DIP DRAM 1,315

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

TC514400AP-70

Toshiba

FAST PAGE DRAM

COMMERCIAL

20

DIP

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

4

IN-LINE

2.54 mm

70 Cel

3-STATE

1MX4

1M

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T20

5.5 V

4.4 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

24.6 mm

70 ns

MCM6256BP12

Motorola

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

NMOS

THROUGH-HOLE

ASYNCHRONOUS

72 mA

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T16

5.5 V

4.19 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

19.05 mm

120 ns

D2164A-15

Intel

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC, GLASS-SEALED

PAGE

NO

1

NMOS

THROUGH-HOLE

ASYNCHRONOUS

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

TIN LEAD

DUAL

1

R-GDIP-T16

5.5 V

5.08 mm

7.62 mm

Not Qualified

65536 bit

4.5 V

RAS ONLY/HIDDEN REFRESH

e0

19.558 mm

150 ns

D2164A-20

Intel

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC, GLASS-SEALED

PAGE

NO

1

NMOS

THROUGH-HOLE

ASYNCHRONOUS

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

TIN LEAD

DUAL

1

R-GDIP-T16

5.5 V

5.08 mm

7.62 mm

Not Qualified

65536 bit

4.5 V

RAS ONLY/HIDDEN REFRESH

e0

19.558 mm

200 ns

KM41C256P-7

Samsung

FAST PAGE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

65 mA

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T16

5.5 V

4.65 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

19.43 mm

70 ns

KM41C4000BSLP-8

Samsung

FAST PAGE DRAM

COMMERCIAL

18

DIP

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

70 mA

4194304 words

NO

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

4MX1

4M

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T18

5.5 V

4.65 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.0001 Amp

22.02 mm

80 ns

KM44C256AP-8

Samsung

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

75 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T20

3

5.5 V

4.19 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

24.56 mm

80 ns

KM44C256BP-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

80 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T20

5.5 V

4.65 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

24.56 mm

70 ns

KM44C256CP-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

65 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDIP-T20

5.5 V

4.65 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

24.56 mm

70 ns

LH2464-10

Sharp Corporation

PAGE MODE DRAM

COMMERCIAL

18

DIP

256

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

NMOS

THROUGH-HOLE

ASYNCHRONOUS

65536 words

5

4

IN-LINE

2.54 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T18

5.5 V

4.4 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

23 mm

100 ns

MB81C4256A-70P

Fujitsu

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

68 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

1048576 bit

e0

.001 Amp

70 ns

MCM4116BC-20

Freescale Semiconductor

PAGE MODE DRAM

COMMERCIAL

16

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

PAGE

NO

1

MOS

-5 V

THROUGH-HOLE

ASYNCHRONOUS

16384 words

5

1

IN-LINE

70 Cel

16KX1

16K

0 Cel

DUAL

1

R-CDIP-T16

5.5 V

16384 bit

4.5 V

RAS ONLY REFRESH, ALSO REQUIRES VDD 12 V

200 ns

MCM4116BC20

Motorola

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

16384 bit

e0

200 ns

MCM514256AP70

Motorola

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

80 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDIP-T20

5.5 V

4.44 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.001 Amp

24.64 mm

70 ns

MT1259-12

Micron Technology

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

55 mA

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

262144 bit

e0

120 ns

MT4264-15

Micron Technology

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

30 mA

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

65536 bit

e0

150 ns

TMM41256AP-10

Toshiba

FAST PAGE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

80 mA

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDIP-T16

5.5 V

5 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH; LG-MAX

e0

19.9 mm

100 ns

TMM416D-3

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

Not Qualified

16384 bit

e0

200 ns

TMM416P-4

Toshiba

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

MOS

THROUGH-HOLE

ASYNCHRONOUS

16384 words

SEPARATE

12

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T16

13.2 V

5 mm

7.62 mm

Not Qualified

16384 bit

10.8 V

RAS ONLY REFRESH

e0

250 ns

TMS4256-12NL

