BALL Other Function Logic ICs 59

Reset All

Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SN74LVC1G97YZPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS	3	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	16.4 ns	32 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B6	1	5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V	.01 mA		e1	NOT SPECIFIED	260	1.4 mm	LVC/LCX/Z
SN74LVC1G58YEAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G58YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G58YZAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SSTU32864EC/G	Texas Instruments	BUS DRIVER	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS			1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32			Other Logic ICs	.8 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B96					Not Qualified
SSTU32864EC	Texas Instruments	BUS DRIVER	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS			1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32			Other Logic ICs	.8 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B96					Not Qualified
SN74LVC1G97YZAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G57YEAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G57YZAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74AUP1G98YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified		.8 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	AUP/ULP/V
SN74AUP1G97YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified		.8 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	AUP/ULP/V
SN74LVC1G98YEAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74AUP1G57YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified		.8 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	AUP/ULP/V
SN74LVC1G97YEAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74AUP1G99YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA8,2X4,20		1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B8		3.6 V	.5 mm	.9 mm	Not Qualified		.8 V				NOT SPECIFIED	NOT SPECIFIED	1.9 mm	AUP/ULP/V
SN74AUP1G58YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified		.8 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	AUP/ULP/V
SN74LVC1G98YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G98YZAR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G57YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74AUP1G99YZPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS		TR	1.1	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA8,2X4,20		4 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B8	1	3.6 V	.5 mm	.9 mm	Not Qualified	TRUE	.8 V			e1	NOT SPECIFIED	260	1.9 mm	AUP/ULP/V
SN74LVC1G97YEPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V				NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74AUP1G58YZTR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS		TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6	1	3.6 V	.625 mm	.9 mm	Not Qualified		.8 V			e1	30	260	1.4 mm	AUP/ULP/V
NBSG86AMAG	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	TBGA	SQUARE	UNSPECIFIED	NO	YES	1	ECL			2.5	+-2.5/+-3.3		GRID ARRAY, THIN PROFILE	LGA16,4X4,40			Gates	1 mm	70 Cel		-40 Cel	MATTE TIN	BOTTOM	S-XBGA-B16		3.465 V	1.03 mm	4 mm	Not Qualified		2.375 V	39 mA	NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V	e3			4 mm	86
NBSG86ABAR2	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1	ECL		TR	2.5	+-2.5/+-3.3		GRID ARRAY, LOW PROFILE	BGA16,4X4,40			Gates	1 mm	70 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	3	3.465 V	1.4 mm	4 mm	Not Qualified		2.375 V	39 mA	NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V	e0			4 mm	86
NBSG86ABAHTBG	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1	ECL		TR	2.5	+-2.5/+-3.3		GRID ARRAY, LOW PROFILE	BGA16,4X4,40			Gates	1 mm	70 Cel		-40 Cel		BOTTOM	S-PBGA-B16		3.465 V	1.4 mm	4 mm	Not Qualified		2.375 V	39 mA	NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V				4 mm	86
NBSG86AMAHTBG	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	TBGA	SQUARE	UNSPECIFIED		YES	1				2.5			GRID ARRAY, THIN PROFILE					1 mm	70 Cel		-40 Cel		BOTTOM	S-XBGA-B16		3.465 V	1.03 mm	4 mm	Not Qualified		2.375 V		NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V		NOT SPECIFIED	NOT SPECIFIED	4 mm	86
NBSG86AMA1TBG	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	TBGA	SQUARE	UNSPECIFIED	NO	YES	1	ECL			2.5	+-2.5/+-3.3		GRID ARRAY, THIN PROFILE	LGA16,4X4,40			Gates	1 mm	70 Cel		-40 Cel	MATTE TIN	BOTTOM	S-XBGA-B16		3.465 V	1.03 mm	4 mm	Not Qualified		2.375 V	39 mA	NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V	e3			4 mm	86
