Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N16 |
3 |
3.6 V |
.92 mm |
3 mm |
3 V |
e4 |
30 |
260 |
3 mm |
744 |
||||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TR |
3.3 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-CQCC-N16 |
3 |
3.6 V |
.92 mm |
3 mm |
Not Qualified |
3 V |
30 |
260 |
3 mm |
744 |
|||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TR |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
5.5 V |
1 mm |
3 mm |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
713 |
||||||||||||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
TR |
2.5 |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
39 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
3 mm |
86 |
||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N16 |
3 |
.92 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
850 |
|||||||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
2.7 V |
e3 |
3 mm |
713 |
|||||||||||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
RAIL |
2.5 |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
39 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
30 |
260 |
3 mm |
86 |
||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TR |
-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-CQCC-N16 |
3 |
.92 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
850 |
||||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TR |
3.3 |
3.3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
3.5 V |
1 mm |
3 mm |
Not Qualified |
3.1 V |
ALSO OPERATES ON 3.7 TO 5.5V SUPPLY |
e3 |
3 mm |
988 |
||||||||||||||||||
|
Texas Instruments |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
CMOS |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
2.625 V |
.8 mm |
5.5 mm |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
10 mm |
100 |
|||||||||||||||||||
Texas Instruments |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N54 |
2.625 V |
.8 mm |
5.5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
10 mm |
100 |
|||||||||||||||||||||||||||
Texas Instruments |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N54 |
2.625 V |
.8 mm |
5.5 mm |
2.375 V |
ALSO OPERATES AT 3.3 V SUPPLY |
10 mm |
100 |
|||||||||||||||||||||||||||
|
Texas Instruments |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
2.625 V |
.8 mm |
5.5 mm |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
10 mm |
100 |
||||||||||||||||||||
|
Texas Instruments |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
CMOS |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
2.625 V |
.8 mm |
5.5 mm |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
10 mm |
100 |
|||||||||||||||||||
|
Texas Instruments |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
2.625 V |
.8 mm |
5.5 mm |
COMPLEMENTARY |
2.375 V |
e3 |
30 |
260 |
10 mm |
100 |
||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
TR |
-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-CQCC-N16 |
3 |
.92 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
724 |
||||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Clock Drivers |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N16 |
.92 mm |
3 mm |
Not Qualified |
e4 |
3 mm |
720 |
||||||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N16 |
3 |
.92 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
724 |
|||||||||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
28000000000 Hz |
BICMOS |
TR |
-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
FF/Latches |
.5 mm |
85 Cel |
POSITIVE EDGE |
-40 Cel |
QUAD |
S-CQCC-N16 |
3 |
.92 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
853 |
|||||||||||||||||||
|
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
28000000000 Hz |
BICMOS |
-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
FF/Latches |
.5 mm |
85 Cel |
POSITIVE EDGE |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N16 |
3 |
.92 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
853 |
||||||||||||||||||
Analog Devices |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-CQCC-N16 |
.92 mm |
3 mm |
3 mm |
853 |
|||||||||||||||||||||||||||||||
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
TR |
2.5 |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
39 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
e0 |
235 |
3 mm |
86 |
||||||||||||||||
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
RAIL |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
50 mA |
e0 |
235 |
3 mm |
7L |
|||||||||||||||||
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
RAIL |
2.5 |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
39 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
e0 |
235 |
3 mm |
86 |
||||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
ECL |
TR |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
3.465 V |
1 mm |
3 mm |
2.375 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
7L |
||||||||||||||||||||||
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
TR |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
50 mA |
e0 |
235 |
3 mm |
7L |
|||||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
TR |
2.5 |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
39 mA |
NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
30 |
260 |
3 mm |
86 |
||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
RAIL |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
50 mA |
30 |
260 |
3 mm |
7L |
|||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
ECL |
RAIL |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
3.465 V |
1 mm |
3 mm |
2.375 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
7L |
||||||||||||||||||||||
|
Onsemi |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
1 |
ECL |
TR |
2.5 |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Gates |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
3.465 V |
1 mm |
3 mm |
Not Qualified |
2.375 V |
50 mA |
30 |
260 |
3 mm |
7L |
|||||||||||||||
NXP Semiconductors |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
3.6 V |
1 mm |
3 mm |
2.3 V |
3 mm |
9641 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TR, 13 INCH |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 |
3.6 V |
1 mm |
3 mm |
2.3 V |
e4 |
30 |
260 |
3 mm |
9641 |
||||||||||||||||||||
NXP Semiconductors |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
3.6 V |
1 mm |
3 mm |
2.3 V |
3 mm |
9641 |
||||||||||||||||||||||||||||
|
Renesas Electronics |
LOGIC CIRCUIT |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N100 |
3 |
3.465 V |
.9 mm |
12 mm |
3.135 V |
e3 |
260 |
12 mm |
8V |
|||||||||||||||||||||||
|
Renesas Electronics |
LOGIC CIRCUIT |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N100 |
3 |
3.465 V |
.9 mm |
12 mm |
3.135 V |
e3 |
260 |
12 mm |
8V |
Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.
Some of the commonly used other function logic ICs include:
1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.
2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.
3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.
4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.
5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.
Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.