COMMERCIAL Other Function Logic ICs 184

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SN74LS627FN	Texas Instruments	LOGIC CIRCUIT	COMMERCIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	TTL	5		CHIP CARRIER				70 Cel			QUAD	S-PQCC-J20		5.25 V			Not Qualified	4.75 V			NOT SPECIFIED	NOT SPECIFIED		LS
SN74LS448NP1	Texas Instruments		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL	5	5	IN-LINE	DIP20,.3	Other Logic ICs	2.54 mm	70 Cel			DUAL	R-PDIP-T20					Not Qualified
DS1291	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel		TIN LEAD	DUAL	R-PDIP-T16					Not Qualified			e0
DS1291N	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5		IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel		TIN LEAD	DUAL	R-PDIP-T16		5.5 V	4.572 mm	7.62 mm	Not Qualified	4.5 V		e0			19.175 mm
DS1292	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			IN-LINE	DIP24,.3	Other Logic ICs	2.54 mm	70 Cel		TIN LEAD	DUAL	R-PDIP-T24					Not Qualified			e0
DS1293N	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5		IN-LINE	DIP24,.3	Other Logic ICs	2.54 mm	70 Cel		TIN LEAD	DUAL	R-PDIP-T24		5.5 V	4.572 mm	7.62 mm	Not Qualified	4.5 V		e0			30.545 mm
DS1293	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			IN-LINE	DIP24,.3	Other Logic ICs	2.54 mm	70 Cel		TIN LEAD	DUAL	R-PDIP-T24					Not Qualified			e0
PCA9504ADGG/G,518	NXP Semiconductors	LOGIC CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	OPEN-DRAIN	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G56		3.6 V	1.2 mm	6.1 mm		3 V		e4			14 mm	9504
PCA9504ADGG-T	NXP Semiconductors	LOGIC CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	OPEN-DRAIN	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G56	1	3.6 V	1.2 mm	6.1 mm	Not Qualified	3 V		e4			14 mm
PCA9504ADGG	NXP Semiconductors	LOGIC CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	OPEN-DRAIN	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G56	1	3.6 V	1.2 mm	6.1 mm	Not Qualified	3 V		e4			14 mm
SSTL16877DGG,512	NXP Semiconductors	BUS DRIVER	COMMERCIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			2.5	2.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G48					Not Qualified
SSTUM32866EC/G,518	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			1.8	1.8	GRID ARRAY, FINE PITCH	BGA96,6X16,32	Other Logic ICs	.8 mm	70 Cel			BOTTOM	R-PBGA-B96					Not Qualified
SSTV16857EV,118	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	56	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			2.5	2.5	GRID ARRAY, FINE PITCH	BGA56,6X10,25	Other Logic ICs	.635 mm	70 Cel			BOTTOM	R-PBGA-B56					Not Qualified
SSTUM32868ET/G,518	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	176	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			1.8	1.8	GRID ARRAY, FINE PITCH	BGA176,8X22,25	Other Logic ICs	.635 mm	70 Cel			BOTTOM	R-PBGA-B176					Not Qualified
PCA9504ADGG/G,118	NXP Semiconductors	LOGIC CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	OPEN-DRAIN	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G56		3.6 V	1.2 mm	6.1 mm		3 V		e4			14 mm	9504
CBT6832DDGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832CDGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832EDGG,112	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832DGG,112	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832EDGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832DGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832CDGG,112	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
CBT6832DDGG,112	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel			DUAL	R-PDSO-G56					Not Qualified
SDA5650G	Infineon Technologies		COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5	5	SMALL OUTLINE	SOP20,.4	Other Logic ICs	1.27 mm	70 Cel		Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20					Not Qualified			e0
SDA5650A	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	5	5	IN-LINE	DIP14,.3	Other Logic ICs	2.54 mm	70 Cel		Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T14					Not Qualified			e0
PI74SSTV32852NBX	Diodes Incorporated	BUS DRIVER	COMMERCIAL	BALL	114	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	2.5	2.5	GRID ARRAY, FINE PITCH	BGA114,6X19,32	Other Logic ICs	.8 mm	70 Cel			BOTTOM	R-PBGA-B114					Not Qualified
DS1223	Maxim Integrated	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			IN-LINE	DIP24,.6	Other Logic ICs	2.54 mm	70 Cel		Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified			e0
DS1290	Maxim Integrated	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel		Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16					Not Qualified			e0
SSTUA32S869AHLF-T	Renesas Electronics	BUS DRIVER	COMMERCIAL	BALL	150	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	1.8	1.8	GRID ARRAY, FINE PITCH	BGA150,11X19,25	Other Logic ICs	.635 mm	70 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B150	3				Not Qualified			e1	30	260
HPL1-82C138-5	Renesas Electronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS	5	5	IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel			DUAL	R-XDIP-T16					Not Qualified
83840BHT	Renesas Electronics		COMMERCIAL	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			2.5	2.5	GRID ARRAY, FINE PITCH	BGA64,11X11,20	Other Logic ICs	.5 mm	70 Cel			BOTTOM	S-PBGA-B64					Not Qualified
HPL1-82C139-5	Renesas Electronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS	5	5	IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel			DUAL	R-XDIP-T16					Not Qualified
HPL4-82C339-5	Renesas Electronics		COMMERCIAL	NO LEAD	28	QCCN	SQUARE	CERAMIC	YES		CMOS	5	5	CHIP CARRIER	LCC28,.45SQ	Other Logic ICs	1.27 mm	70 Cel			QUAD	S-XQCC-N28					Not Qualified
HPL4-82C338-5	Renesas Electronics		COMMERCIAL	NO LEAD	20	QCCN	SQUARE	CERAMIC	YES		CMOS	5	5	CHIP CARRIER	LCC20,.35SQ	Other Logic ICs	1.27 mm	70 Cel			QUAD	S-XQCC-N20					Not Qualified
674R-01LFT	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Prescaler/Multivibrators	.635 mm	70 Cel		MATTE TIN	DUAL	R-PDSO-G28	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	3 V	ALSO OPERATES WITH 5V SUPPLY	e3	30	260	9.9 mm	674
674R-01LF	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Prescaler/Multivibrators	.635 mm	70 Cel		MATTE TIN	DUAL	R-PDSO-G28	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	3 V	ALSO OPERATES WITH 5V SUPPLY	e3	30	260	9.9 mm	674
8V54816ANLG8	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	NO LEAD	100	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel		MATTE TIN	QUAD	S-XQCC-N100	3	3.465 V	.9 mm	12 mm		3.135 V		e3		260	12 mm	8V
SSTUF32864AH-T	Renesas Electronics	BUS DRIVER	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	1.8	1.8	GRID ARRAY, FINE PITCH	BGA96,6X16,32	Other Logic ICs	.8 mm	70 Cel		Tin/Lead (Sn63Pb37)	BOTTOM	R-PBGA-B96	3				Not Qualified			e0	30	225
8V54816ANLG	Renesas Electronics	LOGIC CIRCUIT	COMMERCIAL	NO LEAD	100	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel		MATTE TIN	QUAD	S-XQCC-N100	3	3.465 V	.9 mm	12 mm		3.135 V		e3		260	12 mm	8V
HBCR-1800	Broadcom		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	5	5	IN-LINE	DIP40,.6	Other Logic ICs	2.54 mm	70 Cel		Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified			e0

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.