Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
55 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
262144 bit |
e0 |
.0001 Amp |
90 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
80 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
15 mA |
65536 words |
COMMON |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
QUAD |
R-PQCC-J32 |
1 |
Not Qualified |
524288 bit |
.000015 Amp |
70 ns |
2.7 |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
35 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
55 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
250 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
262144 bit |
e0 |
.0001 Amp |
250 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
15 mA |
65536 words |
COMMON |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
1 |
Not Qualified |
524288 bit |
e3 |
.000015 Amp |
70 ns |
2.7 |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
Not Qualified |
262144 bit |
e0 |
.0001 Amp |
60 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
55 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
200 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
45 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
35 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
55 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
5 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
34 words |
5 |
8 |
UNCASED CHIP |
34X8 |
34 |
UPPER |
X-XUUC-N5 |
Not Qualified |
272 bit |
5 |
|||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
80 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
80 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
Not Qualified |
262144 bit |
e0 |
.0001 Amp |
120 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
80 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
80 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
80 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
Not Qualified |
262144 bit |
e0 |
.0001 Amp |
250 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
55 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
200 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
35 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
45 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
70 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
55 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
150 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
45 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
15 mA |
65536 words |
COMMON |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDSO-G28 |
1 |
Not Qualified |
524288 bit |
.000015 Amp |
70 ns |
2.7 |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
200 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
3-STATE |
64KX16 |
64K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
131072 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
20 |
1.27 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
10000 Write/Erase Cycles |
50 MHz |
Not Qualified |
SPI |
1048576 bit |
2.7 V |
e3 |
.00005 Amp |
2.7 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
5 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
SERIAL |
SYNCHRONOUS |
34 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
34X8 |
34 |
UNSPECIFIED |
X-XXMA-X5 |
Not Qualified |
272 bit |
5 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
131072 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
20 |
1.27 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
10000 Write/Erase Cycles |
50 MHz |
Not Qualified |
SPI |
1048576 bit |
2.7 V |
e3 |
.00005 Amp |
2.7 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
2 mA |
4096 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
32768 bit |
e4 |
.00001 Amp |
2.7 |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
35 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.56,20 |
OTP ROMs |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
1048576 bit |
e0 |
.0001 Amp |
100 ns |
2.7 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.