DDR DRAM MODULE DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

KVR16S11S8/4

Kingston Technology Company

DDR DRAM MODULE

OTHER

204

DIMM

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

1.5

64

MICROELECTRONIC ASSEMBLY

85 Cel

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N204

1.575 V

30 mm

34359738368 bit

1.425 V

PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

67.6 mm

AS4C512M16D3LA-10BIN

Alliance Memory

DDR DRAM MODULE

INDUSTRIAL

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

512MX16

512M

-40 Cel

BOTTOM

1

R-PBGA-B96

3

1.425 V

1.2 mm

9 mm

8589934592 bit

1.275 V

AUTO/SELF REFRESH

13.5 mm

AS4C512M16D3LA-10BCN

Alliance Memory

DDR DRAM MODULE

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

512MX16

512M

0 Cel

BOTTOM

1

R-PBGA-B96

3

1.425 V

1.2 mm

9 mm

8589934592 bit

1.275 V

AUTO/SELF REFRESH

13.5 mm

KVR16LN11/4

Kingston Technology Company

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

1.35

64

MICROELECTRONIC ASSEMBLY

85 Cel

512MX64

512M

0 Cel

GOLD

DUAL

1

R-XDMA-N240

1.45 V

30 mm

34359738368 bit

1.28 V

PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM

e4

133.35 mm

KVR16LS11/4

Kingston Technology Company

DDR DRAM MODULE

OTHER

204

DIMM

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

1.35

64

MICROELECTRONIC ASSEMBLY

85 Cel

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N204

1.45 V

30.12 mm

34359738368 bit

1.28 V

PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

NOT SPECIFIED

NOT SPECIFIED

67.6 mm

KVR16LS11/8

Kingston Technology Company

DDR DRAM MODULE

OTHER

204

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1073741824 words

COMMON

1.35

1.35

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

85 Cel

3-STATE

1GX64

1G

0 Cel

DUAL

R-PDMA-N204

800 MHz

Not Qualified

68719476736 bit

.225 ns

KVR16LN11/8

Kingston Technology Company

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

1.35

64

MICROELECTRONIC ASSEMBLY

85 Cel

1GX64

1G

0 Cel

DUAL

1

R-XDMA-N240

1.45 V

30 mm

68719476736 bit

1.28 V

ALSO OPERATES AT 1.5V ; PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM

133.35 mm

MT8HTF12864HDZ-667H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1430 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.45 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

3.6 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH; WD-MAX

e4

.056 Amp

67.6 mm

.4 ns

MT36KSF2G72PZ-1G6E1

Micron Technology

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.35

72

MICROELECTRONIC ASSEMBLY

8

1 mm

95 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N240

1.45 V

30.5 mm

4 mm

154618822656 bit

1.283 V

SELF REFRESH; WD-MAX

NOT SPECIFIED

NOT SPECIFIED

133.35 mm

MTA16ATF2G64HZ-2G6E1

Micron Technology

DDR DRAM MODULE

OTHER

260

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

64

MICROELECTRONIC ASSEMBLY

95 Cel

2GX64

2G

0 Cel

ZIG-ZAG

1

R-XZMA-N260

1.26 V

30.13 mm

3.7 mm

137438953472 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

69.6 mm

AS4C512M16D3LA-10BCNTR

Alliance Memory

DDR DRAM MODULE

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

512MX16

512M

0 Cel

BOTTOM

1

R-PBGA-B96

3

1.425 V

1.2 mm

9 mm

8589934592 bit

1.275 V

AUTO/SELF REFRESH

13.5 mm

M393A1G40DB0-CPB

Samsung

DDR DRAM MODULE

288

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

1GX72

1G

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

77309411328 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

NOT SPECIFIED

NOT SPECIFIED

133.35 mm

HMA84GR7CJR4N-VK

Sk Hynix

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4294967296 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

