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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935292879132	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		TR, 7 INCH	3			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	3.6 V	.35 mm	1 mm		2.3 V		e4	30	260	1 mm	AUP/ULP/V
935293185132	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	5.5 V	.5 mm	1 mm		1.65 V		e3	30	260	1 mm	LVC/LCX/Z
935293188132	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		TR, 7 INCH	1.8			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	5.5 V	.35 mm	1 mm		1.65 V		e3	30	260	1 mm	LVC/LCX/Z
935280472115	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		TR, 7 INCH	3			SMALL OUTLINE, VERY THIN PROFILE				.5 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm		2.3 V		e3	30	260	1.45 mm	AUP/ULP/V
935281329132	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm		.8 V		e3	30	260	1 mm	AUP/ULP/V
935281366132	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm		2.3 V		e3	30	260	1 mm	AUP/ULP/V
935280472132	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		TR, 7 INCH	3			SMALL OUTLINE, VERY THIN PROFILE				.5 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm		2.3 V		e3	30	260	1.45 mm	AUP/ULP/V
935280469115	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		TR, 7 INCH	3			SMALL OUTLINE, VERY THIN PROFILE				.5 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N6	1	3.6 V	.5 mm	1 mm		2.3 V		e3	30	260	1.45 mm	AUP/ULP/V
74LVC1G97FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	24 Amp	Gates	.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AUP1G98FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.8 V		e4		260	1 mm	AUP/ULP/V
74LVC1G98FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	24 Amp	Gates	.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AUP1G57FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.8 V		e4		260	1 mm	AUP/ULP/V
74AUP1G58FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.8 V		e4		260	1 mm	AUP/ULP/V
74LVC1G57FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	24 Amp	Gates	.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AUP1G97FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.1			SMALL OUTLINE, VERY THIN PROFILE				.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6		3.6 V	.4 mm	1 mm		.8 V		e4		260	1 mm	AUP/ULP/V
74LVC1G58FW4-7	Diodes Incorporated	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	3.3	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	24 Amp	Gates	.35 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	5.5 V	.4 mm	1 mm	Not Qualified	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
MAX9383EUA-T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e0		245	3 mm
MAX9382EUA+T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e3			3 mm
MAX9382EUA	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e0			3 mm
MAX9383EUA+T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e3			3 mm
MAX9383EUA+	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e3	30	260	3 mm
MAX9382EUA+	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e3	30	260	3 mm
MAX9382EUA-T	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				4.5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.2 V		e0			3 mm
MAX9383EUA	Maxim Integrated	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				5.2			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	Not Qualified	4.75 V		e0			3 mm
TC7MBL3126CFTG(EB)	Toshiba		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY		YES		CMOS				1.8/3.3		CHIP CARRIER	LCC16,.10SQ,20		Other Logic ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16					Not Qualified
TC7MB3257CFTG(EB)	Toshiba		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY		YES		CMOS			5	5		CHIP CARRIER	LCC16,.10SQ,20		Other Logic ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16					Not Qualified
TC7MBL3253CFTG(EB)	Toshiba		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY		YES		CMOS				1.8/3.3		CHIP CARRIER	LCC16,.10SQ,20		Other Logic ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16					Not Qualified
TC7MBL3125CFTG(EB)	Toshiba		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY		YES		CMOS				1.8/3.3		CHIP CARRIER	LCC16,.10SQ,20		Other Logic ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16					Not Qualified
83840BHT	Renesas Electronics		COMMERCIAL	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY		YES					2.5	2.5		GRID ARRAY, FINE PITCH	BGA64,11X11,20		Other Logic ICs	.5 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64					Not Qualified
HPL4-82C339-5	Renesas Electronics		COMMERCIAL	NO LEAD	28	QCCN	SQUARE	CERAMIC		YES		CMOS			5	5		CHIP CARRIER	LCC28,.45SQ		Other Logic ICs	1.27 mm	70 Cel	0 Cel		QUAD	S-XQCC-N28					Not Qualified
HPL4-82C338-5	Renesas Electronics		COMMERCIAL	NO LEAD	20	QCCN	SQUARE	CERAMIC		YES		CMOS			5	5		CHIP CARRIER	LCC20,.35SQ		Other Logic ICs	1.27 mm	70 Cel	0 Cel		QUAD	S-XQCC-N20					Not Qualified
HPL4-82C338-9	Renesas Electronics		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	CERAMIC		YES		CMOS			5	5		CHIP CARRIER	LCC20,.35SQ		Other Logic ICs	1.27 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20					Not Qualified
8V54816ANLG8	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	NO LEAD	100	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N100	3	3.465 V	.9 mm	12 mm		3.135 V		e3		260	12 mm	8V
HPL4-82C338-8	Renesas Electronics		MILITARY	NO LEAD	20	QCCN	SQUARE	CERAMIC		YES		CMOS	38535Q/M;38534H;883B		5	5		CHIP CARRIER	LCC20,.35SQ		Other Logic ICs	1.27 mm	125 Cel	-55 Cel		QUAD	S-XQCC-N20					Not Qualified
HPL4-82C339-8	Renesas Electronics		MILITARY	NO LEAD	28	QCCN	SQUARE	CERAMIC		YES		CMOS	38535Q/M;38534H;883B		5	5		CHIP CARRIER	LCC28,.45SQ		Other Logic ICs	1.27 mm	125 Cel	-55 Cel		QUAD	S-XQCC-N28					Not Qualified
HPL4-82C338-9+	Renesas Electronics		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	CERAMIC		YES		CMOS			5	5		CHIP CARRIER	LCC20,.35SQ		Other Logic ICs	1.27 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20
8V54816ANLG	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	NO LEAD	100	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N100	3	3.465 V	.9 mm	12 mm		3.135 V		e3		260	12 mm	8V
HPL4-82C339-9	Renesas Electronics		INDUSTRIAL	NO LEAD	28	QCCN	SQUARE	CERAMIC		YES		CMOS			5	5		CHIP CARRIER	LCC28,.45SQ		Other Logic ICs	1.27 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N28					Not Qualified
SLG7NT4180V	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	2				3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N12		3.6 V	.8 mm	2.5 mm		3 V	TWO DIFFRENT FUCTION AND AND OR FUCTION		NOT SPECIFIED	NOT SPECIFIED	2.5 mm	4180
SLG7NT4180VTR	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	2				3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N12		3.6 V	.8 mm	2.5 mm		3 V	TWO DIFFRENT FUCTION AND AND OR FUCTION				2.5 mm	4180
BCM8124	Broadcom	LOGIC CIRCUIT		BALL	127	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8			GRID ARRAY								BOTTOM	S-PBGA-B127	1				Not Qualified							8124

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.