66 DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4H561638H-UICC

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

350 mA

16777216 words

2,4,8

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

DUAL

R-PDSO-G66

200 MHz

Not Qualified

268435456 bit

.004 Amp

2,4,8

.65 ns

K4H510838D-UPB00

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

325 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.005 Amp

2,4,8

22.22 mm

.75 ns

K4D261638I-LC500

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

390 mA

8388608 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

65 Cel

3-STATE

8MX16

8M

0 Cel

TIN BISMUTH

DUAL

1

R-PDSO-G66

3

2.625 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

e6

.345 Amp

2,4,8

22.22 mm

.7 ns

K4H561638N-LLCCT

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

140 mA

16777216 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

200 MHz

Not Qualified

268435456 bit

e3

260

.003 Amp

2,4,8

.65 ns

K4H511638B-TCA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

22.22 mm

.75 ns

K4H510438B-TLB0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

22.22 mm

.75 ns

K4H280838C-TCA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

280 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

100 MHz

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.0035 Amp

2,4,8

22.22 mm

.8 ns

K4H281638E-TCC4

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

405 mA

8388608 words

2,4,8

YES

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

8MX16

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

134217728 bit

2.5 V

AUTO/SELF REFRESH

e0

.0035 Amp

2,4,8

22.22 mm

.7 ns

K4H280838F-TLB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

2.5

8

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

16MX8

16M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

22.22 mm

.75 ns

K4D551638F-TC400

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

410 mA

16777216 words

2,4,8

YES

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

250 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4,8

22.22 mm

.6 ns

KM44L64331AT-FY

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

200 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.025 Amp

2,4,8

22.22 mm

.75 ns

K4D261638F-TC50

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

245 mA

8388608 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

8MX16

8M

0 Cel

TIN LEAD

DUAL

R-PDSO-G66

200 MHz

Not Qualified

134217728 bit

e0

.045 Amp

2,4,8

.7 ns

K4H1G0438M-TLB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

410 mA

268435456 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

256MX4

256M

0 Cel

TIN LEAD

DUAL

R-PDSO-G66

133 MHz

Not Qualified

1073741824 bit

e0

.006 Amp

2,4,8

.7 ns

K4H560838F-ULCC0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

310 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

.004 Amp

2,4,8

22.22 mm

.65 ns

K4H641638Q-LLCCT

Samsung

CACHE DRAM MODULE

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

90 mA

4194304 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G66

1

2.7 V

1.2 mm

400 MHz

10.16 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

e3

260

.003 Amp

2,4,8

22.22 mm

.65 ns

K4H511638F-LCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

380 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

260

.005 Amp

2,4,8

22.22 mm

.7 ns

K4H280838C-TCB0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

350 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.004 Amp

2,4,8

22.22 mm

.75 ns

K4H560838D-TCC4

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

350 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

e0

.004 Amp

2,4,8

22.22 mm

.65 ns

K4H280438D-TLA2T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

290 mA

33554432 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX4

32M

0 Cel

TIN LEAD

DUAL

R-PDSO-G66

133 MHz

Not Qualified

134217728 bit

e0

.003 Amp

2,4,8

.75 ns

K4H510438B-UCB0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

134217728 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

DUAL

R-PDSO-G66

3

133 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.75 ns

K4H511638D-ULCC0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

400 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

536870912 bit

2.5 V

AUTO/SELF REFRESH

.005 Amp

2,4,8

22.22 mm

.65 ns

K4H1G0838A-ULA2T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

230 mA

134217728 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

128MX8

128M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

1073741824 bit

e3

.015 Amp

2,4,8

.75 ns

K4D261638F-LC50

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

245 mA

8388608 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

8MX16

8M

0 Cel

DUAL

R-PDSO-G66

3

200 MHz

Not Qualified

134217728 bit

260

.045 Amp

2,4,8

.7 ns

K4H510838C-ULA2T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4H560838E-UCA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

250 mA

33554432 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

R-PDSO-G66

3

133 MHz

Not Qualified

268435456 bit

260

.003 Amp

2,4,8

.75 ns

K4H560838C-TCA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

285 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

22.22 mm

.75 ns

K4C560838C-TCD40

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

8

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.65 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.35 V

AUTO/SELF REFRESH

e0

22.22 mm

.65 ns

K4H281638B-TCB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

400 mA

8388608 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

8MX16

8M

0 Cel

DUAL

R-PDSO-G66

133 MHz

Not Qualified

134217728 bit

.03 Amp

2,4,8

.75 ns

K4H511638C-UCB0T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

345 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4H561638H-UPB30

Samsung

DDR DRAM MODULE

INDUSTRIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

330 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

2,4,8

22.22 mm

.7 ns

K4D261638F-TC400

Samsung

SYNCHRONOUS GRAPHICS RAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

260 mA

8388608 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

65 Cel

3-STATE

8MX16

8M

0 Cel

DUAL

1

R-PDSO-G66

2.625 V

1.2 mm

250 MHz

10.16 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

30

240

.045 Amp

2,4,8

22.22 mm

.6 ns

K4H511638D-KCB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

2,4,8

22.22 mm

.6 ns

K4H280838D-TLB3T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

330 mA

16777216 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

TIN LEAD

DUAL

R-PDSO-G66

166 MHz

Not Qualified

134217728 bit

e0

.003 Amp

2,4,8

.7 ns

K4H561638F-UCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

350 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

2,4,8

22.22 mm

.7 ns

K4H510838C-ULA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

DUAL

R-PDSO-G66

3

133 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.75 ns

K4D28163HD-TC60

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

280 mA

8388608 words

2,4,8

YES

COMMON

3.3

2.5,3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

65 Cel

3-STATE

8MX16

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G66

3.465 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

134217728 bit

3.135 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

22.22 mm

.75 ns

KM48H8031T-8

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

2,4,8

YES

COMMON

3.3

2.5,3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G66

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

.02 Amp

2,4,8

22.22 mm

K4D551638D-LC60

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

268435456 bit

260

2,4,8

K4H1G0638B-UCB00

Samsung

DDR DRAM MODULE

COMMERCIAL

66

SSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

390 mA

268435456 words

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, SHRINK PITCH

SSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

256MX4

256M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

2.59 mm

133 MHz

10.16 mm

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

260

.01 Amp

22.22 mm

.75 ns

K4H561638J-LIB30

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

270 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

167 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.004 Amp

2,4,8

22.22 mm

.7 ns

K4H511638C-UPB00

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

345 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.005 Amp

2,4,8

22.22 mm

.75 ns

K4H561638H-UCB3T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

330 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

2,4,8

22.22 mm

.7 ns

K4H280838B-TCA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

375 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.03 Amp

2,4,8

22.22 mm

.75 ns

K4H641638N-LLB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

200 mA

4194304 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.004 Amp

2,4,8

22.22 mm

.7 ns

K4H510738E-TCAA0

Samsung

DDR DRAM MODULE

COMMERCIAL

66

ATSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

67108864 words

YES

2.5

8

SMALL OUTLINE, PIGGYBACK, THIN PROFILE

.65 mm

70 Cel

64MX8

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

2.59 mm

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

22.22 mm

.75 ns

K4H510438C-UCB00HI

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

128MX4

128M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.75 ns

KM48H8031T-7.5

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

2,4,8

YES

COMMON

3.3

2.5,3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G66

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

.02 Amp

2,4,8

22.22 mm

K4H561638N-LLB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

120 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

260

.003 Amp

2,4,8

22.22 mm

.7 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.