85 Cel

4GX72

4G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

30.88 mm

3.98 mm

309237645312 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

HMT42GR7BFR4A-PB

Sk Hynix

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.35

72

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N240

1.45 V

30.33 mm

7.65 mm

154618822656 bit

1.283 V

AUTO/SELF REFRESH; WD-MAX

20

260

133.75 mm

M393A4K40BB1-CRC

Samsung

DDR DRAM MODULE

OTHER

288

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4294967296 words

YES

COMMON

1.2

1.2

72

MICROELECTRONIC ASSEMBLY

DIMM288,33

Other Memory ICs

.85 mm

85 Cel

3-STATE

4GX72

4G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

1200 MHz

3.9 mm

Not Qualified

309237645312 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

NOT SPECIFIED

NOT SPECIFIED

133.35 mm

.175 ns

MT16KTF1G64HZ-1G9P1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.35

64

MICROELECTRONIC ASSEMBLY

70 Cel

1GX64

1G

0 Cel

ZIG-ZAG

1

R-XZMA-N204

1.45 V

30.15 mm

3.8 mm

68719476736 bit

1.283 V

SELF REFRESH; WD-MAX

30

260

67.6 mm

MT8HTF12864HDZ-800M1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.8

64

MICROELECTRONIC ASSEMBLY

70 Cel

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N200

1.9 V

30.15 mm

3.8 mm

8589934592 bit

1.7 V

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX

67.6 mm

KVR1333D3S9/4GKC

Kingston Technology Company

DDR DRAM MODULE

MTA36ASF4G72PZ-2G3B1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4294967296 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

95 Cel

4GX72

4G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

309237645312 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

M378T2953EZ3-CE6

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1760 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