Texas Instruments

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

NMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

DUAL

1

R-PDIP-T16

5.5 V

5.08 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

19.305 mm

120 ns

TMX4C1024-15N

Texas Instruments

FAST PAGE DRAM

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

1

IN-LINE

2.54 mm

3-STATE

1MX1

1M

DUAL

1

R-PDIP-T18

5.5 V

5.08 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

22.48 mm

150 ns

SMJ4C1024-15SVM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

DIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

38535Q/M;38534H;883B

THROUGH-HOLE

SYNCHRONOUS

55 mA

1048576 words

SEPARATE

5

5

1

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

125 Cel

3-STATE

1MX1

1M

-55 Cel

DUAL

1

R-CDIP-T20

5.5 V

10.92 mm

2.92 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS REFRESH

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

26.67 mm

150 ns

SMJ4416-15JDE

Texas Instruments

PAGE MODE DRAM

INDUSTRIAL

18

DIP

256

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

PAGE

NO

1

NMOS

38535Q/M;38534H;883B

THROUGH-HOLE

ASYNCHRONOUS

16384 words

COMMON

5

5

4

IN-LINE

DIP18,.3

DRAMs

2.54 mm

85 Cel

3-STATE

16KX4

16K

-40 Cel

DUAL

1

R-CDIP-T18

5.5 V

5.08 mm

7.62 mm

Not Qualified

65536 bit

4.5 V

RAS ONLY REFRESH

NOT SPECIFIED

NOT SPECIFIED

22.606 mm

150 ns

5962-9062201MTA

Texas Instruments

FAST PAGE DRAM

MILITARY

18

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

ASYNCHRONOUS

4194304 words

5

1

IN-LINE

2.54 mm

125 Cel

4MX1

4M

-55 Cel

TIN LEAD

DUAL

1

R-CDIP-T18

5.5 V

3.93 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

22.86 mm

120 ns

SMJ4164-12JDE

Texas Instruments

PAGE MODE DRAM

INDUSTRIAL

16

DIP

256

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

PAGE

NO

1

NMOS

38535Q/M;38534H;883B

THROUGH-HOLE

ASYNCHRONOUS

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

85 Cel

3-STATE

64KX1

64K

-40 Cel

DUAL

1

R-CDIP-T16

5.5 V

5.08 mm

7.62 mm

Not Qualified

65536 bit

4.5 V

RAS ONLY REFRESH

NOT SPECIFIED

NOT SPECIFIED

120 ns

5962-9062203MTX

Texas Instruments

FAST PAGE DRAM

MILITARY

18

DIP

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

ASYNCHRONOUS

4194304 words

5

1

IN-LINE

2.54 mm

125 Cel

4MX1

4M

-55 Cel

DUAL

1

R-XDIP-T18

5.5 V

4.44 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

23.085 mm

80 ns

5962-01-349-6975

Texas Instruments

PAGE MODE DRAM

COMMERCIAL

16

DIP

256

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX1

256K

0 Cel

DUAL

R-PDIP-T16

Not Qualified

262144 bit

NOT SPECIFIED

NOT SPECIFIED

100 ns

5962-01-263-9398

Texas Instruments

PAGE MODE DRAM

OTHER

16

DIP

256

RECTANGULAR

CERAMIC

NO

MOS

38535Q/M;38534H;883B

THROUGH-HOLE

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

100 Cel

3-STATE

64KX1

64K

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

65536 bit

NOT SPECIFIED

NOT SPECIFIED

120 ns

SMJ4C1024-10JD

Texas Instruments

FAST PAGE DRAM

MILITARY

18

DIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

1

IN-LINE

2.54 mm

125 Cel

3-STATE

1MX1

1M

-55 Cel

DUAL

1

R-CDIP-T18

5.5 V

4.45 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

22.606 mm

100 ns

SMJ44C251B-12JDL

Texas Instruments

VIDEO DRAM

COMMERCIAL

28

DIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE WITH EDO

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

2

R-CDIP-T28

5.5 V

3.56 mm

10.16 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT

120 ns

SMJ44400-15JDM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

DIP

1024

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

4

IN-LINE

2.54 mm

125 Cel

3-STATE

1MX4

1M

-55 Cel

DUAL

1

R-CDIP-T20

5.5 V

3.56 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

CAS BEFORE RAS REFRESH

150 ns

TMS4060-1NL

Texas Instruments

COMMERCIAL

22

DIP

64

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

60 mA

4096 words

SEPARATE

1

IN-LINE

DIP22,.4

Other Memory ICs

2.54 mm

70 Cel

3-STATE

4KX1

4K

0 Cel

DUAL

R-PDIP-T22

Not Qualified

4096 bit

NOT SPECIFIED

NOT SPECIFIED

250 ns

5962-01-168-5239

Texas Instruments

PAGE MODE DRAM

OTHER

16

DIP

256

RECTANGULAR

CERAMIC

NO

MOS

38535Q/M;38534H;883B

THROUGH-HOLE

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

100 Cel

3-STATE

64KX1

64K

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

65536 bit

NOT SPECIFIED

NOT SPECIFIED

150 ns

SMJ44400-12JDM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

DIP

1024

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

