 |
1 |
260 |
5 mm |
89547 |
||||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.39 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
140 mA |
SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY |
e4 |
1 |
260 |
5 mm |
58029 |
|||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.24 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
2.625 V |
.95 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V SUPPLY |
e4 |
40 |
1 |
260 |
3 mm |
58017 |
||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
TUBE |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.475 ns |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3 TO -5.5V |
e4 |
1 |
6.5 mm |
100E |
|||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
ECL |
2 |
TUBE |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.47 ns |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3 TO -5.5V |
e4 |
1 |
6.5 mm |
100E |
|||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.1 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
2.625 V |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
130 mA |
e4 |
1 |
260 |
5 mm |
89847 |
||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.47 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
2.625 V |
.95 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
IT CAN ALSO OPERATE WITH 3.3 VOLT SUPPLY |
e4 |
1 |
3 mm |
58610 |
||||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
TR |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.475 ns |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
ECL MODE: VCC = 0V WITH VEE = -3 TO -5.5V |
e4 |
1 |
6.5 mm |
100E |
|||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
TUBE |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.24 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
2.625 V |
.95 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V SUPPLY |
e4 |
40 |
1 |
260 |
3 mm |
58018 |
||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
8 |
TRAY |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
.45 ns |
.5 mm |
85 Cel |
.015 ns |
-40 Cel |
MATTE TIN |
4 |
QUAD |
4000 MHz |
S-XQCC-N44 |
2.625 V |
1 mm |
7 mm |
COMPLEMENTARY |
2.375 V |
200 mA |
ALSO OPERATES WITH 3.3V SUPPLY |
e3 |
1 |
7 mm |
58037 |
|||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
DIFFERENTIAL MUX |
1 |
8 |
TR |
2.5 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
.45 ns |
.5 mm |
85 Cel |
.015 ns |
-40 Cel |
MATTE TIN |
4 |
QUAD |
4000 MHz |
S-XQCC-N44 |
2.625 V |
1 mm |
7 mm |
COMPLEMENTARY |
2.375 V |
200 mA |
ALSO OPERATES WITH 3.3V SUPPLY |
e3 |
1 |
7 mm |
58037 |
|||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
4 |
TR |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.6 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
3.6 V |
.95 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e4 |
40 |
1 |
260 |
5 mm |
89545 |
||||||||||||||||||||||||
|
Microchip Technology |
MULTIPLEXER |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
8 |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.64 ns |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N44 |
2.625 V |
1 mm |
7 mm |
COMPLEMENTARY |
2.375 V |
ALSO OPERATES WITH 3.3V SUPPLY |
e3 |
1 |
7 mm |
89859 |
Multiplexers and demultiplexers are electronic circuits that are used to transmit and receive multiple signals over a single channel. They are essential components of digital systems and are used to reduce the number of transmission lines required to transmit multiple signals.
A multiplexer, also known as a mux, is a digital circuit that can select one of several input signals and transmit it to a single output line based on a control signal. A multiplexer can have two or more inputs and a single output, and the selection of the input is determined by the binary value of the control signal. Multiplexers are used to reduce the number of transmission lines required to transmit multiple signals over a long distance.
A demultiplexer, also known as a demux, is a digital circuit that can distribute a single input signal to one of several output lines based on a control signal. A demultiplexer can have a single input and two or more outputs, and the selection of the output is determined by the binary value of the control signal. Demultiplexers are used to receive multiple signals transmitted over a single line.
Multiplexers and demultiplexers are commonly used together in digital systems to transmit and receive multiple signals over a single channel. They are used in various applications, including digital signal processing, telecommunications, and data storage systems. Multiplexers and demultiplexers are also used in memory systems to store and retrieve data from memory cells.
Multiplexers and demultiplexers can be designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can also be cascaded together to increase the number of inputs or outputs.