333 MHz

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH

260

.128 Amp

.45 ns

MTA9ADF1G72AZ-3G2E1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

95 Cel

1GX72

1G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

18.9 mm

2.7 mm

77309411328 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

HMA82GR7CJR8N-VK

Sk Hynix

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

85 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

30.88 mm

3.98 mm

154618822656 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

M393A2K40CB1-CRC

Samsung

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

95 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

4.3 mm

154618822656 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

MTA36ASF2G72PZ-2G1B1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

85 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

154618822656 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

MTA4ATF51264HZ-2G3B1

Micron Technology

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

1.2

64

MICROELECTRONIC ASSEMBLY

95 Cel

512MX64

512M

0 Cel

ZIG-ZAG

1

R-XZMA-N260

1.26 V

30.13 mm

2.5 mm

34359738368 bit

1.14 V

WD-MAX

69.6 mm

M471B5173QH0-YK0

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.35

64

MICROELECTRONIC ASSEMBLY

.6 mm

85 Cel

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N204

1.45 V

30.13 mm

3.8 mm

34359738368 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX

67.6 mm

MTA4ATF51264HZ-2G6E1

Micron Technology

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

1.2

64

MICROELECTRONIC ASSEMBLY

95 Cel

512MX64

512M

0 Cel

ZIG-ZAG

1

R-XZMA-N260

1.26 V

30.13 mm

2.5 mm

34359738368 bit

1.14 V

WD-MAX

69.6 mm

MTA8ATF51264HZ-2G6B1

Micron Technology

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

85 Cel

512MX72

512M

0 Cel

ZIG-ZAG

1

R-XZMA-N260

1.26 V

30.13 mm

3.7 mm

38654705664 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

NOT SPECIFIED

NOT SPECIFIED

69.6 mm

MT16KTF2G64HZ-1G6A1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.35

64

MICROELECTRONIC ASSEMBLY

70 Cel

2GX64

2G

0 Cel

ZIG-ZAG

1

R-XZMA-N204

1.45 V

30.15 mm

3.8 mm

137438953472 bit

1.283 V

SELF REFRESH; WD-MAX

30

260

67.6 mm

MT18KSF51272HZ-1G6K2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.35

72

MICROELECTRONIC ASSEMBLY

.6 mm

70 Cel

512MX72

512M

0 Cel

ZIG-ZAG

1

R-XZMA-N204

1.45 V

30.15 mm

3.8 mm

38654705664 bit

1.283 V

AUTO/SELF REFRESH; WD-MAX

67.6 mm

MTA8ATF1G64HZ-3G2J1

Micron Technology

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.2

64

MICROELECTRONIC ASSEMBLY

95 Cel

1GX64

1G

0 Cel

DUAL

1

R-XDMA-N260

1.26 V

30.13 mm

3.7 mm

68719476736 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

69.6 mm

M471B5273DH0-CH9

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1240 mA

536870912 words

YES

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

85 Cel

3-STATE

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N204

1.575 V

30.15 mm

667 MHz

3.8 mm

Not Qualified

34359738368 bit

1.425 V

AUTO/SELF REFRESH; WD-MAX

.192 Amp

67.6 mm

.255 ns

M378B5273DH0-CH9

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1240 mA

536870912 words

YES

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

30.15 mm

667 MHz

Not Qualified

34359738368 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.192 Amp

133.35 mm

20 ns

M471A1K43CB1-CRC

Samsung

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

1.2

64

MICROELECTRONIC ASSEMBLY

85 Cel

1GX64

1G

0 Cel

DUAL

1

R-XDMA-N260

68719476736 bit

MT8JTF12864HZ-1G6G1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

204

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

4800 mA

134217728 words

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

MATTE TIN

DUAL

R-PDMA-N204

1

800 MHz

Not Qualified

8589934592 bit

e3

.096 Amp

.225 ns

M378B5773DH0-CH9

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1080 mA

268435456 words

YES

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

30.15 mm

667 MHz

Not Qualified

17179869184 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.096 Amp

133.35 mm

20 ns

MTA18ASF1G72HZ-2G1A1

Micron Technology

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

85 Cel

1GX72

1G

0 Cel

ZIG-ZAG

1

R-XZMA-N260

1.26 V

30.13 mm

3.7 mm

77309411328 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

NOT SPECIFIED

NOT SPECIFIED

69.6 mm

M378T2863DZS-CE6

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1920 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

4 mm

333 MHz

30 mm

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH

260

133.35 mm

.45 ns

MT8JTF25664AZ-1G4D1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

3080 mA

268435456 words

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

70 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

R-PDMA-N240

667 MHz

Not Qualified

17179869184 bit

.096 Amp

MTA16ATF2G64AZ-3G2E1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

64

MICROELECTRONIC ASSEMBLY

85 Cel

2GX64

2G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

137438953472 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

MTA18ASF2G72AZ-2G3A1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

85 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

154618822656 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

MTA18ASF2G72AZ-2G3B1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2147483648 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

85 Cel

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

154618822656 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

MTA4ATF51264AZ-2G3B1

Micron Technology

DDR DRAM MODULE

OTHER

288

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

1.2

64

MICROELECTRONIC ASSEMBLY

85 Cel

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

2.7 mm

34359738368 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

M378B5673EH1-CF8

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1640 mA

268435456 words

YES

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

533 MHz

Not Qualified

17179869184 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.16 Amp

.3 ns

M378B5673EH1-CH9

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2120 mA

268435456 words

YES

COMMON

1.5

1.5

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

667 MHz

Not Qualified

17179869184 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.16 Amp

.255 ns

M378T2863QZS-CF7

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2000 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

400 MHz

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH

260

.4 ns

M378T5663QZ3-CF7

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2280 mA

268435456 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

400 MHz

Not Qualified

17179869184 bit

1.7 V

AUTO/SELF REFRESH

260

.24 Amp

.4 ns

M386A8K40BM1-CRC

Samsung

DDR DRAM MODULE

288

DIMM

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

8589934592 words

YES

1.2

72

MICROELECTRONIC ASSEMBLY

.85 mm

8GX72

8G

DUAL

1

R-XDMA-N288

1.26 V

31.4 mm

3.9 mm

618475290624 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

133.35 mm

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.