90 DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT46H16M32LFCX-6LIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

115 mA

16777216 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

166 MHz

9 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

2,4,8,16

13 mm

6 ns

MT46H64M16LFCM-75LIT:A

Micron Technology

DDR1 DRAM

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

60 mA

67108864 words

2,4,8,16

YES

COMMON

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

.8 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

10 mm

1073741824 bit

1.7 V

AUTO/SELF REFRESH

.016 Amp

2,4,8,16

13 mm

6 ns

MT46H16M32LFB5-54AT:C

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

8 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48LC4M32B2B5-7ITES:G

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

8 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e1

13 mm

5.5 ns

MT48LC2M32B2B5-6AT:G

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

2097152 words

YES

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

2MX32

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

8 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e1

13 mm

5.5 ns

MT48H8M32LFB5-75:H

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

85 mA

8388608 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

0 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

13 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

.00001 Amp

1,2,4,8

8 mm

5.4 ns

MT48V4M32LFBC-10IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

2.7 V

1.2 mm

100 MHz

11 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e1

260

.00035 Amp

1,2,4,8

13 mm

7 ns

MT46H16M32LFCM-75LIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

100 mA

16777216 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

2,4,8,16

13 mm

7.5 ns

MT46H8M32LFB5-5:H

Micron Technology

LPDDR1 DRAM

COMMERCIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

8388608 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

200 MHz

8 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

.0003 Amp

2,4,8,16

13 mm

5 ns

MT48LC16M32S2B5-6

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

375 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

0 Cel

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

536870912 bit

.0024 Amp

1,2,4,8

MT46H256M32L4CX-5AT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

256MX32

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

9 mm

8589934592 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48V4M32LFFC-10IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

2.7 V

1.2 mm

100 MHz

11 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.00035 Amp

1,2,4,8

13 mm

7 ns

MT48H32M32LGB5-6LIT:B

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX32

32M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

8 mm

1073741824 bit

1.7 V

AUTO/SELF REFRESH

13 mm

5 ns

MT46H16M32LGBQ-54AIT:C

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

8 mm

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48V4M32LFB5-10IT:G

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

8388608 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

2.7 V

1 mm

100 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e1

.00045 Amp

1,2,4,8

13 mm

7 ns

MT48V4M32LFB5-75MIT:G

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

150 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

2.7 V

1 mm

133 MHz

8 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e1

.00045 Amp

1,2,4,8

13 mm

5.4 ns

MT46H256M32LFCM-6AT:A

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

256MX32

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT46H16M32LGBQ-6AIT:C

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

8 mm

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48LC16M32L2B5-8

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.6 V

1.4 mm

8 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

e1

13 mm

MT48H16M16LFB5-75:G

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

100 mA

16777216 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

8 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

.0003 Amp

1,2,4,8

13 mm

6 ns

MT46H32M16LGCM-75LIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

7.5 ns

MT46H64M32L4CM-5:A

Micron Technology

LPDDR1 DRAM

COMMERCIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX32

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

2147483648 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48LC8M16LFFC-8

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-40 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

3.6 V

1.2 mm

11 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

13 mm

7 ns

MT48V8M32LFF5-8

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

255 mA

8388608 words

1,2,4,8,FP

YES

COMMON

2.5

2.5

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

2.7 V

1 mm

125 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.00001 Amp

1,2,4,8

13 mm

7 ns

MT48LC4M32B2B5-6:G

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

320 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX32

4M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

166 MHz

8 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e1

.002 Amp

1,2,4,8

13 mm

5.5 ns

MT46HC16M32LGCX-5LIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

9 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48LC4M32LFBC-10IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.6 V

1.2 mm

100 MHz

11 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e1

260

.00035 Amp

1,2,4,8

13 mm

7 ns

MT46H256M32L4CX-75AT:B

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

256MX32

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

9 mm

8589934592 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

6 ns

MT46H32M32LFCM-75:A

Micron Technology

LPDDR1 DRAM

COMMERCIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

140 mA

33554432 words

2,4,8

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX32

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

10 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

e1

.0006 Amp

2,4,8

13 mm

6 ns

MT46H16M16LFB5-75AAT:H

Micron Technology

LPDDR1 DRAM

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

95 mA

16777216 words

2,4,8,16

YES

COMMON

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

.8 mm

105 Cel

16MX16

16M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

8 mm

268435456 bit

1.7 V

AUTO/SELF REFRESH

.0003 Amp

2,4,8,16

13 mm

MT46H16M32LGCX-54LIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

16777216 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

185 MHz

9 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

2,4,8,16

13 mm

5.4 ns

MT48LC16M32S2F5-7IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

335 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-40 Cel

BOTTOM

R-PBGA-B90

143 MHz

Not Qualified

536870912 bit

.0024 Amp

1,2,4,8

MT48V16M32L2B5-10

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.7

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.5 V

1.4 mm

8 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e1

13 mm

MT46H128M32LFCM-6AT:A

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

105 Cel

128MX32

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

4294967296 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48H16M32LGB5-75AIT:C

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX32

16M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

8 mm

536870912 bit

1.7 V

AUTO/SELF REFRESH

13 mm

5.4 ns

MT46H16M32LFB5-54LIT:C

Micron Technology

LPDDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

8 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT46H64M32LFCX-5:B

Micron Technology

LPDDR1 DRAM

COMMERCIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX32

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

9 mm

2147483648 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48H16M32LFCM-10IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

90 mA

16777216 words

1,2,4,8

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

100 MHz

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

1,2,4,8

13 mm

7 ns

MT48LC4M32LFFC-8IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

220 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

3.6 V

1.2 mm

125 MHz

11 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

.00035 Amp

1,2,4,8

13 mm

7 ns

MT46H16M16LGB5-54AAT:H

Micron Technology

LPDDR1 DRAM

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

130 mA

16777216 words

2,4,8,16

YES

COMMON

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

.8 mm

105 Cel

16MX16

16M

-40 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

185 MHz

8 mm

268435456 bit

1.7 V

AUTO/SELF REFRESH

.0003 Amp

2,4,8,16

13 mm

MT46HC32M16LFCM-5LIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5 ns

MT48V4M32LFF5-8XT

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL EXTENDED

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

220 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

75 Cel

3-STATE

4MX32

4M

-25 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

2.7 V

1 mm

125 MHz

8 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.00045 Amp

1,2,4,8

13 mm

7 ns

MT46H32M32LFB5-5AIT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

150 mA

33554432 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX32

32M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

200 MHz

8 mm

1073741824 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

2,4,8,16

13 mm

5 ns

MT46HC16M32LGCM-54:B

Micron Technology

DDR1 DRAM

COMMERCIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

5.4 ns

MT46H32M32LGCM-5L:A

Micron Technology

LPDDR1 DRAM

COMMERCIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

150 mA

33554432 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX32

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

200 MHz

10 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

2,4,8,16

13 mm

5 ns

MT46H32M32LFCM-75IT

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

33554432 words

2,4,8

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX32

32M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B90

1

133 MHz

Not Qualified

1073741824 bit

e3

.0006 Amp

2,4,8

6 ns

MT46H16M16LFB5-75:H

Micron Technology

LPDDR1 DRAM

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

95 mA

16777216 words

2,4,8,16

YES

COMMON

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

.8 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

8 mm

268435456 bit

1.7 V

AUTO/SELF REFRESH

.0003 Amp

2,4,8,16

13 mm

MT46H32M16LGCX-75IT:B

Micron Technology

DDR1 DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

7.5 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.