RECTANGULAR Other Function Logic ICs 904

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935307123147	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V		e4	30	260	1 mm	AUP/ULP/V
935307128125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm		.8 V					1 mm	AUP/ULP/V
935307122147	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V		e4	30	260	1 mm	AUP/ULP/V
935302838125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE			.95 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm		1.65 V		e3	30	260	2.9 mm	LVC/LCX/Z
935338983147	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	1 mm	LVC/LCX/Z
935307171125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm		2 V		e3	30	260	2.05 mm	AHC/VHC/H/U/V
935307128147	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V		e4	30	260	1 mm	AUP/ULP/V
935300134084	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm		2.3 V	TERM PITCH-MAX		30	260	.65 mm	AUP/ULP/V
935302839125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm		1.65 V		e3	30	260	2 mm	LVC/LCX/Z
935304436125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE			.95 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm		1.65 V		e3	30	260	2.9 mm	LVC/LCX/Z
935307121125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm		.8 V					1 mm	AUP/ULP/V
935304437125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm		1.65 V		e3	30	260	2 mm	LVC/LCX/Z
935307182125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm		2 V		e3	30	260	2.05 mm	AHC/VHC/H/U/V
935307091125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm		2 V		e3	30	260	2.05 mm	AHC/VHC/H/U/V
935300134012	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm		2.3 V	TERM PITCH-MAX				.65 mm	AUP/ULP/V
935307121147	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V		e4	30	260	1 mm	AUP/ULP/V
935307073147	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	2.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		2.3 V	CAN ALSO OPERATE AT 3.3V NOMINAL	e4	30	260	1 mm	AUP/ULP/V
935307122125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm		.8 V					1 mm	AUP/ULP/V
935307346084	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm		.8 V	TERM PITCH-MAX		30	260	.65 mm	AUP/ULP/V
935307123125	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm		.8 V					1 mm	AUP/ULP/V
935307346012	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm		.8 V	TERM PITCH-MAX				.65 mm	AUP/ULP/V
74LVC1G97GX	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AUP1T98GW-Q100H	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	TR, 7 INCH	2.5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm		2.3 V	CAN ALSO OPERATE AT 5V NOMINAL	e3	30	260	2 mm	AUP/ULP/V
74AUP1T97UKZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm		2.3 V	TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1T97GXZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	2.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		2.3 V	CAN ALSO OPERATE AT 3.3V NOMINAL		30	260	1 mm	AUP/ULP/V
74AUP1T97UK	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm		2.3 V	CAN ALSO OPERATE AT 3.3V NOMINAL; TERM PITCH-MAX		30	260	.65 mm	AUP/ULP/V
74AUP1G97GXZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V			30	260	1 mm	AUP/ULP/V
74LVC1G97GXZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V			30	260	1 mm	LVC/LCX/Z
74AUP1G98GXZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V			30	260	1 mm	AUP/ULP/V
74AUP1G97UKAZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm		.8 V	TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1G58GXZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				125 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V			30	260	1 mm	AUP/ULP/V
74AUP1T97UKAZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm		2.3 V	TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1G97UKZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm		.8 V	TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1G97UK	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.1		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.23 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm		.8 V			30	260	.65 mm	AUP/ULP/V
74LVC1G58GV-Q100H	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE			.95 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm		1.65 V		e3	30	260	2.9 mm	LVC/LCX/Z
PI3B3251IQ	Diodes Incorporated		INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Logic ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16					Not Qualified			e0
PI3B16209A48	Diodes Incorporated		INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	Other Logic ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified			e0
PI3B162209A48	Diodes Incorporated		INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	Other Logic ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified			e0
PI74SSTV32852NBX	Diodes Incorporated	BUS DRIVER	COMMERCIAL	BALL	114	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			2.5	2.5	GRID ARRAY, FINE PITCH	BGA114,6X19,32	Other Logic ICs	.8 mm	70 Cel	0 Cel		BOTTOM	R-PBGA-B114					Not Qualified
PI5C3383SE	Diodes Incorporated		INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			5	5	SMALL OUTLINE	SOP24,.4	Other Logic ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24					Not Qualified
PI5C34X2383	Diodes Incorporated		INDUSTRIAL	GULL WING	80	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			5	5	SMALL OUTLINE, SHRINK PITCH	SSOP80,.25,20	Other Logic ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G80					Not Qualified			e0
PI3B3251IW	Diodes Incorporated		INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	Other Logic ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16					Not Qualified			e0
PI3B162209V48	Diodes Incorporated		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	Other Logic ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified			e0
PI13B16209A	Diodes Incorporated		INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	Other Logic ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified			e0
PI3B3251IL	Diodes Incorporated		INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Logic ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16					Not Qualified			e0
PI13B16209V	Diodes Incorporated		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	Other Logic ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G48					Not Qualified			e0
PI5C34X383	Diodes Incorporated		INDUSTRIAL	GULL WING	80	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			5	5	SMALL OUTLINE, SHRINK PITCH	SSOP80,.25,20	Other Logic ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G80					Not Qualified			e0
PI74ALVCH16260V56	Diodes Incorporated		INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	Other Logic ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G56					Not Qualified			e0

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.