TSSOP DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4H561638N-LCB3T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

120 mA

16777216 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

268435456 bit

e3

30

260

.003 Amp

2,4,8

.7 ns

K4H510838C-UIB3T

Samsung

CACHE DRAM MODULE

INDUSTRIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

360 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

K4H280838C-TCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

400 mA

16777216 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

134217728 bit

240

.004 Amp

2,4,8

.7 ns

K4H560438E-ULA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

240 mA

67108864 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

DUAL

R-PDSO-G66

3

133 MHz

Not Qualified

268435456 bit

260

.003 Amp

2,4,8

.75 ns

K4H510838B-UCB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.7 ns

K4S643222B-TL80

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

86

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

150 mA

2097152 words

1,2,4,8,FP

COMMON

3.3

3.3

32

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP86,.46,20

DRAMs

.5 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

TIN LEAD

DUAL

R-PDSO-G86

3

125 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

6 ns

K4H560838E-TCC5

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

330 mA

33554432 words

2,4,8

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G66

233 MHz

Not Qualified

268435456 bit

e0

.005 Amp

2,4,8

.65 ns

K4H560838H-ULB0T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

250 mA

33554432 words

2,4,8

COMMON

2.3

2.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

268435456 bit

e3

.003 Amp

2,4,8

.75 ns

K4H510438D-ULA2T

Samsung

CACHE DRAM MODULE

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

325 mA

134217728 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4D261638F-LC2A

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

400 mA

8388608 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

8MX16

8M

0 Cel

DUAL

R-PDSO-G66

3

350 MHz

Not Qualified

134217728 bit

260

.06 Amp

2,4,8

.6 ns

K4H560838E-VCB3

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

280 mA

33554432 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

MATTE TIN

DUAL

R-PDSO-G54

1

166 MHz

Not Qualified

268435456 bit

e3

.003 Amp

2,4,8

K4S643232E-TL60T

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

86

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

185 mA

2097152 words

1,2,4,8,FP

COMMON

3.3

3.3

32

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP86,.46,20

DRAMs

.5 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G86

166 MHz

Not Qualified

67108864 bit

e0

.002 Amp

1,2,4,8

5.5 ns

K4C561638F-TCDA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

16MX16

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.65 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.35 V

AUTO/SELF REFRESH

e0

22.22 mm

.75 ns

K4D551638F-LC60T

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

350 mA

16777216 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

166 MHz

Not Qualified

268435456 bit

e3

2,4,8

K4H510838B-NLB0

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

340 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

.75 ns

K4H560838E-VCCC0

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.6

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G54

2

2.7 V

1.2 mm

7.6 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

14 mm

.65 ns

K4H510838D-UCCCT

Samsung

CACHE DRAM MODULE

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

385 mA

67108864 words

2,4,8

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

200 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.65 ns

K4H510838D-VLB3T

Samsung

CACHE DRAM MODULE

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

360 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G54

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

K4H280438B-TCB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

350 mA

33554432 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX4

32M

0 Cel

DUAL

R-PDSO-G66

133 MHz

Not Qualified

134217728 bit

.03 Amp

2,4,8

.75 ns

K4H510438G-LCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

210 mA

134217728 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN BISMUTH

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

536870912 bit

e6

260

.005 Amp

2,4,8

.7 ns

K4H510838D-UCB3T

Samsung

CACHE DRAM MODULE

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

360 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

K4H510438B-VLA20

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.4 mm

70 Cel

128MX4

128M

0 Cel

DUAL

1

R-PDSO-G54

2

2.7 V

1.2 mm

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

11.2 mm

.75 ns

K4H1G0838M-TLA20

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

300 mA

134217728 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

128MX8

128M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

240

.008 Amp

2,4,8

22.22 mm

.75 ns

K4H511638D-ULB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

345 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

.005 Amp

2,4,8

22.22 mm

.75 ns

K4D551638D-TC40T

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

410 mA

16777216 words

2,4,8

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

R-PDSO-G66

250 MHz

Not Qualified

268435456 bit

.07 Amp

2,4,8

.6 ns

K4H560838E-ULAA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.75 ns

K4D551638F-LC33

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

520 mA

16777216 words

2,4,8

COMMON

2.8

2.8

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

R-PDSO-G66

3

300 MHz

Not Qualified

268435456 bit

260

2,4,8

K4H561638F-ULB0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

300 mA

16777216 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

R-PDSO-G66

3

133 MHz

Not Qualified

268435456 bit

260

2,4,8

K4H560438E-ULB0T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

240 mA

67108864 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

268435456 bit

e3

.003 Amp

2,4,8

.75 ns

K4H560438E-NLA20

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

260 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

DUAL

1

R-PDSO-G54

3

2.7 V

1.2 mm

133 MHz

7.6 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

240

.003 Amp

2,4,8

14 mm

.75 ns

K4H511638B-UCB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.7 ns

K4H2G0638A-ULB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

400 mA

536870912 words

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

512MX4

512M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

2147483648 bit

2.3 V

AUTO/SELF REFRESH

.03 Amp

22.22 mm

.7 ns

K4H561638F-ULCC

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

380 mA

16777216 words

2,4,8

COMMON

2.6

2.6

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

200 MHz

Not Qualified

268435456 bit

e3

2,4,8

K4H510838D-VLCCT

Samsung

CACHE DRAM MODULE

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

385 mA

67108864 words

2,4,8

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G54

1

200 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.65 ns

K4H510838G-LLCC0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

240 mA

67108864 words

2,4,8

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

TIN BISMUTH

DUAL

R-PDSO-G66

3

200 MHz

Not Qualified

536870912 bit

e6

260

.005 Amp

2,4,8

.65 ns

K4D551638F-LC600

Samsung

GDDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

350 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

65 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

3

2.625 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.375 V

AUTO/SELF REFRESH

2,4,8

22.22 mm

.7 ns

K4H560438E-NLB30

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

260 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

DUAL

1

R-PDSO-G54

3

2.7 V

1.2 mm

166 MHz

7.6 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

240

.003 Amp

2,4,8

14 mm

.7 ns

K4H1G0438M-TLB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

300 mA

268435456 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

256MX4

256M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

240

.008 Amp

2,4,8

22.22 mm

.75 ns

K4H281638B-TLA0T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

330 mA

8388608 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

8MX16

8M

0 Cel

DUAL

R-PDSO-G66

100 MHz

Not Qualified

134217728 bit

.025 Amp

2,4,8

.8 ns

K4H510438B-NLB0

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

.75 ns

K4H280838C-TLB3T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

400 mA

16777216 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

134217728 bit

240

.004 Amp

2,4,8

.7 ns

K4H510838D-UIB0

Samsung

DDR1 DRAM

AUTOMOTIVE

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

325 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

125 Cel

3-STATE

64MX8

64M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4H510838D-VLB0

Samsung

CACHE DRAM MODULE

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

325 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G54

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4H280838C-TLA0T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

280 mA

16777216 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

DUAL

R-PDSO-G66

3

100 MHz

Not Qualified

134217728 bit

240

.0035 Amp

2,4,8

.8 ns

K4H511638J-LPB3T

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

200 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

166 MHz

Not Qualified

536870912 bit

e3

260

.005 Amp

2,4,8

.7 ns

K4H511638B-ULB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.7 ns

K4H560838E-NCB0T

Samsung

CACHE DRAM MODULE

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

250 mA

33554432 words

2,4,8

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

R-PDSO-G54

3

133 MHz

Not Qualified

268435456 bit

240

.003 Amp

2,4,8

.75 ns

K4H511638D-ULB0T

Samsung

CACHE DRAM MODULE

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

345 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.