NXP Semiconductors Other Function Logic ICs 224

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935292916132	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N6		5.5 V	.35 mm	1 mm		1.65 V		NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
74AHC1G4212GW,125	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		2 V				2.05 mm	AHC/VHC/H/U/V
935276073125	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.95 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.5 mm		1.65 V		NOT SPECIFIED	NOT SPECIFIED	2.9 mm	LVC/LCX/Z
HEC4751VD	NXP Semiconductors	LOGIC CIRCUIT	MILITARY	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS				IN-LINE				125 Cel		-55 Cel		DUAL	R-CDIP-T28		15 V			Not Qualified	3 V					4751
SSTUB32866EC/S,518	NXP Semiconductors	BUS DRIVER	OTHER	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				1.8	1.8	GRID ARRAY, FINE PITCH	BGA96,6X16,32	Other Logic ICs	.8 mm	85 Cel		0 Cel		BOTTOM	R-PBGA-B96					Not Qualified
74HCT297D-T	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE				125 Cel		-40 Cel		DUAL	R-PDSO-G16		5.5 V			Not Qualified	4.5 V					HCT
74HCT297DB	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		5.5 V	2 mm	5.3 mm	Not Qualified	4.5 V				6.2 mm	HCT
PCA9504ADGG	NXP Semiconductors	LOGIC CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	OPEN-DRAIN	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G56	1	3.6 V	1.2 mm	6.1 mm	Not Qualified	3 V	e4			14 mm
74HC297D	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE				125 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V			Not Qualified	2 V					HC/UH
SSTL16877DGG,512	NXP Semiconductors	BUS DRIVER	COMMERCIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				2.5	2.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G48					Not Qualified
74AHC1G4212GM	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		2 V				1.45 mm	AHC/VHC/H/U/V
HEC4751VDBF	NXP Semiconductors	LOGIC CIRCUIT	MILITARY	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS				IN-LINE			2.54 mm	125 Cel		-55 Cel		DUAL	R-CDIP-T28			5.84 mm	15.24 mm	Not Qualified						4751
74HCT297N	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5		IN-LINE				125 Cel		-40 Cel		DUAL	R-PDIP-T16		5.5 V			Not Qualified	4.5 V					HCT
74HC297NB	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5		IN-LINE			2.54 mm	125 Cel		-40 Cel		DUAL	R-PDIP-T16		6 V	4.06 mm	7.62 mm	Not Qualified	2 V				19.09 mm	HC/UH
PCA9641BSHP	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TR, 13 INCH	3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	3.6 V	1 mm	3 mm		2.3 V	e4	30	260	3 mm	9641
PCA9641PW	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		3.6 V	1.1 mm	4.4 mm		2.3 V		NOT SPECIFIED	NOT SPECIFIED	5 mm	9641
74HCT297PW-T	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		5.5 V	1.1 mm	4.4 mm	Not Qualified	4.5 V				5 mm	HCT
SSTUM32866EC/G,518	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				1.8	1.8	GRID ARRAY, FINE PITCH	BGA96,6X16,32	Other Logic ICs	.8 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B96					Not Qualified
74HCT297D	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE				125 Cel		-40 Cel		DUAL	R-PDSO-G16		5.5 V			Not Qualified	4.5 V					HCT
935277211132	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		1.65 V		NOT SPECIFIED	NOT SPECIFIED	1.45 mm	LVC/LCX/Z
74HC297DB	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V	2 mm	5.3 mm	Not Qualified	2 V				6.2 mm	HC/UH
SSTV16857EV,118	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	56	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				2.5	2.5	GRID ARRAY, FINE PITCH	BGA56,6X10,25	Other Logic ICs	.635 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B56					Not Qualified
PCA9641PW,118	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		3.6 V	1.1 mm	4.4 mm		2.3 V				5 mm	9641
74AHC1G4210GW,125	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		2 V				2.05 mm	AHC/VHC/H/U/V
PCA9641BSJ	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16		3.6 V	1 mm	3 mm		2.3 V				3 mm	9641
SSTUM32868ET/G,518	NXP Semiconductors	BUS DRIVER	COMMERCIAL	BALL	176	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				1.8	1.8	GRID ARRAY, FINE PITCH	BGA176,8X22,25	Other Logic ICs	.635 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B176					Not Qualified
74AHC1G4210GM	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N6		5.5 V	.5 mm	1 mm		2 V				1.45 mm	AHC/VHC/H/U/V
74HC297D-T	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE				125 Cel		-40 Cel		DUAL	R-PDSO-G16		6 V			Not Qualified	2 V					HC/UH
PCA9504ADGG/G,118	NXP Semiconductors	LOGIC CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	OPEN-DRAIN	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G56		3.6 V	1.2 mm	6.1 mm		3 V	e4			14 mm	9504
HEF4751VTD-T	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G28		12.5 V	2.65 mm	7.5 mm	Not Qualified	4.5 V				17.9 mm	4751
HEF4751VT-T	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		12.5 V	2.65 mm	7.5 mm	Not Qualified	4.5 V	e4			17.9 mm	4751
CBT6832DDGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G56					Not Qualified
CBT6832CDGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G56					Not Qualified
HEF4094BN	NXP Semiconductors
HEF4094BF	NXP Semiconductors
HEF4751VTD	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G28		12.5 V	2.65 mm	7.5 mm	Not Qualified	4.5 V				17.9 mm	4751
HEF4751VT	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5	5/10	SMALL OUTLINE	SOP28,.4	Prescaler/Multivibrators	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		12.5 V	2.65 mm	7.5 mm	Not Qualified	4.5 V	e4			17.9 mm	4751
CBTV4020EE,557	NXP Semiconductors
935303675128	NXP Semiconductors	LOGIC CIRCUIT																				Nickel/Palladium/Gold (Ni/Pd/Au)			1						e4
CBT6832EDGG,112	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G56					Not Qualified
CBT16292DG-T	NXP Semiconductors		INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G56					Not Qualified
CBT6832DGG,112	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G56					Not Qualified
CBT6832EDGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G56					Not Qualified
CBT6832DGG,118	NXP Semiconductors		COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	Other Logic ICs	.5 mm	70 Cel		0 Cel		DUAL	R-PDSO-G56					Not Qualified
HEF4751VDF	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS		5		IN-LINE			2.54 mm	85 Cel		-40 Cel		DUAL	R-GDIP-T28		12.5 V	5.84 mm	15.24 mm	Not Qualified	4.5 V					4751
HEF4751VD	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS		5	5/10	IN-LINE	DIP28,.6	Prescaler/Multivibrators	2.54 mm	85 Cel		-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-GDIP-T28		12.5 V	5.84 mm	15.24 mm	Not Qualified	4.5 V	e3/e4				4751
HEF4751VPN	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5		IN-LINE			2.54 mm	85 Cel		-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		12.5 V	5.1 mm	15.24 mm	Not Qualified	4.5 V	e3/e4			35.5 mm	4751
935303676118	NXP Semiconductors	LOGIC CIRCUIT																				NICKEL PALLADIUM GOLD			1						e4	30	260

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.