NBSG86ABAG	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY		YES	1				2.5			GRID ARRAY, LOW PROFILE					1 mm	70 Cel		-40 Cel		BOTTOM	S-PBGA-B16		3.465 V	1.4 mm	4 mm	Not Qualified		2.375 V		NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V		NOT SPECIFIED	NOT SPECIFIED	4 mm	86
NBSG86ABA	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1	ECL		TRAY	2.5	+-2.5/+-3.3		GRID ARRAY, LOW PROFILE	BGA16,4X4,40			Gates	1 mm	70 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	3	3.465 V	1.4 mm	4 mm	Not Qualified		2.375 V	39 mA	NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V	e0			4 mm	86
NBSG86ABAR2G	Onsemi	LOGIC CIRCUIT	OTHER	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY		YES	1				2.5			GRID ARRAY, LOW PROFILE					1 mm	70 Cel		-40 Cel		BOTTOM	S-PBGA-B16		3.465 V	1.4 mm	4 mm	Not Qualified		2.375 V		NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V		NOT SPECIFIED	NOT SPECIFIED	4 mm	86
SSTUB32866EC/S,518	NXP Semiconductors	BUS DRIVER	OTHER	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES					1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32			Other Logic ICs	.8 mm	85 Cel		0 Cel		BOTTOM	R-PBGA-B96					Not Qualified
SSTUM32866EC/G,518	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES					1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32			Other Logic ICs	.8 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B96					Not Qualified
SSTV16857EV,118	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	56	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES					2.5	2.5		GRID ARRAY, FINE PITCH	BGA56,6X10,25			Other Logic ICs	.635 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B56					Not Qualified
SSTUM32868ET/G,518	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	176	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES					1.8	1.8		GRID ARRAY, FINE PITCH	BGA176,8X22,25			Other Logic ICs	.635 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B176					Not Qualified
935300134084	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS						GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm			2.3 V		TERM PITCH-MAX		30	260	.65 mm	AUP/ULP/V
935300134012	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS						GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm			2.3 V		TERM PITCH-MAX				.65 mm	AUP/ULP/V
935307346084	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			1.1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm			.8 V		TERM PITCH-MAX		30	260	.65 mm	AUP/ULP/V
935307346012	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			1.1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm			.8 V		TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1T97UKZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS						GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm			2.3 V		TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1T97UK	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			2.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm			2.3 V		CAN ALSO OPERATE AT 3.3V NOMINAL; TERM PITCH-MAX		30	260	.65 mm	AUP/ULP/V
74AUP1G97UKAZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			1.1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm			.8 V		TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1T97UKAZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS						GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm			2.3 V		TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1G97UKZ	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			1.1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.3 mm	.44 mm			.8 V		TERM PITCH-MAX				.65 mm	AUP/ULP/V
74AUP1G97UK	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			1.1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.23 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B6	1	3.6 V	.3 mm	.44 mm			.8 V				30	260	.65 mm	AUP/ULP/V
PI74SSTV32852NBX	Diodes Incorporated	BUS DRIVER	COMMERCIAL	BALL	114	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS			2.5	2.5		GRID ARRAY, FINE PITCH	BGA114,6X19,32			Other Logic ICs	.8 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B114					Not Qualified
SSTUA32S869AHLF-T	Renesas Electronics	BUS DRIVER	COMMERCIAL	BALL	150	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS			1.8	1.8		GRID ARRAY, FINE PITCH	BGA150,11X19,25			Other Logic ICs	.635 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B150	3				Not Qualified					e1	30	260
RD74LVC1G97WPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.4 mm	.7 mm	Not Qualified		1.65 V						1.1 mm	LVC/LCX/Z
83840BHT	Renesas Electronics		COMMERCIAL	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY		YES					2.5	2.5		GRID ARRAY, FINE PITCH	BGA64,11X11,20			Other Logic ICs	.5 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B64					Not Qualified

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.