Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
24.6 mm |
70 ns |
||||||||||||||||||||||
Motorola |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
72 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T16 |
5.5 V |
4.19 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
19.05 mm |
120 ns |
|||||||||||||||||
Intel |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY/HIDDEN REFRESH |
e0 |
19.558 mm |
150 ns |
||||||||||||||||||
Intel |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY/HIDDEN REFRESH |
e0 |
19.558 mm |
200 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T16 |
5.5 V |
4.65 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
19.43 mm |
70 ns |
|||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
70 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
4.65 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
.0001 Amp |
22.02 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
75 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
3 |
5.5 V |
4.19 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
24.56 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
80 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.65 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
24.56 mm |
70 ns |
||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.65 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
24.56 mm |
70 ns |
||||||||||||||||
Sharp Corporation |
PAGE MODE DRAM |
COMMERCIAL |
18 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
23 mm |
100 ns |
||||||||||||||||||||||
Fujitsu |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
68 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
70 ns |
||||||||||||||||||||||||||
Freescale Semiconductor |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
NO |
1 |
MOS |
-5 V |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
5 |
1 |
IN-LINE |
70 Cel |
16KX1 |
16K |
0 Cel |
DUAL |
1 |
R-CDIP-T16 |
5.5 V |
16384 bit |
4.5 V |
RAS ONLY REFRESH, ALSO REQUIRES VDD 12 V |
200 ns |
||||||||||||||||||||||||||||||
Motorola |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
SEPARATE |
+-5,12 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX1 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
Not Qualified |
16384 bit |
e0 |
200 ns |
|||||||||||||||||||||||||||||
Motorola |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
80 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.44 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
.001 Amp |
24.64 mm |
70 ns |
||||||||||||||||
Micron Technology |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
55 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
262144 bit |
e0 |
120 ns |
|||||||||||||||||||||||||||
Micron Technology |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
30 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
65536 bit |
e0 |
150 ns |
|||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
80 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDIP-T16 |
5.5 V |
5 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH; LG-MAX |
e0 |
19.9 mm |
100 ns |
|||||||||||||||||
Toshiba |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
SEPARATE |
+-5,12 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX1 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
Not Qualified |
16384 bit |
e0 |
200 ns |
|||||||||||||||||||||||||||||
Toshiba |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
PLASTIC/EPOXY |
PAGE |
NO |
1 |
MOS |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
SEPARATE |
12 |
+-5,12 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX1 |
16K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T16 |
13.2 V |
5 mm |
7.62 mm |
Not Qualified |
16384 bit |
10.8 V |
RAS ONLY REFRESH |
e0 |
250 ns |
|||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
DUAL |
1 |
R-PDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
19.305 mm |
120 ns |
||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
IN-LINE |
2.54 mm |
3-STATE |
1MX1 |
1M |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
22.48 mm |
150 ns |
||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
DIP |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
SYNCHRONOUS |
55 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
ZIP20,.1 |
DRAMs |
1.27 mm |
125 Cel |
3-STATE |
1MX1 |
1M |
-55 Cel |
DUAL |
1 |
R-CDIP-T20 |
5.5 V |
10.92 mm |
2.92 mm |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.003 Amp |
26.67 mm |
150 ns |
|||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
INDUSTRIAL |
18 |
DIP |
256 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
NO |
1 |
NMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
85 Cel |
3-STATE |
16KX4 |
16K |
-40 Cel |
DUAL |
1 |
R-CDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.606 mm |
150 ns |
|||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
4MX1 |
4M |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-CDIP-T18 |
5.5 V |
3.93 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
22.86 mm |
120 ns |
|||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
INDUSTRIAL |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
NO |
1 |
NMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
85 Cel |
3-STATE |
64KX1 |
64K |
-40 Cel |
DUAL |
1 |
R-CDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
120 ns |
||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
4MX1 |
4M |
-55 Cel |
DUAL |
1 |
R-XDIP-T18 |
5.5 V |
4.44 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
23.085 mm |
80 ns |
|||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
262144 bit |
NOT SPECIFIED |
NOT SPECIFIED |
100 ns |
||||||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
100 Cel |
3-STATE |
64KX1 |
64K |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
65536 bit |
NOT SPECIFIED |
NOT SPECIFIED |
120 ns |
|||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
18 |
DIP |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
1MX1 |
1M |
-55 Cel |
DUAL |
1 |
R-CDIP-T18 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
22.606 mm |
100 ns |
||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
COMMERCIAL |
28 |
DIP |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
2 |
R-CDIP-T28 |
5.5 V |
3.56 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT |
120 ns |
|||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
DIP |
1024 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
1MX4 |
1M |
-55 Cel |
DUAL |
1 |
R-CDIP-T20 |
5.5 V |
3.56 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
150 ns |
|||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
22 |
DIP |
64 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
60 mA |
4096 words |
SEPARATE |
1 |
IN-LINE |
DIP22,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
DUAL |
R-PDIP-T22 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
250 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
100 Cel |
3-STATE |
64KX1 |
64K |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
65536 bit |
NOT SPECIFIED |
NOT SPECIFIED |
150 ns |
|||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
DIP |
1024 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
65 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.4 |
DRAMs |
2.54 mm |
125 Cel |
3-STATE |
1MX4 |
1M |
-55 Cel |
DUAL |
1 |
R-CDIP-T20 |
5.5 V |
3.556 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.004 Amp |
120 ns |
|||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
4MX1 |
4M |
-55 Cel |
DUAL |
1 |
R-CDIP-T16 |
5.5 V |
3.93 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
20.32 mm |
100 ns |
||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
75 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
24.325 mm |
80 ns |
||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
120 mA |
262144 words |
5 |
5 |
4 |
IN-LINE |
DIP28,.4 |
Other Memory ICs |
2.54 mm |
125 Cel |
256KX4 |
256K |
-55 Cel |
DUAL |
2 |
R-XDIP-T28 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS/HIDDEN REFRESH |
.015 Amp |
100 ns |
|||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
22 |
DIP |
64 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
60 mA |
4096 words |
SEPARATE |
1 |
IN-LINE |
DIP22,.4 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
DUAL |
R-XDIP-T22 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
300 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
NIBBLE MODE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
1048576 bit |
150 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
256KX4 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-CDIP-T20 |
5.5 V |
3.93 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
25.4 mm |
150 ns |
|||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
DIP |
512 |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
60 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
125 Cel |
3-STATE |
256KX4 |
256K |
-55 Cel |
DUAL |
1 |
R-GDIP-T20 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.004 Amp |
120 ns |
||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
55 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
1048576 bit |
.003 Amp |
150 ns |
||||||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
MILITARY |
16 |
DIP |
128 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
125 Cel |
3-STATE |
64KX1 |
64K |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
65536 bit |
150 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
18 |
DIP |
256 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
NO |
1 |
NMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
0 Cel |
DUAL |
1 |
R-CDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.606 mm |
150 ns |
|||||||||||||||||
Texas Instruments |
STATIC COLUMN DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
55 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
22.48 mm |
120 ns |
||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
18 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
0 Cel |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.48 mm |
100 ns |
||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
128 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
16384 words |
SEPARATE |
+-5,12 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX1 |
16K |
0 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
250 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
110 Cel |
3-STATE |
256KX1 |
256K |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
262144 bit |
NOT SPECIFIED |
NOT SPECIFIED |
120 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.