LOGIC CIRCUIT Other Function Logic ICs 978

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74AUP1G58FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1		CMOS		1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.8 V		e4		260	1 mm	AUP/ULP/V
74AUP1G97W6-7	Diodes Incorporated	LOGIC CIRCUIT																									MATTE TIN										e3	30	260
74AUP1G97FW3-7	Diodes Incorporated	LOGIC CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
74AUP1G57W6-7	Diodes Incorporated	LOGIC CIRCUIT																									MATTE TIN										e3	30	260
74LVC1G57FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1		CMOS	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	24 Amp	Gates	.35 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AUP1G58FZ4-7	Diodes Incorporated	LOGIC CIRCUIT																									NICKEL PALLADIUM GOLD										e4	30	260
74AUP1G97FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1		CMOS		1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.8 V		e4		260	1 mm	AUP/ULP/V
74AUP1G98FZ4-7	Diodes Incorporated	LOGIC CIRCUIT																									NICKEL PALLADIUM GOLD										e4	30	260
74LVC1G98FZ4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1		CMOS	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	24 Amp	Gates	.5 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74AUP1G57FZ4-7	Diodes Incorporated	LOGIC CIRCUIT																									NICKEL PALLADIUM GOLD										e4	30	260
74AUP1G57DW-7	Diodes Incorporated	LOGIC CIRCUIT																									MATTE TIN										e3	30	260
74LVC1G97FZ4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1		CMOS	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	24 Amp	Gates	.5 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G58FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1		CMOS	TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	24 Amp	Gates	.35 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
MAX9383ESA+	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.75 V		e3	30	260	4.9 mm
MAX9382ESA	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.2 V		e0			4.9 mm
MAX9383EUA-T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e0		245	3 mm
MAX9382EUA+T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e3			3 mm
MAX9382EUA	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e0			3 mm
MAX9382ESA+T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.2 V		e3			4.9 mm
MAX9383EUA+T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e3			3 mm
MAX9383EUA+	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e3	30	260	3 mm
MAX9382EUA+	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e3	30	260	3 mm
MAX9383ESA-T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.75 V		e0			4.9 mm
MAX9382EUA-T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e0			3 mm
MAX9383ESA	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.75 V		e0			4.9 mm
MAX9382ESA-T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		5.5 V	1.75 mm	3.9 mm	Not Qualified	4.2 V		e0			4.9 mm
MAX9383ESA+T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.75 V		e3			4.9 mm
MAX9383EUA	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e0			3 mm
DS1223	Maxim Integrated	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY		NO			CMOS					IN-LINE	DIP24,.6		Other Logic ICs	2.54 mm	70 Cel			0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified			e0
DS1290	Maxim Integrated	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO			CMOS					IN-LINE	DIP16,.3		Other Logic ICs	2.54 mm	70 Cel			0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16					Not Qualified			e0
MAX9382ESA+	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE				1.27 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	4.2 V		e3	30	260	4.9 mm
TC5081AP	Toshiba	LOGIC CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	9	SIP	RECTANGULAR	PLASTIC/EPOXY		NO	1							IN-LINE				2.54 mm	75 Cel	3-STATE		-30 Cel	TIN LEAD	SINGLE	R-PSIP-T9		8 V	7.9 mm	3.2 mm	Not Qualified	4.5 V		e0			22.28 mm
TC7SP97TU	Toshiba	LOGIC CIRCUIT	INDUSTRIAL	FLAT	6	VSOF	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			SMALL OUTLINE, VERY THIN PROFILE				.65 mm	85 Cel			-40 Cel		DUAL	R-PDSO-F6		3.6 V	.75 mm	1.7 mm	Not Qualified	1.2 V					2 mm	S
TC7SX04BFE	Toshiba	LOGIC CIRCUIT	INDUSTRIAL	FLAT	5	VSOF	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		2.3			SMALL OUTLINE, VERY THIN PROFILE				.5 mm	85 Cel			-40 Cel		DUAL	R-PDSO-F5		3.6 V	.6 mm	1.2 mm		1.65 V					1.6 mm	HC/UH
TC7SP98TU	Toshiba	LOGIC CIRCUIT	INDUSTRIAL	FLAT	6	VSOF	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			SMALL OUTLINE, VERY THIN PROFILE				.65 mm	85 Cel			-40 Cel		DUAL	R-PDSO-F6		3.6 V	.75 mm	1.7 mm	Not Qualified	1.2 V					2 mm	S
TC7SP58FU(TE85LF)	Toshiba	LOGIC CIRCUIT
TC7SP57FU	Toshiba	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel		DUAL	R-PDSO-G6		3.6 V	1.1 mm	1.25 mm	Not Qualified	1.2 V					2 mm	S
TC7SP58FU	Toshiba	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel			-40 Cel		DUAL	R-PDSO-G6		3.6 V	1.1 mm	1.25 mm	Not Qualified	1.2 V					2 mm	S
TC7MP01FK	Toshiba	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	16	VSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1		CMOS		1.8	1.8/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP16,.16,20	2 Amp	Gates	.5 mm	85 Cel			-40 Cel		DUAL	R-PDSO-G16		3.6 V	1 mm	3 mm	Not Qualified	1.65 V					4 mm	P
RD74LVC1G97WPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.4 mm	85 Cel			-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
HD74LV1GW57ACME	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1		CMOS	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	6 Amp	Logic IC:Other	.65 mm	85 Cel			-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V		e6			2 mm	LV/LV-A/LVX/H
674R-01ILFT	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		3.3	3.3/5		SMALL OUTLINE, SHRINK PITCH	SSOP28,.25		Prescaler/Multivibrators	.635 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	3 V	ALSO OPERATES WITH 5V SUPPLY	e3	30	260	9.9 mm	674
HD74LVC1G97CPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel			-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD15LD74APT0	Renesas Electronics	LOGIC CIRCUIT	OTHER	THROUGH-HOLE	20	SDIP	RECTANGULAR	PLASTIC/EPOXY		NO	8	15000000 Hz	CMOS			3.3/5	30 pF	IN-LINE	SDIP20,.3	100 Amp	FF/Latches	1.78 mm	85 Cel	3-STATE	POSITIVE EDGE	-20 Cel		DUAL	R-PDIP-T20	1				Not Qualified
674R-01LFT	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		3.3	3.3/5		SMALL OUTLINE, SHRINK PITCH	SSOP28,.25		Prescaler/Multivibrators	.635 mm	70 Cel			0 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	3 V	ALSO OPERATES WITH 5V SUPPLY	e3	30	260	9.9 mm	674
HD74LVC1G58CLE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel			-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
674R-01LF	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		3.3	3.3/5		SMALL OUTLINE, SHRINK PITCH	SSOP28,.25		Prescaler/Multivibrators	.635 mm	70 Cel			0 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	3 V	ALSO OPERATES WITH 5V SUPPLY	e3	30	260	9.9 mm	674
HD74LVC1G58CPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel			-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.