Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Kingston Technology Company |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
30 mm |
34359738368 bit |
1.425 V |
PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
67.6 mm |
|||||||||||||||||||||||||||
|
Alliance Memory |
DDR DRAM MODULE |
INDUSTRIAL |
96 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
95 Cel |
512MX16 |
512M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B96 |
3 |
1.425 V |
1.2 mm |
9 mm |
8589934592 bit |
1.275 V |
AUTO/SELF REFRESH |
13.5 mm |
|||||||||||||||||||||||||
|
Alliance Memory |
DDR DRAM MODULE |
OTHER |
96 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
95 Cel |
512MX16 |
512M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B96 |
3 |
1.425 V |
1.2 mm |
9 mm |
8589934592 bit |
1.275 V |
AUTO/SELF REFRESH |
13.5 mm |
|||||||||||||||||||||||||
Kingston Technology Company |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX64 |
512M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30 mm |
34359738368 bit |
1.28 V |
PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM |
e4 |
133.35 mm |
||||||||||||||||||||||||||||
|
Kingston Technology Company |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.45 V |
30.12 mm |
34359738368 bit |
1.28 V |
PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
67.6 mm |
|||||||||||||||||||||||||||
|
Kingston Technology Company |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1073741824 words |
COMMON |
1.35 |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
1GX64 |
1G |
0 Cel |
DUAL |
R-PDMA-N204 |
800 MHz |
Not Qualified |
68719476736 bit |
.225 ns |
||||||||||||||||||||||||||||
Kingston Technology Company |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX64 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30 mm |
68719476736 bit |
1.28 V |
ALSO OPERATES AT 1.5V ; PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM |
133.35 mm |
||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1430 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.45 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
3.6 V |
30.15 mm |
400 MHz |
3.8 mm |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH; WD-MAX |
e4 |
.056 Amp |
67.6 mm |
.4 ns |
|||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
8 |
1 mm |
95 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30.5 mm |
4 mm |
154618822656 bit |
1.283 V |
SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
133.35 mm |
|||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
2GX64 |
2G |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
3.7 mm |
137438953472 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
69.6 mm |
|||||||||||||||||||||||||||||
|
Alliance Memory |
DDR DRAM MODULE |
OTHER |
96 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
95 Cel |
512MX16 |
512M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B96 |
3 |
1.425 V |
1.2 mm |
9 mm |
8589934592 bit |
1.275 V |
AUTO/SELF REFRESH |
13.5 mm |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
1GX72 |
1G |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
133.35 mm |
|||||||||||||||||||||||||||
|
Sk Hynix |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4294967296 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
85 Cel |
4GX72 |
4G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
30.88 mm |
3.98 mm |
309237645312 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||
|
Sk Hynix |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
30.33 mm |
7.65 mm |
154618822656 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX |
20 |
260 |
133.75 mm |
||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4294967296 words |
YES |
COMMON |
1.2 |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM288,33 |
Other Memory ICs |
.85 mm |
85 Cel |
3-STATE |
4GX72 |
4G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
1200 MHz |
3.9 mm |
Not Qualified |
309237645312 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
133.35 mm |
.175 ns |
|||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1GX64 |
1G |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
3.8 mm |
68719476736 bit |
1.283 V |
SELF REFRESH; WD-MAX |
30 |
260 |
67.6 mm |
|||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
1.9 V |
30.15 mm |
3.8 mm |
8589934592 bit |
1.7 V |
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX |
67.6 mm |
|||||||||||||||||||||||||||
Kingston Technology Company |
DDR DRAM MODULE |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4294967296 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
4GX72 |
4G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
309237645312 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
333 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.128 Amp |
.45 ns |
||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
18.9 mm |
2.7 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Sk Hynix |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
30.88 mm |
3.98 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
95 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
4.3 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
512MX64 |
512M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
2.5 mm |
34359738368 bit |
1.14 V |
WD-MAX |
69.6 mm |
||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
.6 mm |
85 Cel |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.45 V |
30.13 mm |
3.8 mm |
34359738368 bit |
1.283 V |
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX |
67.6 mm |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
512MX64 |
512M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
2.5 mm |
34359738368 bit |
1.14 V |
WD-MAX |
69.6 mm |
|||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
3.7 mm |
38654705664 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
69.6 mm |
|||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
2GX64 |
2G |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
3.8 mm |
137438953472 bit |
1.283 V |
SELF REFRESH; WD-MAX |
30 |
260 |
67.6 mm |
|||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
.6 mm |
70 Cel |
512MX72 |
512M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.45 V |
30.15 mm |
3.8 mm |
38654705664 bit |
1.283 V |
AUTO/SELF REFRESH; WD-MAX |
67.6 mm |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
1GX64 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
1.26 V |
30.13 mm |
3.7 mm |
68719476736 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
69.6 mm |
||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1240 mA |
536870912 words |
YES |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
30.15 mm |
667 MHz |
3.8 mm |
Not Qualified |
34359738368 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
.192 Amp |
67.6 mm |
.255 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1240 mA |
536870912 words |
YES |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
667 MHz |
Not Qualified |
34359738368 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.192 Amp |
133.35 mm |
20 ns |
||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX64 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
68719476736 bit |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4800 mA |
134217728 words |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
MATTE TIN |
DUAL |
R-PDMA-N204 |
1 |
800 MHz |
Not Qualified |
8589934592 bit |
e3 |
.096 Amp |
.225 ns |
|||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1080 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
667 MHz |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.096 Amp |
133.35 mm |
20 ns |
||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N260 |
1.26 V |
30.13 mm |
3.7 mm |
77309411328 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
69.6 mm |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1920 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
4 mm |
333 MHz |
30 mm |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
133.35 mm |
.45 ns |
||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3080 mA |
268435456 words |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
70 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
R-PDMA-N240 |
667 MHz |
Not Qualified |
17179869184 bit |
.096 Amp |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
2GX64 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
137438953472 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
154618822656 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
OTHER |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX64 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
2.7 mm |
34359738368 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1640 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
533 MHz |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.16 Amp |
.3 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2120 mA |
268435456 words |
YES |
COMMON |
1.5 |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
667 MHz |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.16 Amp |
.255 ns |
||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2000 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
400 MHz |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.4 ns |
|||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2280 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
256MX64 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
400 MHz |
Not Qualified |
17179869184 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.24 Amp |
.4 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
288 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8589934592 words |
YES |
1.2 |
72 |
MICROELECTRONIC ASSEMBLY |
.85 mm |
8GX72 |
8G |
DUAL |
1 |
R-XDMA-N288 |
1.26 V |
31.4 mm |
3.9 mm |
618475290624 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
133.35 mm |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.