38535Q/M;38534H;883B

THROUGH-HOLE

ASYNCHRONOUS

65 mA

1048576 words

NO

COMMON

5

5

4

IN-LINE

DIP20,.4

DRAMs

2.54 mm

125 Cel

3-STATE

1MX4

1M

-55 Cel

DUAL

1

R-CDIP-T20

5.5 V

3.556 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.004 Amp

120 ns

5962-9062202MVX

Texas Instruments

FAST PAGE DRAM

MILITARY

16

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

4194304 words

5

1

IN-LINE

2.54 mm

125 Cel

4MX1

4M

-55 Cel

DUAL

1

R-CDIP-T16

5.5 V

3.93 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

20.32 mm

100 ns

TMS44C256-80N

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

75 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

1

R-PDIP-T20

5.5 V

5.08 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

24.325 mm

80 ns

5962-8949704MXX

Texas Instruments

VIDEO DRAM

MILITARY

28

DIP

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

ASYNCHRONOUS

120 mA

262144 words

5

5

4

IN-LINE

DIP28,.4

Other Memory ICs

2.54 mm

125 Cel

256KX4

256K

-55 Cel

DUAL

2

R-XDIP-T28

5.5 V

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

.015 Amp

100 ns

TMS4030JL

Texas Instruments

COMMERCIAL

22

DIP

64

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

60 mA

4096 words

SEPARATE

1

IN-LINE

DIP22,.4

Other Memory ICs

2.54 mm

70 Cel

3-STATE

4KX1

4K

0 Cel

DUAL

R-XDIP-T22

Not Qualified

4096 bit

NOT SPECIFIED

NOT SPECIFIED

300 ns

TMS4C1025-15N

Texas Instruments

NIBBLE MODE DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

DUAL

R-PDIP-T18

Not Qualified

1048576 bit

150 ns

5962-9061701MRX

Texas Instruments

FAST PAGE DRAM

MILITARY

20

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

2.54 mm

125 Cel

256KX4

256K

-55 Cel

TIN LEAD

DUAL

1

R-CDIP-T20

5.5 V

3.93 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

25.4 mm

150 ns

5962-9061702MRA

Texas Instruments

FAST PAGE DRAM

MILITARY

20

DIP

512

RECTANGULAR

CERAMIC, GLASS-SEALED

FAST PAGE

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

ASYNCHRONOUS

60 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

125 Cel

3-STATE

256KX4

256K

-55 Cel

DUAL

1

R-GDIP-T20

5.5 V

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.004 Amp

120 ns

TMS44C256-15N

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

55 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

R-PDIP-T20

Not Qualified

1048576 bit

.003 Amp

150 ns

M38510/24402BEA

Texas Instruments

PAGE MODE DRAM

MILITARY

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

38535Q/M;38534H;883B

THROUGH-HOLE

65536 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

125 Cel

3-STATE

64KX1

64K

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

65536 bit

150 ns

SMJ4464-15JDL

Texas Instruments

PAGE MODE DRAM

COMMERCIAL

18

DIP

256

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

PAGE

NO

1

NMOS

38535Q/M;38534H;883B

THROUGH-HOLE

ASYNCHRONOUS

65536 words

COMMON

5

5

4

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

DUAL

1

R-CDIP-T18

5.5 V

5.08 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

22.606 mm

150 ns

TMS4C1027-12N

Texas Instruments

STATIC COLUMN DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

STATIC COLUMN

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

55 mA

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

SRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

DUAL

1

R-PDIP-T18

5.5 V

5.08 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

22.48 mm

120 ns

TMS4464-10NL

Texas Instruments

PAGE MODE DRAM

COMMERCIAL

18

DIP

256

RECTANGULAR

PLASTIC/EPOXY

PAGE

NO

1

NMOS

THROUGH-HOLE

ASYNCHRONOUS

65536 words

COMMON

5

5

4

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

64KX4

64K

0 Cel

DUAL

1

R-PDIP-T18

5.5 V

5.08 mm

7.62 mm

Not Qualified

262144 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

22.48 mm

100 ns

5962-01-240-9245

Texas Instruments

PAGE MODE DRAM

COMMERCIAL

16

DIP

128

RECTANGULAR

CERAMIC

NO

MOS

THROUGH-HOLE

16384 words

SEPARATE

+-5,12

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

70 Cel

3-STATE

16KX1

16K

0 Cel

DUAL

R-XDIP-T16

Not Qualified

16384 bit

NOT SPECIFIED

NOT SPECIFIED

250 ns

5962-01-407-9554

Texas Instruments

PAGE MODE DRAM

OTHER

16

DIP

256

RECTANGULAR

CERAMIC

NO

MOS

38535Q/M;38534H;883B

THROUGH-HOLE

262144 words

SEPARATE

5

5

1

IN-LINE

DIP16,.3

DRAMs

2.54 mm

110 Cel

3-STATE

256KX1

256K

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

262144 bit

NOT SPECIFIED

NOT SPECIFIED

120 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.