Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
EEPROM CARD |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
1073741824 words |
3.3 |
NO |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
.5 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
8589934592 bit |
2.7 V |
4K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
2.7 |
NO |
|||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
10 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
1048576 bit |
3.135 V |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15000 mA |
131072 words |
3.3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
10 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
1048576 bit |
3.135 V |
128 |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3.3 |
YES |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
10 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
1048576 bit |
3.135 V |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
10 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
1048576 bit |
3.135 V |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
3.135 V |
128 |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3 |
YES |
|||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
11.8 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
10 |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
e3 |
11.8 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
11.8 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
2/5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP8,.25 |
8 |
EEPROMs |
100 |
.65 mm |
85 Cel |
3-STATE |
64X16 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
2 MHz |
3 mm |
Not Qualified |
5 ms |
MICROWIRE |
1024 bit |
4.5 V |
CONFIGURABLE AS 128 X 8 |
e4 |
40 |
260 |
.000015 Amp |
4.4 mm |
5 |
||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
17179869184 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
10000 PROGRAM/ERASE CYCLES |
64 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
10 |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e3 |
.0001 Amp |
11.8 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
.0003 Amp |
11.8 mm |
90 ns |
5 |
YES |
||||||||||||||||||||||
Rochester Electronics |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
e3 |
11.8 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Rochester Electronics |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
11.8 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
11.8 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
11.8 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
e3 |
.0002 Amp |
18.4 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.00005 Amp |
11.8 mm |
200 ns |
3 |
YES |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
64 |
e3 |
.00005 Amp |
11.8 mm |
200 ns |
3 |
YES |
||||||||||||||||||||||
Catalyst Semiconductor |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e0 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e0 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
11.8 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
|
Rochester Electronics |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
e3 |
11.8 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4294967296 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
34359738368 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
8K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
512 |
NAND TYPE |
.00005 Amp |
18.4 mm |
45 ns |
3 |
NO |
||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE |
128 |
e0 |
240 |
.0002 Amp |
18.4 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
|
Toshiba |
EEPROM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16777216 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
10 |
.55 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
YES |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 100K ENDURANCE WRITE CYCLES; DATA RETENTION > 10 YEARS |
e0 |
240 |
.0001 Amp |
11.8 mm |
250 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.0002 Amp |
11.8 mm |
200 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
8192 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
3.63 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
65536 bit |
2.97 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.00002 Amp |
11.8 mm |
200 ns |
3 |
YES |
||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16K |
30 mA |
33554432 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.71,20 |
Flash Memories |
.5 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
2K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
268435456 bit |
3 V |
512 |
NAND TYPE |
.0001 Amp |
18.4 mm |
35 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16K |
30 mA |
16777216 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
1K |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
512 |
e0 |
NAND TYPE |
.00005 Amp |
18.4 mm |
45 ns |
3 |
NO |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
7 mA |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
100 |
.65 mm |
125 Cel |
NO |
3-STATE |
8KX8 |
8K |
-40 Cel |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
5 MHz |
3 mm |
5 ms |
SPI |
65536 bit |
2.5 V |
.000009 Amp |
4.4 mm |
5 |
|||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
12.4 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8 mA |
8192 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
105 Cel |
8KX8 |
8K |
-40 Cel |
NO |
DUAL |
R-PDSO-G28 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
3 V |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
11.8 mm |
250 ns |
3 |
YES |
|||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
12.4 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
.00015 Amp |
11.8 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
262144 bit |
3 V |
64 |
e0 |
.00015 Amp |
11.8 mm |
200 ns |
3 |
YES |
|||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
65536 bit |
3 V |
e0 |
18.4 mm |
250 ns |
3 |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
18.4 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
3 V |
e0 |
12.4 mm |
250 ns |
3 |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G32 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
3 V |
12.4 mm |
250 ns |
3 |
|||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
NO |
DUAL |
R-PDSO-G32 |
1 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
524288 bit |
4.5 V |
128 |
.0002 Amp |
18.4 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
12.4 mm |
250 ns |
5 |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
11.8 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
65536 bit |
3 V |
e0 |
12.4 mm |
300 ns |
3 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.